Low Dielectric Constant Materials for IC Applications

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Publisher : Springer Science & Business Media
ISBN 13 : 3642559085
Total Pages : 310 pages
Book Rating : 4.6/5 (425 download)

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Book Synopsis Low Dielectric Constant Materials for IC Applications by : Paul S. Ho

Download or read book Low Dielectric Constant Materials for IC Applications written by Paul S. Ho and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for

Dielectric Materials and Applications

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Author :
Publisher : Nova Science Publishers
ISBN 13 : 9781536153170
Total Pages : 416 pages
Book Rating : 4.1/5 (531 download)

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Book Synopsis Dielectric Materials and Applications by : P. K. Choudhury

Download or read book Dielectric Materials and Applications written by P. K. Choudhury and published by Nova Science Publishers. This book was released on 2019 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: "The book Dielectric Materials and Applications focuses on the recent research advancements in the area of dielectrics that can be utilized in a variety of technology-oriented applications. The topics covered in this book include the investigations of materials having low dielectric constants for Cu interconnects, a two-layer metallic waveguide as a tool to determine the complex permittivity of liquids and/or clinical diagnostics, microwave dielectric materials for the miniaturization of portable electronic devices, microwave assisted heating of dielectric and composite materials, and the dielectric properties of certain 3D nanocomposites. The other areas of discussion encapsulate the modeling of supershaped dielectric lens antennas, the roles of dielectric mediums in metamaterials to realize photonic devices ranging from absorbers, sensors and communication systems. Some of the chapters are purely experimental, whereas some others are based on modeling and simulation. Reading this volume truly remains key to understanding novel applications of dielectric materials in different areas of technological interest"--

Low and High Dielectric Constant Materials

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566772709
Total Pages : 262 pages
Book Rating : 4.7/5 (727 download)

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Book Synopsis Low and High Dielectric Constant Materials by : Mark J. Lododa

Download or read book Low and High Dielectric Constant Materials written by Mark J. Lododa and published by The Electrochemical Society. This book was released on 2000 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt: Contains papers from a May 2000 symposium, representing the state of the art in areas of dielectric materials science and process integration. Papers are arranged in sections on low and high dielectric constant materials, covering topics such as ammonia plasma passivation effects on properties of post-CMP low-k HSQ, characterization of ashing effects on low-k dielectric films, and electron beam curing of thin film polymer dielectrics. Other subjects include characterization of high-k dielectrics using the non-contact surface charge profiler method, and processing effects and electrical evaluation of ZrO2 formed by RTP oxidation of Zr. Loboda is affiliated with Dow Corning Corporation. c. Book News Inc.

Low-dielectric Constant Materials

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Publisher :
ISBN 13 :
Total Pages : 330 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Low-dielectric Constant Materials by :

Download or read book Low-dielectric Constant Materials written by and published by . This book was released on 1999 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Handbook of Low and High Dielectric Constant Materials and Their Applications, Two-Volume Set

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Author :
Publisher : Elsevier
ISBN 13 : 0080533531
Total Pages : 1108 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Handbook of Low and High Dielectric Constant Materials and Their Applications, Two-Volume Set by : Hari Singh Nalwa

Download or read book Handbook of Low and High Dielectric Constant Materials and Their Applications, Two-Volume Set written by Hari Singh Nalwa and published by Elsevier. This book was released on 1999-09-07 with total page 1108 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, etc., are of equal importance. Many chemical and physical strategies have been employed to get desired dielectric materials with high performance. This is a rapidly growing field of science--both in novel materials and their applications to future packing technologies. The experimental data on inorganic and organic materials having low or high dielectric constant remail scattered in the literature. It is timely, therfore, to consolidate the current knowledge on low and high dielectric constant materials into a sigle reference source. Handbook of Low and High Dielectric Constant Materials and Their Applications is aimed at bringing together under a sigle cover (in two volumes) all low and high dielectric constant materials currently studied in academic and industrial research covering all spects of inorgani an organic materials from their synthetic chemistry, processing techniques, physics, structure-property relationship to applications in IC devices. This book will summarize the current status of the field covering important scientific developments made over the past decade with contributions from internationally recognized experts from all over the world. Fully cross-referenced, this book has clear, precise, and wide appeal as an essential reference source for all those interested in low and high dielectric constant material.

