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Author : Yu-Ting Cheng
Publisher :
ISBN 13 :
Total Pages : 256 pages
Book Rating : 4.3/5 (91 download)
Download or read book Localized Heating and Bonding Technique for MEMS Packaging written by Yu-Ting Cheng and published by . This book was released on 2000 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yung-cheng Lee
Publisher : World Scientific
ISBN 13 : 9813229373
Total Pages : 363 pages
Book Rating : 4.8/5 (132 download)
Download or read book Mems Packaging written by Yung-cheng Lee and published by World Scientific. This book was released on 2018-01-03 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Author : Zhaoying Zhou
Publisher : Springer Science & Business Media
ISBN 13 : 3642182933
Total Pages : 1011 pages
Book Rating : 4.6/5 (421 download)
Download or read book Microsystems and Nanotechnology written by Zhaoying Zhou and published by Springer Science & Business Media. This book was released on 2012-08-30 with total page 1011 pages. Available in PDF, EPUB and Kindle. Book excerpt: “Microsystems and Nanotechnology” presents the latest science and engineering research and achievements in the fields of microsystems and nanotechnology, bringing together contributions by authoritative experts from the United States, Germany, Great Britain, Japan and China to discuss the latest advances in microelectromechanical systems (MEMS) technology and micro/nanotechnology. The book is divided into five parts – the fundamentals of microsystems and nanotechnology, microsystems technology, nanotechnology, application issues, and the developments and prospects – and is a valuable reference for students, teachers and engineers working with the involved technologies. Professor Zhaoying Zhou is a professor at the Department of Precision Instruments & Mechanology , Tsinghua University , and the Chairman of the MEMS & NEMS Society of China. Dr. Zhonglin Wang is the Director of the Center for Nanostructure Characterization, Georgia Tech, USA. Dr. Liwei Lin is a Professor at the Department of Mechanical Engineering, University of California at Berkeley, USA.
Author : Patty Pei-Ling Chang-Chien
Publisher :
ISBN 13 :
Total Pages : 422 pages
Book Rating : 4.3/5 (91 download)
Download or read book Wafer-level Packaging and Frequency Trimming by Localized Mass Deposition written by Patty Pei-Ling Chang-Chien and published by . This book was released on 2002 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : C.P. Wong
Publisher : Springer Science & Business Media
ISBN 13 : 1441900403
Total Pages : 761 pages
Book Rating : 4.4/5 (419 download)
Download or read book Nano-Bio- Electronic, Photonic and MEMS Packaging written by C.P. Wong and published by Springer Science & Business Media. This book was released on 2009-12-23 with total page 761 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author : Masayoshi Esashi
Publisher : John Wiley & Sons
ISBN 13 : 3527823255
Total Pages : 528 pages
Book Rating : 4.5/5 (278 download)
Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author : Vijay K. Varadan
Publisher : John Wiley & Sons
ISBN 13 : 0470093625
Total Pages : 418 pages
Book Rating : 4.4/5 (7 download)
Download or read book Smart Material Systems and MEMS written by Vijay K. Varadan and published by John Wiley & Sons. This book was released on 2006-11-02 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt: Presenting unified coverage of the design and modeling of smart micro- and macrosystems, this book addresses fabrication issues and outlines the challenges faced by engineers working with smart sensors in a variety of applications. Part I deals with the fundamental concepts of a typical smart system and its constituent components. Preliminary fabrication and characterization concepts are introduced before design principles are discussed in detail. Part III presents a comprehensive account of the modeling of smart systems, smart sensors and actuators. Part IV builds upon the fundamental concepts to analyze fabrication techniques for silicon-based MEMS in more detail. Practicing engineers will benefit from the detailed assessment of applications in communications technology, aerospace, biomedical and mechanical engineering. The book provides an essential reference or textbook for graduates following a course in smart sensors, actuators and systems.
Author : Bharat Bhushan
Publisher : Springer Science & Business Media
ISBN 13 : 3540012184
Total Pages : 1232 pages
Book Rating : 4.5/5 (4 download)
Download or read book Springer Handbook of Nanotechnology written by Bharat Bhushan and published by Springer Science & Business Media. This book was released on 2004-01-19 with total page 1232 pages. Available in PDF, EPUB and Kindle. Book excerpt: This major work has established itself as the definitive reference in the nanoscience and nanotechnology area in one volume. In presents nanostructures, micro/nanofabrication, and micro/nanodevices. Special emphasis is on scanning probe microscopy, nanotribology and nanomechanics, molecularly thick films, industrial applications and microdevice reliability, and on social aspects. Reflecting further developments, the new edition has grown from six to eight parts. The latest information is added to fields such as bionanotechnology, nanorobotics, and NEMS/MEMS reliability. This classic reference book is orchestrated by a highly experienced editor and written by a team of distinguished experts for those learning about the field of nanotechnology.
Author : Svetan Ratchev
Publisher : Springer Science & Business Media
ISBN 13 : 0387312765
Total Pages : 331 pages
Book Rating : 4.3/5 (873 download)
Download or read book Precision Assembly Technologies for Mini and Micro Products written by Svetan Ratchev and published by Springer Science & Business Media. This book was released on 2006-01-19 with total page 331 pages. Available in PDF, EPUB and Kindle. Book excerpt: These contributions to the 3rd IPAS'2006 seminar are grouped in 6 sections. Part 1 reviews new techniques for handling and feeding micro parts. Micro-robotics and robot applications for micro assembly are discussed in Part 2. An overview of different design and planning applications for microassembly is provided in Part 3. Part 4 covers reconfigurable and modular micro assembly systems and control applications. The economic aspects of microassembly including new business models are discussed in Part 5 while Part 6 presents specific technical solutions and microassembly applications.
