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Material Factors Influencing Metallic Whisker Growth
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Book Synopsis Factors Governing Tin Whisker Growth by : Erika R Crandall
Download or read book Factors Governing Tin Whisker Growth written by Erika R Crandall and published by Springer Science & Business Media. This book was released on 2013-08-15 with total page 145 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (including satellite and defense sectors). Due to legislation in the EU, Japan, and the U.S., mandating a gradual shift from lead (Pb)-based to lead-free solders and board finishes, there has been a reemergence of Sn whiskers. Continuing reports of Sn whisker induced failures coupled with the lack of an industry-accepted understanding of whisker growth and/or test methods to identify whisker prone products has made pure/high Sn substitutes a risky proposition in high reliability systems. This thesis is designed to clarify and control the fundamental mechanisms that govern whisker formation. The research focuses on reproducible "laboratory" created whiskers under a variety of rigorously controlled environmental factors such as film thickness, film stress, substrate material, gas environment, and humidity exposure, which are known to play a significant role in whisker production. The ultimate question of how to impede and/or prevent whisker growth is also addressed and shows that whisker prevention is possible via hard metal capping films, which are impenetrable by whiskers.
Book Synopsis Whisker Technology by : Albert P. Levitt
Download or read book Whisker Technology written by Albert P. Levitt and published by John Wiley & Sons. This book was released on 1970 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1992 with total page 1572 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book RCA Engineer written by and published by . This book was released on 1960 with total page 68 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis ISTFA 1997: International Symposium for Testing and Failure Analysis by : Grace M. Davidson
Download or read book ISTFA 1997: International Symposium for Testing and Failure Analysis written by Grace M. Davidson and published by ASM International. This book was released on 1997-01-01 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Army Research and Development written by and published by . This book was released on 1965 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Materials Science and Chemical Engineering by : Jin Yun
Download or read book Materials Science and Chemical Engineering written by Jin Yun and published by Trans Tech Publications Ltd. This book was released on 2013-05-27 with total page 948 pages. Available in PDF, EPUB and Kindle. Book excerpt: Selected, peer reviewed papers from the 2013 International Conference on Materials Science and Chemical Engineering (MSCE 2013), February 20-21, 2013, Singapore, Singapore
Book Synopsis U.S. Government Research and Development Reports by :
Download or read book U.S. Government Research and Development Reports written by and published by . This book was released on 1965 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by : Karl J. Puttlitz
Download or read book Handbook of Lead-Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Book Synopsis Reliability Abstracts and Technical Reviews by :
Download or read book Reliability Abstracts and Technical Reviews written by and published by . This book was released on 1966 with total page 556 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Composite Reinforcements by : Stuart M. Lee
Download or read book Handbook of Composite Reinforcements written by Stuart M. Lee and published by John Wiley & Sons. This book was released on 1996-12-17 with total page 736 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive single volume handbook covers every aspect of reinforcement science, from hands-on subjects, such as manual 'lay-up' processing, to theoretical discussions concerning rheology and modeling. Taken from the recently published six volume International Encyclopedia of Composites, this reference volume offers scholarly and practical knowledge of distinguished industry-experts, academics, and government researchers in one accessible and informative handbook. Fibers, processes, and composite reinforcement types, as well as relevant miscellaneous subjects such as property relationships, manufacturing, hybrid reinforcements, and modeling are given detailed treatment. Engineers, materials scientists, and technologists will find the Composite Reinforcement Handbook an invaluable tool.
Book Synopsis Inorganic Fibres & Composite Materials by : P. Bracke
Download or read book Inorganic Fibres & Composite Materials written by P. Bracke and published by Elsevier. This book was released on 2013-10-22 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: A compendium of the current state-of-the-art in the technology of inorganic fibre manufacture and its use in the development of new high grade composite materials. Provides comprehensive information that is well in advance of industrial realization with invaluable insight relating to development and expected future trends. Specific entries are provided for the most important types of fibres known to date, each type discussed under manufacture, post-treatments, properties and uses. Also includes high quality photomicrographs, diagrams of the process techniques and molecular structures, bibliographical data, and helpful summaries in tabular form. Lists over 870 patent references.
Book Synopsis Navy Research Task Summary, 1961 by : United States. Office of Naval Research
Download or read book Navy Research Task Summary, 1961 written by United States. Office of Naval Research and published by . This book was released on 1962 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Navy Research Task Summary by : United States. Office of Naval Research
Download or read book Navy Research Task Summary written by United States. Office of Naval Research and published by . This book was released on with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Applied Mechanics Reviews written by and published by . This book was released on 1969 with total page 1090 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Tin and Solder Plating in the Semiconductor Industry by : A.C. Tan
Download or read book Tin and Solder Plating in the Semiconductor Industry written by A.C. Tan and published by Springer Science & Business Media. This book was released on 1992-11-30 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Book Synopsis Connections in Electronic Assemblies by : Anthony J. Bilotta
Download or read book Connections in Electronic Assemblies written by Anthony J. Bilotta and published by CRC Press. This book was released on 1985-12-03 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
