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Author : Yan Wang
Publisher :
ISBN 13 :
Total Pages : 153 pages
Book Rating : 4.:/5 (733 download)
Download or read book Integration of III-V Compound Semiconductors on Silicon MEMS Structures written by Yan Wang and published by . This book was released on 2000 with total page 153 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Author : Yan Wang
Publisher :
ISBN 13 :
Total Pages : 356 pages
Book Rating : 4.E/5 ( download)
Download or read book Integration of III-V Compound Semicond[cu]tors on Silicon MEMS Structures written by Yan Wang and published by . This book was released on 2000 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Tingkai Li
Publisher : CRC Press
ISBN 13 : 1439815232
Total Pages : 588 pages
Book Rating : 4.4/5 (398 download)
Download or read book III-V Compound Semiconductors written by Tingkai Li and published by CRC Press. This book was released on 2016-04-19 with total page 588 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicon-based microelectronics has steadily improved in various performance-to-cost metrics. But after decades of processor scaling, fundamental limitations and considerable new challenges have emerged. The integration of compound semiconductors is the leading candidate to address many of these issues and to continue the relentless pursuit of more
Author : Serge Oktyabrsky
Publisher : Springer Science & Business Media
ISBN 13 : 1441915478
Total Pages : 451 pages
Book Rating : 4.4/5 (419 download)
Download or read book Fundamentals of III-V Semiconductor MOSFETs written by Serge Oktyabrsky and published by Springer Science & Business Media. This book was released on 2010-03-16 with total page 451 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fundamentals of III-V Semiconductor MOSFETs presents the fundamentals and current status of research of compound semiconductor metal-oxide-semiconductor field-effect transistors (MOSFETs) that are envisioned as a future replacement of silicon in digital circuits. The material covered begins with a review of specific properties of III-V semiconductors and available technologies making them attractive to MOSFET technology, such as band-engineered heterostructures, effect of strain, nanoscale control during epitaxial growth. Due to the lack of thermodynamically stable native oxides on III-V's (such as SiO2 on Si), high-k oxides are the natural choice of dielectrics for III-V MOSFETs. The key challenge of the III-V MOSFET technology is a high-quality, thermodynamically stable gate dielectric that passivates the interface states, similar to SiO2 on Si. Several chapters give a detailed description of materials science and electronic behavior of various dielectrics and related interfaces, as well as physics of fabricated devices and MOSFET fabrication technologies. Topics also include recent progress and understanding of various materials systems; specific issues for electrical measurement of gate stacks and FETs with low and wide bandgap channels and high interface trap density; possible paths of integration of different semiconductor materials on Si platform.
Author : Jong-Won Lee
Publisher :
ISBN 13 :
Total Pages : 526 pages
Book Rating : 4.E/5 ( download)
Download or read book Monolithic Integration of III-V Compound Semiconductor Devices in Silicon-based Electronics written by Jong-Won Lee and published by . This book was released on 1997 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: Investigates semiconductor materials that may facilitate epitaxial growth of laser devices on Si substrates. Presents solutions to the main problems in achieving monolithic integration: growth of low defect density III-V epilayers on Si [Silicon] and growth of light-emitting material on Si. GaP [Gallium Phosphide] can be grown only on off-axis Si, light-emitting GaInP [Gallium Indium Phosphide] island on on-axis, and using selective area growth, on-axis GaP surface on the epilayer can be recovered. Also demonstrates room temperature electroluminescence of GaInP islands.
Author : F. Roozeboom
Publisher : The Electrochemical Society
ISBN 13 : 1566778638
Total Pages : 377 pages
Book Rating : 4.5/5 (667 download)
Download or read book Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications written by F. Roozeboom and published by The Electrochemical Society. This book was released on 2011-04-25 with total page 377 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions covers emerging materials, process and technology options for large-area silicon wafers to enhance advanced IC performance or to enable revolutionary device structures with entirely new functionalities. Topics : high-mobility channel materials, (e.g. strained Si/Ge, compound semiconductors and graphene), high-performance gate stacks and low-resistivity junctions and contacts on new, Si-compatible materials; new materials and processes for 3-D (TSV) integration ; synthesis of nano-structures including wires, pores and membranes of Si-compatible materials; novel MEMS/NEMS structures and their integration with the mainstream Si-IC technology.