Low-Dielectric Constant Materials II: Volume 443

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Author :
Publisher :
ISBN 13 :
Total Pages : 224 pages
Book Rating : 4.:/5 (318 download)

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Book Synopsis Low-Dielectric Constant Materials II: Volume 443 by : André Lagendijk

Download or read book Low-Dielectric Constant Materials II: Volume 443 written by André Lagendijk and published by . This book was released on 1997-08-19 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.

High Dielectric Constant Materials

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Publisher : Springer Science & Business Media
ISBN 13 : 9783540210818
Total Pages : 740 pages
Book Rating : 4.2/5 (18 download)

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Book Synopsis High Dielectric Constant Materials by : Howard Huff

Download or read book High Dielectric Constant Materials written by Howard Huff and published by Springer Science & Business Media. This book was released on 2005 with total page 740 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore's Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.

Dielectric Films for Advanced Microelectronics

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Author :
Publisher : John Wiley & Sons
ISBN 13 : 0470065419
Total Pages : 508 pages
Book Rating : 4.4/5 (7 download)

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Book Synopsis Dielectric Films for Advanced Microelectronics by : Mikhail Baklanov

Download or read book Dielectric Films for Advanced Microelectronics written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2007-04-04 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.

Low-Dielectric Constant Materials V: Volume 565

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Author :
Publisher : Cambridge University Press
ISBN 13 : 9781558994720
Total Pages : 0 pages
Book Rating : 4.9/5 (947 download)

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Book Synopsis Low-Dielectric Constant Materials V: Volume 565 by : John Hummel

Download or read book Low-Dielectric Constant Materials V: Volume 565 written by John Hummel and published by Cambridge University Press. This book was released on 2000-01-12 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interest in developing low-dielectric constant materials is driven by requirements from the microelectronics sector to improve performance in interconnections by reducing parasitic capacitance and cross talk. The continuing increase in density of semiconductor devices is becoming limited by the dielectric properties of the insulator which threatens to slow the rate of productivity. The requirement for dielectric constant is rapidly approaching an e value of 2.0, with continued improvement sought even below this level to maintain this progression, commonly known as Moore's Law. Synthetic methods of obtaining materials in this range are addressed in this book. The materials solution to the interconnect problem - changing the insulator to lower the dielectric constant from 4.0, the e of silicon dioxide - introduces a host of reliability concerns, as well as changes to the process of manufacturing semiconductor devices. Topics include: porous films - organic and inorganic; porous films - organic/low-k integration; low-k integration; low-k/advanced interconnect; low-dielectric constant materials and applications in microelectronics and low-k film property/integration.

LOW & HIGH DIELECTRIC CONSTANT MTRLS V1

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Author :
Publisher : Academic Press
ISBN 13 : 9780125139076
Total Pages : 0 pages
Book Rating : 4.1/5 (39 download)

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Book Synopsis LOW & HIGH DIELECTRIC CONSTANT MTRLS V1 by : Hari Singh Nalwa

Download or read book LOW & HIGH DIELECTRIC CONSTANT MTRLS V1 written by Hari Singh Nalwa and published by Academic Press. This book was released on 1999-08-03 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, et cetera, are of equal importance. Many chemical and physical strategies have been employed to get desired dielectric materials with high performance. This is a rapidly growing field of science--both in novel materials and their applications to future packing technologies. The experimental data on inorganic and organic materials having low or high dielectric constant remail scattered in the literature. It is timely, therfore, to consolidate the current knowledge on low and high dielectric constant materials into a sigle reference source. Handbook of Low and High Dielectric Constant Materials and Their Applications is aimed at bringing together under a sigle cover (in two volumes) all low and high dielectric constant materials currently studied in academic and industrial research covering all spects of inorgani an organic materials from their synthetic chemistry, processing techniques, physics, structure-property relationship to applications in IC devices. This book will summarize the current status of the field covering important scientific developments made over the past decade with contributions from internationally recognized experts from all over the world. Fully cross-referenced, this book has clear, precise, and wide appeal as an essential reference source for all those interested in low and high dielectric constant material.

Dielectric Materials for Wireless Communication

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Author :
Publisher : Elsevier
ISBN 13 : 0080560504
Total Pages : 689 pages
Book Rating : 4.0/5 (85 download)

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Book Synopsis Dielectric Materials for Wireless Communication by : Mailadil T. Sebastian

Download or read book Dielectric Materials for Wireless Communication written by Mailadil T. Sebastian and published by Elsevier. This book was released on 2010-07-07 with total page 689 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microwave dielectric materials play a key role in our global society with a wide range of applications, from terrestrial and satellite communication including software radio, GPS, and DBS TV to environmental monitoring via satellite. A small ceramic component made from a dielectric material is fundamental to the operation of filters and oscillators in several microwave systems. In microwave communications, dielectric resonator filters are used to discriminate between wanted and unwanted signal frequencies in the transmitted and received signal. When the wanted frequency is extracted and detected, it is necessary to maintain a strong signal. For clarity it is also critical that the wanted signal frequencies are not affected by seasonal temperature changes. In order to meet the specifications of current and future systems, improved or new microwave components based on dedicated dielectric materials and new designs are required. The recent progress in microwave telecommunication, satellite broadcasting and intelligent transport systems (ITS) has resulted in an increased demand for Dielectric Resonators (DRs). With the recent revolution in mobile phone and satellite communication systems using microwaves as the propagation media, the research and development in the field of device miniaturization has been a major challenge in contemporary Materials Science. In a mobile phone communication, the message is sent from a phone to the nearest base station, and then on via a series of base stations to the other phone. At the heart of each base station is the combiner/filter unit which has the job of receiving the messages, keeping them separate, amplifying the signals and sending then onto the next base station. For such a microwave circuit to work, part of it needs to resonate at the specific working frequency. The frequency determining component (resonator) used in such a high frequency device must satisfy certain criteria. The three important characteristics required for a dielectric resonator are (a) a high dielectric constant which facilitates miniaturization (b) a high quality factor (Qxf) which improves the signal-to-noise ratio, (c) a low temperature coefficient of the resonant frequency which determines the stability of the transmitted frequency. During the past 25 years scientists the world over have developed a large number of new materials (about 3000) or improved the properties of known materials. About 5000 papers have been published and more than 1000 patents filed in the area of dielectric resonators and related technologies. This book brings the data and science of these several useful materials together, which will be of immense benefit to researchers and engineers the world over. The topics covered in the book includes factors affecting the dielectric properties, measurement of dielectric properties, important low loss dielectric material systems such as perovskites, tungsten bronze type materials, materials in BaO-TiO2 system, (Zr,Sn)TiO4, alumina, rutile, AnBn-1O3n type materials, LTCC, ceramic-polymer composites etc. The book also has a data table listing all reported low loss dielectric materials with properties and references arranged in the order of increasing dielectric constant. Collects together in one source data on all new materials used in wireless communication Includes tabulated properties of all reported low loss dielectric materials In-depth treatment of dielectric resonator materials

Handbook of Low and High Dielectric Constant Materials and Their Applications: Materials and processing

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Author :
Publisher :
ISBN 13 :
Total Pages : 600 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Handbook of Low and High Dielectric Constant Materials and Their Applications: Materials and processing by : Hari Singh Nalwa

Download or read book Handbook of Low and High Dielectric Constant Materials and Their Applications: Materials and processing written by Hari Singh Nalwa and published by . This book was released on 1999 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Interlayer Dielectrics for Semiconductor Technologies

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Publisher : Elsevier
ISBN 13 : 9780080521954
Total Pages : 464 pages
Book Rating : 4.5/5 (219 download)

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Book Synopsis Interlayer Dielectrics for Semiconductor Technologies by : Shyam P Muraka

Download or read book Interlayer Dielectrics for Semiconductor Technologies written by Shyam P Muraka and published by Elsevier. This book was released on 2003-10-13 with total page 464 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package. * Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume * written by renowned experts in the field * Provides an up-to-date starting point in this young research field.

