Metal Dielectric Interfaces In Gigascale Electronics

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Metal-Dielectric Interfaces in Gigascale Electronics

Author : Ming He
Publisher : Springer Science & Business Media
ISBN 13 : 1461418127
Total Pages : 155 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Metal-Dielectric Interfaces in Gigascale Electronics by : Ming He

Download or read book Metal-Dielectric Interfaces in Gigascale Electronics written by Ming He and published by Springer Science & Business Media. This book was released on 2012-02-02 with total page 155 pages. Available in PDF, EPUB and Kindle. Book excerpt: Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them. Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design.

Dielectric Breakdown in Gigascale Electronics

Author : Juan Pablo Borja
Publisher : Springer
ISBN 13 : 3319432206
Total Pages : 105 pages
Book Rating : 4.3/5 (194 download)

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Book Synopsis Dielectric Breakdown in Gigascale Electronics by : Juan Pablo Borja

Download or read book Dielectric Breakdown in Gigascale Electronics written by Juan Pablo Borja and published by Springer. This book was released on 2016-09-16 with total page 105 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the experimental and theoretical aspects of the time-dependent breakdown of advanced dielectric films used in gigascale electronics. Coverage includes the most important failure mechanisms for thin low-k films, new and established experimental techniques, recent advances in the area of dielectric failure, and advanced simulations/models to resolve and predict dielectric breakdown, all of which are of considerable importance for engineers and scientists working on developing and integrating present and future chip architectures. The book is specifically designed to aid scientists in assessing the reliability and robustness of electronic systems employing low-k dielectric materials such as nano-porous films. Similarly, the models presented here will help to improve current methodologies for estimating the failure of gigascale electronics at device operating conditions from accelerated lab test conditions. Numerous graphs, tables, and illustrations are included to facilitate understanding of the topics. Readers will be able to understand dielectric breakdown in thin films along with the main failure modes and characterization techniques. In addition, they will gain expertise on conventional as well as new field acceleration test models for predicting long term dielectric degradation.

Direct Copper Interconnection for Advanced Semiconductor Technology

Author : Dongkai Shangguan
Publisher : CRC Press
ISBN 13 : 1040028640
Total Pages : 463 pages
Book Rating : 4.0/5 (4 download)

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Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Energy Saving Coating Materials

Author : Goutam Kumar Dalapati
Publisher : Elsevier
ISBN 13 : 0128221046
Total Pages : 318 pages
Book Rating : 4.1/5 (282 download)

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Book Synopsis Energy Saving Coating Materials by : Goutam Kumar Dalapati

Download or read book Energy Saving Coating Materials written by Goutam Kumar Dalapati and published by Elsevier. This book was released on 2020-05-14 with total page 318 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy Saving Coating Materials: Design, Process, Implementation and Developments provides comprehensive information regarding recent materials advancements and design aspects and integration for infra-red radiation regulators, along with future developments of zero emission buildings. The key opportunities and challenges for the usage of existing heat regulation materials and their implementation for commercial aspects are explored. The fundamental interaction between electromagnetic waves and materials are discussed, along with materials synthesis, design and integration of coatings for smart window applications. This book presents recent developments of innovative technologies comprising energy saving materials and coatings which are key considerations for achieving vital energy saving milestones. Provides knowledge-based information on the optical properties of materials and their utility for solar energy harvesting and energy saving applications Discusses innovative coatings for smart windows applications, including the progressive development of radiative cooling and cool paint Previews future developments for the synthesis, design and integration of heat regulative materials

Physical-chemical Interactions at Metal/low-k Dielectric Interfaces

Author : Ravi S. Achanta
Publisher : ProQuest
ISBN 13 : 9780549815204
Total Pages : 326 pages
Book Rating : 4.8/5 (152 download)

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Book Synopsis Physical-chemical Interactions at Metal/low-k Dielectric Interfaces by : Ravi S. Achanta

Download or read book Physical-chemical Interactions at Metal/low-k Dielectric Interfaces written by Ravi S. Achanta and published by ProQuest. This book was released on 2008 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt:

IEEE Hong Kong Electron Devices Meeting

Author :
Publisher :
ISBN 13 :
Total Pages : 174 pages
Book Rating : 4.:/5 (31 download)

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Book Synopsis IEEE Hong Kong Electron Devices Meeting by :

Download or read book IEEE Hong Kong Electron Devices Meeting written by and published by . This book was released on 2001 with total page 174 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Dielectric Phenomena in Solids

Author : Kwan Chi Kao
Publisher : Elsevier
ISBN 13 : 0080470165
Total Pages : 579 pages
Book Rating : 4.0/5 (84 download)

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Book Synopsis Dielectric Phenomena in Solids by : Kwan Chi Kao

Download or read book Dielectric Phenomena in Solids written by Kwan Chi Kao and published by Elsevier. This book was released on 2004-05-11 with total page 579 pages. Available in PDF, EPUB and Kindle. Book excerpt: In general, a dielectric is considered as a non-conducting or insulating material (such as a ceramic or polymer used to manufacture a microelectronic device). This book describes the laws governing all dielectric phenomena. · A unified approach is used in describing each of the dielectric phenomena, with the aim of answering "what?", "how?" and "why" for the occurrence of each phenomenon; · Coverage unavailable in other books on ferroelectrics, piezoelectrics, pyroelectrics, electro-optic processes, and electrets; · Theoretical analyses are general and broadly applicable; · Mathematics is simplified and emphasis is placed on the physical insight of the mechanisms responsible for the phenomena; · Truly comprehensive coverage not available in the current literature.

The Fabrication and Characterization of MOSFETs with Titanium Dioxide and Hafnium Dioxide as Gate Dielectrics

Author : Tiezhong Ma
Publisher :
ISBN 13 :
Total Pages : 354 pages
Book Rating : 4.:/5 (319 download)

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Book Synopsis The Fabrication and Characterization of MOSFETs with Titanium Dioxide and Hafnium Dioxide as Gate Dielectrics by : Tiezhong Ma

Download or read book The Fabrication and Characterization of MOSFETs with Titanium Dioxide and Hafnium Dioxide as Gate Dielectrics written by Tiezhong Ma and published by . This book was released on 2001 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Advances in Solid State Circuit Technologies

Author : Paul Chu
Publisher : BoD – Books on Demand
ISBN 13 : 9533070862
Total Pages : 458 pages
Book Rating : 4.5/5 (33 download)

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Book Synopsis Advances in Solid State Circuit Technologies by : Paul Chu

Download or read book Advances in Solid State Circuit Technologies written by Paul Chu and published by BoD – Books on Demand. This book was released on 2010-04-01 with total page 458 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book brings together contributions from experts in the fields to describe the current status of important topics in solid-state circuit technologies. It consists of 20 chapters which are grouped under the following categories: general information, circuits and devices, materials, and characterization techniques. These chapters have been written by renowned experts in the respective fields making this book valuable to the integrated circuits and materials science communities. It is intended for a diverse readership including electrical engineers and material scientists in the industry and academic institutions. Readers will be able to familiarize themselves with the latest technologies in the various fields.

Proceedings

Author :
Publisher :
ISBN 13 :
Total Pages : 182 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Proceedings by :

Download or read book Proceedings written by and published by . This book was released on 2001 with total page 182 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Rapid Thermal and Other Short-time Processing Technologies II

Author : Dim-Lee Kwong
Publisher : The Electrochemical Society
ISBN 13 : 9781566773157
Total Pages : 458 pages
Book Rating : 4.7/5 (731 download)

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Book Synopsis Rapid Thermal and Other Short-time Processing Technologies II by : Dim-Lee Kwong

Download or read book Rapid Thermal and Other Short-time Processing Technologies II written by Dim-Lee Kwong and published by The Electrochemical Society. This book was released on 2001 with total page 458 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."

Electrical & Electronics Abstracts

Author :
Publisher :
ISBN 13 :
Total Pages : 1948 pages
Book Rating : 4.3/5 (243 download)

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Book Synopsis Electrical & Electronics Abstracts by :

Download or read book Electrical & Electronics Abstracts written by and published by . This book was released on 1997 with total page 1948 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Internal Photoemission Spectroscopy

Author : Valeri V. Afanas'ev
Publisher : Elsevier
ISBN 13 : 0080999301
Total Pages : 404 pages
Book Rating : 4.0/5 (89 download)

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Book Synopsis Internal Photoemission Spectroscopy by : Valeri V. Afanas'ev

Download or read book Internal Photoemission Spectroscopy written by Valeri V. Afanas'ev and published by Elsevier. This book was released on 2014-02-22 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second edition of Internal Photoemission Spectroscopy thoroughly updates this vital, practical guide to internal photoemission (IPE) phenomena and measurements. The book's discussion of fundamental physical and technical aspects of IPE spectroscopic applications is supplemented by an extended overview of recent experimental results in swiftly advancing research fields. These include the development of insulating materials for advanced SiMOS technology, metal gate materials, development of heterostructures based on high-mobility semiconductors, and more. Recent results concerning the band structure of important interfaces in novel materials are covered as well. Internal photoemission involves the physics of charge carrier photoemission from one solid to another, and different spectroscopic applications of this phenomenon to solid state heterojunctions. This technique complements conventional external photoemission spectroscopy by analyzing interfaces separated from the sample surface by a layer of a different solid or liquid. Internal photoemission provides the most straightforward, reliable information regarding the energy spectrum of electron states at interfaces. At the same time, the method enables the analysis of heterostructures relevant to modern micro- and nano-electronic devices as well as new materials involved in their design and fabrication. First complete model description of the internal photoemission phenomena Overview of the most reliable energy barrier determination procedures and trap characterization methods Overview of the most recent results on band structure of high-permittivity insulating materials and their interfaces with semiconductors and metals

Emerging Nanoelectronics

Author : Adrian M. Ionescu
Publisher :
ISBN 13 :
Total Pages : 632 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Emerging Nanoelectronics by : Adrian M. Ionescu

Download or read book Emerging Nanoelectronics written by Adrian M. Ionescu and published by . This book was released on 2005 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Applied Plastics Engineering Handbook

Author : Myer Kutz
Publisher : William Andrew
ISBN 13 : 1437735142
Total Pages : 661 pages
Book Rating : 4.4/5 (377 download)

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Book Synopsis Applied Plastics Engineering Handbook by : Myer Kutz

Download or read book Applied Plastics Engineering Handbook written by Myer Kutz and published by William Andrew. This book was released on 2011-07-26 with total page 661 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical reference for all plastics engineers who are seeking to answer a question, solve a problem, reduce a cost, improve a design or fabrication process, or even venture into a new market. Applied Plastics Engineering Handbook covers both polymer basics - helpful to bring readers quickly up to speed if they are not familiar with a particular area of plastics processing - and recent developments - enabling practitioners to discover which options best fit their requirements. Each chapter is an authoritative source of practical advice for engineers, providing authoritative guidance from experts that will lead to cost savings and process improvements. Throughout the book, the focus is on the engineering aspects of producing and using plastics. The properties of plastics are explained along with techniques for testing, measuring, enhancing and analyzing them. Practical introductions to both core topics and new developments make this work equally valuable for newly qualified plastics engineers seeking the practical rules-of-thumb they don't teach you in school, and experienced practitioners evaluating new technologies or getting up to speed on a new field The depth and detail of the coverage of new developments enables engineers and managers to gain knowledge of, and evaluate, new technologies and materials in key growth areas such as biomaterials and nanotechnology This highly practical handbook is set apart from other references in the field, being written by engineers for an audience of engineers and providing a wealth of real-world examples, best practice guidance and rules-of-thumb

Proceedings of Technical Papers

Author :
Publisher :
ISBN 13 :
Total Pages : 156 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Proceedings of Technical Papers by :

Download or read book Proceedings of Technical Papers written by and published by . This book was released on 2005 with total page 156 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electronic Properties of Materials

Author : Rolf E. Hummel
Publisher : Springer Science & Business Media
ISBN 13 : 3662024241
Total Pages : 323 pages
Book Rating : 4.6/5 (62 download)

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Book Synopsis Electronic Properties of Materials by : Rolf E. Hummel

Download or read book Electronic Properties of Materials written by Rolf E. Hummel and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 323 pages. Available in PDF, EPUB and Kindle. Book excerpt: The present book on electrical, optical, magnetic and thermal properties of materials is in many aspects different from other introductory texts in solid state physics. First of all, this book is written for engineers, particularly materials and electrical engineers who want to gain a fundamental under standing of semiconductor devices, magnetic materials, lasers, alloys, etc. Second, it stresses concepts rather than mathematical formalism, which should make the presentation relatively easy to understand. Thus, this book provides a thorough preparation for advanced texts, monographs, or special ized journal articles. Third, this book is not an encyclopedia. The selection oftopics is restricted to material which is considered to be essential and which can be covered in a 15-week semester course. For those professors who want to teach a two-semester course, supplemental topics can be found which deepen the understanding. (These sections are marked by an asterisk [*]. ) Fourth, the present text leaves the teaching of crystallography, X-ray diffrac tion, diffusion, lattice defects, etc. , to those courses which specialize in these subjects. As a rule, engineering students learn this material at the beginning of their upper division curriculum. The reader is, however, reminded of some of these topics whenever the need arises. Fifth, this book is distinctly divided into five self-contained parts which may be read independently.