Author : Nan Yang Pacella
Publisher :
ISBN 13 :
Total Pages : 176 pages
Book Rating : 4.:/5 (821 download)
Download or read book Platform for Monolithic Integration of III-V Devices with Si CMOS Technology written by Nan Yang Pacella and published by . This book was released on 2012 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: Monolithic integration of III-V compound semiconductors and Si complementary metal-oxide- semiconductor (CMOS) enables the creation of advanced circuits with new functionalities. In order to merge the two technologies, compatible substrate platforms and processing approaches must be developed. The Silicon on Lattice Engineered Silicon (SOLES) substrate allows monolithic integration. It is a Si substrate with embedded III-V template layer, which supports epitaxial IIIV device growth, consistent with present II-V technology. The structure is capped with a silicon-on-insulator (SOI) layer, which enables processing of CMOS devices. The processes required for fabricating and utilizing SOLES wafers which have Ge or InP as the III-V template layers are explored. Allowable thermal budgets are important to consider because the substrate must withstand the thermal budget of all subsequent device processing steps. The maximum processing temperature of Ge SOLES is found to be limited by its melting point. However, Ge diffuses through the buried Si0 2 and must be contained. Solutions include 1) limiting device processing thermal budgets, 2) improving buried silicon dioxide quality and 3) incorporating a silicon nitride diffusion barrier. InP SOLES substrates are created using wafer bonding and layer transfer of silicon, SOI and InP-on-Si wafers, established using a two-step growth method. Two different InP SOLES structures are demonstrated and their allowable thermal budgets are investigated. The thermal budgets appear to be limited by low quality silicon dioxide used for wafer bonding. For ultimate integration, parallel metallization of the III-V and CMOS devices is sought. A method of making ohmic contact to III-V materials through Si encapsulation layers, using Si CMOS technology, is established. The metallurgies and electrical characteristics of nickel silicide structures on Si/III-V films are investigated and the NiSi/Si/III-V structure is found to be optimal. This structure is composed of a standard NiSi/Si interface and novel Si/III-V interface. Specific contact resistivity of the double hetero-interface stack can be tuned by controlling Si/IIIV band alignments at the epitaxial growth interface. P-type Si/GaAs interfaces and n-type Si/InGaAs interfaces create ohmic contacts with the lowest specific contact resistivity and present viable structures for integration. A Si-encapsulated GaAs/AlGaAs laser with NiSi front-side contact is demonstrated and confirms the feasibility of these contact structures.
Author : C. Colinge
Publisher : The Electrochemical Society
ISBN 13 : 1566778239
Total Pages : 656 pages
Book Rating : 4.5/5 (667 download)
Download or read book Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele written by C. Colinge and published by The Electrochemical Society. This book was released on 2010-10 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Author : Carl Wilmsen
Publisher : Springer Science & Business Media
ISBN 13 : 1468448358
Total Pages : 472 pages
Book Rating : 4.4/5 (684 download)
Download or read book Physics and Chemistry of III-V Compound Semiconductor Interfaces written by Carl Wilmsen and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: The application of the 111-V compound semiconductors to device fabrica tion has grown considerably in the last few years. This process has been stimulated, in part, by the advancement in the understanding of the interface physics and chemistry of the III-V's. The literature on this subject is spread over the last 15 years and appears in many journals and conference proceedings. Understanding this literature requires consider able effort by the seasoned researcher, and even more for those starting out in the field or by engineers and scientists who wish to apply this knowledge to the fabrication of devices. The purpose of this book is to bring together much of the fundamental and practical knowledge on the physics and chemistry of the 111-V compounds with metals and dielectrics. The authors of this book have endeavored to provide concise overviews of these areas with many tahles ancI grarhs whic. h c. omr>are and summarize the literature. In this way, the book serves as both an insightful treatise on III-V interfaces and a handy reference to the literature. The selection of authors was mandated by the desire to include both fundamental and practical approaches, covering device and material aspects of the interfaces. All of the authors are recognized experts on III-V interfaces and each has worked for many years in his subject area. This experience is projected in the breadth of understanding in each chapter.
Author : Electrochemical Society
Publisher : ECS Transactions
ISBN 13 : 9781566779586
Total Pages : 265 pages
Book Rating : 4.7/5 (795 download)
Download or read book Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 2 written by Electrochemical Society and published by ECS Transactions. This book was released on 2012-04 with total page 265 pages. Available in PDF, EPUB and Kindle. Book excerpt: This issue of ECS Transactions covers emerging materials, process and technology options for large-area silicon wafers to enhance advanced IC performance or to enable revolutionary device structures with entirely new functionalities. Topics : high-mobility channel materials, (e.g. strained Si/Ge, compound semiconductors and graphene), high-performance gate stacks and low-resistivity junctions and contacts on new, Si-compatible materials; new materials and processes for 3-D (TSV) integration ; synthesis of nano-structures including wires, pores and membranes of Si-compatible materials; novel MEMS/NEMS structures and their integration with the mainstream Si-IC technology.