Low and High Dielectric Constant Materials

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Author :
Publisher : The Electrochemical Society
ISBN 13 : 9781566772297
Total Pages : 242 pages
Book Rating : 4.7/5 (722 download)

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Book Synopsis Low and High Dielectric Constant Materials by : Rajendra Singh

Download or read book Low and High Dielectric Constant Materials written by Rajendra Singh and published by The Electrochemical Society. This book was released on 2000 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Low-Dielectric Constant Materials V:

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Author :
Publisher : Cambridge University Press
ISBN 13 : 9781107414013
Total Pages : 324 pages
Book Rating : 4.4/5 (14 download)

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Book Synopsis Low-Dielectric Constant Materials V: by : John Hummel

Download or read book Low-Dielectric Constant Materials V: written by John Hummel and published by Cambridge University Press. This book was released on 2014-06-05 with total page 324 pages. Available in PDF, EPUB and Kindle. Book excerpt: Interest in developing low-dielectric constant materials is driven by requirements from the microelectronics sector to improve performance in interconnections by reducing parasitic capacitance and cross talk. The continuing increase in density of semiconductor devices is becoming limited by the dielectric properties of the insulator which threatens to slow the rate of productivity. The requirement for dielectric constant is rapidly approaching an e value of 2.0, with continued improvement sought even below this level to maintain this progression, commonly known as Moore's Law. Synthetic methods of obtaining materials in this range are addressed in this book. The materials solution to the interconnect problem - changing the insulator to lower the dielectric constant from 4.0, the e of silicon dioxide - introduces a host of reliability concerns, as well as changes to the process of manufacturing semiconductor devices. Topics include: porous films - organic and inorganic; porous films - organic/low-k integration; low-k integration; low-k/advanced interconnect; low-dielectric constant materials and applications in microelectronics and low-k film property/integration.

Metallization of Polymers 2

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Publisher : Springer Science & Business Media
ISBN 13 : 1461505631
Total Pages : 208 pages
Book Rating : 4.4/5 (615 download)

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Book Synopsis Metallization of Polymers 2 by : Edward Sacher

Download or read book Metallization of Polymers 2 written by Edward Sacher and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 208 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the demands put on the polymer/metal interface, particularly by the microelectronics industry, become more and more severe, the necessity for understanding this interface, its properties and its limitations, becomes more and more essential. This requires a broad knowledge of, and a familiarity with, the latest findings in this rapidly advancing field. At the very least, such familiarity requires an exchange of infonnation, particularly among those intimately involved in this field. Communications among many of us in this area have made one fact quite obvious: the facilities provided by existing organizations, scientific and otherwise, do not offer the forum necessary to accomplish this exchange of infonnation. It was for this reason that Jean-Jacques Pireaux, Steven Kowalczyk and I organized the first Metallization of Polymers, a symposium sponsored by the American Chemical Society, which took place in Montreal, September 25-28, 1989; the Proceedings from that symposium were published as ACS Symposium Series 440, (1990). It is this same per ceived lack of a proper forum, and the encouragement of my colleagues, that prompted me to organize this meeting, so as to bring to the attention of the participants new instruments, materials, methods, advances, and, particularly, thoughts in the field of polymer metalliza tion. The meeting was designed as a workshop, with time being made available throughout for discussion and for the consideration of new findings.

Electronics Packaging Forum

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Publisher : Springer Science & Business Media
ISBN 13 : 9400904398
Total Pages : 459 pages
Book Rating : 4.4/5 (9 download)

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Book Synopsis Electronics Packaging Forum by : James E. Morris

Download or read book Electronics Packaging Forum written by James E. Morris and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 459 pages. Available in PDF, EPUB and Kindle. Book excerpt: Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.