Author : Henry Baltes
Publisher : John Wiley & Sons
ISBN 13 : 3527675043
Total Pages : 441 pages
Book Rating : 4.5/5 (276 download)
Download or read book Enabling Technology for MEMS and Nanodevices written by Henry Baltes and published by John Wiley & Sons. This book was released on 2013-03-27 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mikro- und Nanotechnik haben Wissenschaft und Forschung revolutioniert. In Zukunft werden sie auch den Alltag verändern. Nun liegt der erste Band einer neuen Buchreihe vor: Advanced Micro and Nano Systems 1. Henry Baltes und seine Co-Autoren knüpfen mit AMN an die Sensors Update-Reihe an. Das Autorenteam wurde um weitere Experten erweitert. AMN wird zwei Mal pro Jahr mit einem neuen Band die aktuellen Entwicklungen in der Mikro- und Nano-Welt begleiten. Die Erforschung und der Einsatz von Mikro- und Nanosystemen sind eines der brandaktuellen Themen im Wissenschaftsbereich. Die Forschungsergebnisse werden mehr und mehr auch konkret umgesetzt. Damit werden Mikro- und Nanotechnologie zu Wirtschaftsfaktoren. Aktuelle Entwicklungen, neue Technologien, Nano-Bauelemente und Systeme im Mikromaßstab - Advanced Micro and Nano Systems, die neue Buchreihe, wird Spiegel der spannenden und faszinierenden Mikro- und Nano-Welt sein. Zweimal pro Jahr wird es einen neuen AMN-Band geben. Die Autoren sind ausgewiesene Spezialisten. Zu den Herausgebern zählt Henry Baltes, Professor an der ETH Zürich. Er zeichnete bereits für die Bände der Sensors Update-Reihe verantwortlich. Die Artikel ermöglichen Neueinsteigern einen ersten Zugriff auf die Materie. Fachleute erhalten einen umfassenden Überblick. Anspruch der Herausgeber ist es, nicht nur die theoretischen Grundlagen von Mikro- und Nanosystemen zu reflektieren, sondern immer auch praktische Möglichkeiten und die Grenzen der Anwendung im Blick zu haben. Die AMN-Bände sind Handbücher und Nachschlagewerke in einem. Die Reihe richtet sich an Vertreter unterschiedlicher Fachrichtungen: Biologie, Chemie, Mathematik, Sensorindustrie und Materialwissenschaften.
Author : Mu Chʻiao
Publisher :
ISBN 13 :
Total Pages : 192 pages
Book Rating : 4.:/5 (34 download)
Download or read book MEMS Packaging by Rapid Thermal Processing written by Mu Chʻiao and published by . This book was released on 2002 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yufeng Jin
Publisher : CRC Press
ISBN 13 : 1439865973
Total Pages : 232 pages
Book Rating : 4.4/5 (398 download)
Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Author : Tai-Ran Hsu
Publisher : IET
ISBN 13 : 9780863413353
Total Pages : 310 pages
Book Rating : 4.4/5 (133 download)
Download or read book MEMS Packaging written by Tai-Ran Hsu and published by IET. This book was released on 2004 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the entire spectrum of assembly, packaging and testing of MEMs (microelectro-mechanical systems) and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering.
Author : Seonho Seok
Publisher : Springer
ISBN 13 : 3319778722
Total Pages : 119 pages
Book Rating : 4.3/5 (197 download)
Download or read book Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering written by Seonho Seok and published by Springer. This book was released on 2018-04-27 with total page 119 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
Author : Vijay K. Varadan
Publisher : John Wiley & Sons
ISBN 13 : 0470846194
Total Pages : 406 pages
Book Rating : 4.4/5 (78 download)
Download or read book RF MEMS and Their Applications written by Vijay K. Varadan and published by John Wiley & Sons. This book was released on 2003-07-25 with total page 406 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.
Author : Ernst Obermeier
Publisher : Springer
ISBN 13 : 3642594972
Total Pages : 1763 pages
Book Rating : 4.6/5 (425 download)
Download or read book Transducers ’01 Eurosensors XV written by Ernst Obermeier and published by Springer. This book was released on 2016-05-12 with total page 1763 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Conference is the premier international meeting for the presentation of original work addressing all aspects of the theory, design, fabrication, assembly, packaging, testing and application of solid-state sensors, actuators, MEMS, and microsystems.
Author : Dongqing Li
Publisher : Springer Science & Business Media
ISBN 13 : 0387324682
Total Pages : 2242 pages
Book Rating : 4.3/5 (873 download)
Download or read book Encyclopedia of Microfluidics and Nanofluidics written by Dongqing Li and published by Springer Science & Business Media. This book was released on 2008-08-06 with total page 2242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering all aspects of transport phenomena on the nano- and micro-scale, this encyclopedia features over 750 entries in three alphabetically-arranged volumes including the most up-to-date research, insights, and applied techniques across all areas. Coverage includes electrical double-layers, optofluidics, DNC lab-on-a-chip, nanosensors, and more.