Author : Yazeed Alaskar
Publisher :
ISBN 13 :
Total Pages : 126 pages
Book Rating : 4.:/5 (14 download)
Download or read book High Quality III-V Semiconductor Integration on Si Using Van Der Waals Layered Material Buffer for Photonic Integration Applications written by Yazeed Alaskar and published by . This book was released on 2016 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integration of arsenide-based III-V compound semiconductors on silicon (Si) has been the focus of significant research to integrate light sources on silicon, enabling an integrated optical solution for chip-chip interconnects in future computing systems, and to make cost-effective and efficient multi-junction solar cells on silicon substrates. The primary obstacle to success is the lattice and thermal expansion mismatches between the semiconductor compounds of interest and the silicon substrates. In this thesis, a novel heteroepitaxial growth technique, quasi van der Waals epitaxy, promises the ability to grow high quality As-based semiconductor compounds on silicon using a two-dimensional (2D) layered material as a buffer layer, where the van der Waals force is dominant between the layers, thus reducing the strain arising from lattice and thermal expansion coefficient mismatches. The main body of the thesis is structured in three parts. First, theoretical investigations of quasi van der Waals heteroepitaxial growth of arsenide-based III-V compounds on layered materials, such as graphene, Indium Selenide (InSe), Boron Nitride (h-BN) and Molybdenum Selenide (MoS2), where the surface free energy and adsorption energies of Ga, Al, In and As are calculated using DFT calculations. Second, experimental demonstration of a novel low temperature technique for quasi van der Waals heteroepitaxial growth of arsenide based III-V compounds on graphene using Molecular Beam Epitaxy (MBE) is described. Third, using Indium Selenide (InSe) as a buffer layer due to its relatively high surface free energy and stability at high growth temperatures, a high quality and defect-free InGaAs/GaAs double heterostrucure (DH) is integrated onto a GaAs/ Si structure. The crystal quality of GaAs shows the lowest defect density of GaAs grown directly on Si to date, making it a remarkable step toward obtaining optical emitters on silicon substatres. The optical properties of this heterostructure were characterized using micro-photoluminescence ( -PL), demonstrating room-temperature light emission out of the InGaAs/GaAs heterostructure integrated on thin GaAs on InSe/Si. Planar growth of GaAs thin films on layered materials is a potential route towards heteroepitaxial integration of GaAs on silicon in the developing field of silicon photonics.
Author : F. Roozeboom
Publisher : The Electrochemical Society
ISBN 13 : 1607685949
Total Pages : 338 pages
Book Rating : 4.6/5 (76 download)
Download or read book Silicon Compatible Materials, and Technologies for Advanced Integrated Processes, Circuits and Emerging Applications 5 written by F. Roozeboom and published by The Electrochemical Society. This book was released on 2015 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : J.P. Nougier
Publisher : Elsevier
ISBN 13 : 1483295230
Total Pages : 523 pages
Book Rating : 4.4/5 (832 download)
Download or read book III-V Microelectronics written by J.P. Nougier and published by Elsevier. This book was released on 2014-05-27 with total page 523 pages. Available in PDF, EPUB and Kindle. Book excerpt: As is well known, Silicon widely dominates the market of semiconductor devices and circuits, and in particular is well suited for Ultra Large Scale Integration processes. However, a number of III-V compound semiconductor devices and circuits have recently been built, and the contributions in this volume are devoted to those types of materials, which offer a number of interesting properties. Taking into account the great variety of problems encountered and of their mutual correlations when fabricating a circuit or even a device, most of the aspects of III-V microelectronics, from fundamental physics to modelling and technology, from materials to devices and circuits are reviewed. Containing contributions from European researchers of international repute this volume is the definitive reference source for anyone interested in the latest advances and results of current experimental research in III-V microelectronics.
Author : Harmeet Bhugra
Publisher : Springer
ISBN 13 : 3319286889
Total Pages : 423 pages
Book Rating : 4.3/5 (192 download)
Download or read book Piezoelectric MEMS Resonators written by Harmeet Bhugra and published by Springer. This book was released on 2017-01-09 with total page 423 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associated with testing and qualification Examples of commercialization paths for piezoelectric MEMS resonators in the timing and the filter markets ...and more! The authors present industry and academic perspectives, making this book ideal for engineers, graduate students, and researchers.
Author : Hong H. Lee
Publisher :
ISBN 13 :
Total Pages : 380 pages
Book Rating : 4.F/5 ( download)
Download or read book Proceedings of the Thirteenth State-of-the Art Program on Compound Semiconductors (SOTAPOCS XIII) and the Symposium on Metallization of III-V Compound Semiconductors written by Hong H. Lee and published by . This book was released on 1991 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Sadao Adachi
Publisher : John Wiley & Sons
ISBN 13 : 9780471573296
Total Pages : 342 pages
Book Rating : 4.5/5 (732 download)
Download or read book Physical Properties of III-V Semiconductor Compounds written by Sadao Adachi and published by John Wiley & Sons. This book was released on 1992-11-10 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this book is two-fold: to examine key properties of III-V compounds and to present diverse material parameters and constants of these semiconductors for a variety of basic research and device applications. Emphasis is placed on material properties not only of Inp but also of InAs, GaAs and GaP binaries.
Author : Steve Ming Ting
Publisher :
ISBN 13 :
Total Pages : 152 pages
Book Rating : 4.:/5 (439 download)
Download or read book Monolithic Integration of Three-five Semiconductor Materials and Devices with Silicon written by Steve Ming Ting and published by . This book was released on 1999 with total page 152 pages. Available in PDF, EPUB and Kindle. Book excerpt:
