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Author :
Publisher :
ISBN 13 :
Total Pages : 420 pages
Book Rating : 4.3/5 (91 download)
Download or read book IEEE/CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 1994 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Walt Trybula
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 536 pages
Book Rating : 4.:/5 (318 download)
Download or read book Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 2-4, 1995, Austin, TX, USA written by Walt Trybula and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1995 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt:
![Download IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. PDF Online Free](https://books.google.com/books/content/images/frontcover/4wlWAAAAMAAJ?fife=w200-h370)
Author :
Publisher :
ISBN 13 :
Total Pages : 194 pages
Book Rating : 4.3/5 (91 download)
Download or read book IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. written by and published by . This book was released on 1998 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : EUROFORUM Deutschland GmbH
Publisher : Springer Nature
ISBN 13 : 3662588668
Total Pages : 368 pages
Book Rating : 4.6/5 (625 download)
Download or read book CTI SYMPOSIUM 2018 written by EUROFORUM Deutschland GmbH and published by Springer Nature. This book was released on 2019-11-13 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Every year, the international transmission and drive community meets up at the International CTI SYMPOSIA – automotive drivetrains, intelligent, electrified – in Germany, China and USA to discuss the best strategies and technologies for tomorrow’s cars, busses and trucks. From efficiency, comfort or costs to electrification, energy storage and connectivity, these premier industry meetings cover all the key issues in depth.
Author : Don Millard
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 504 pages
Book Rating : 4.:/5 (318 download)
Download or read book Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA written by Don Millard and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Author : S. W. Ricky Lee
Publisher : John Wiley & Sons
ISBN 13 : 1118881559
Total Pages : 256 pages
Book Rating : 4.1/5 (188 download)
Download or read book From LED to Solid State Lighting written by S. W. Ricky Lee and published by John Wiley & Sons. This book was released on 2021-09-17 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
Author : Navid Asadizanjani
Publisher : Springer Nature
ISBN 13 : 3030626091
Total Pages : 193 pages
Book Rating : 4.0/5 (36 download)
Download or read book Physical Assurance written by Navid Asadizanjani and published by Springer Nature. This book was released on 2021-02-15 with total page 193 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Author : John J. Stephens
Publisher : ASM International
ISBN 13 : 1615031170
Total Pages : 430 pages
Book Rating : 4.6/5 (15 download)
Download or read book Brazing and Soldering written by John J. Stephens and published by ASM International. This book was released on 2006-01-01 with total page 430 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Peter Ramm
Publisher : John Wiley & Sons
ISBN 13 : 3527326464
Total Pages : 435 pages
Book Rating : 4.5/5 (273 download)
Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2012-02-13 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Author : Sergey Yurish
Publisher : Lulu.com
ISBN 13 : 8469786334
Total Pages : 536 pages
Book Rating : 4.4/5 (697 download)
Download or read book 'Advances in Microelectronics: Reviews', Vol_1 written by Sergey Yurish and published by Lulu.com. This book was released on 2017-12-24 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 1st volume of 'Advances in Microelectronics: Reviews' Book Series contains 19 chapters written by 72 authors from academia and industry from 16 countries. With unique combination of information in each volume, the 'Advances in Microelectronics: Reviews' Book Series will be of value for scientists and engineers in industry and at universities. In order to offer a fast and easy reading of the state of the art of each topic, every chapter in this book is independent and self-contained. All chapters have the same structure: first an introduction to specific topic under study; second particular field description including sensing applications. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.
Author : Preeti S Chauhan
Publisher : Springer Science & Business Media
ISBN 13 : 1461457610
Total Pages : 254 pages
Book Rating : 4.4/5 (614 download)
Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Author : Nishar Hameed
Publisher : Elsevier
ISBN 13 : 0323985351
Total Pages : 301 pages
Book Rating : 4.3/5 (239 download)
Download or read book Rapid Cure Composites written by Nishar Hameed and published by Elsevier. This book was released on 2023-05-17 with total page 301 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rapid Cure Composites: Materials, Processing and Manufacturing presents up-to-date information on the design criteria to formulate matrix systems for rapid curing. Emphasis is placed on the role different materials [resin compound and fiber reinforcement] play in developing fast curing composites, assessment of current and novel manufacturing techniques for adapting fast curing processes, the comparison between conventional curing and rapid curing, and different applications in various industrial sectors [e.g., aerospace, automotive, renewables and marine]. The book will be an essential reference resource for academic and industrial researchers working in the field of composite materials, processing and manufacturing organizations, materials scientists, and more. Polymer composites are widely used in several industries, including aerospace, automobile, spray and coatings, and electronics due to their lightweight and superior mechanical properties. However, one of the dominant hurdles towards their growth in commercial industries is the long curing cycle and slow production. - Comprehensively addresses the scientific and technological development of rapid cured epoxy composites - Covers, in detail, the chemistry, processing, structure and performance of rapid cured epoxy composites - Provides detailed comparisons of how/why rapid cure composites are different to conventional composites - Discusses the challenges of the existing technology and future trends
Author : Chong Leong, Gan
Publisher : Springer Nature
ISBN 13 : 3031267087
Total Pages : 223 pages
Book Rating : 4.0/5 (312 download)
Download or read book Interconnect Reliability in Advanced Memory Device Packaging written by Chong Leong, Gan and published by Springer Nature. This book was released on 2023-05-30 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Author :
Publisher :
ISBN 13 :
Total Pages : 816 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings of the ... International Symposium on Microelectronics written by and published by . This book was released on 2001 with total page 816 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Alan T. Zehnder
Publisher : Springer
ISBN 13 : 3319421956
Total Pages : 155 pages
Book Rating : 4.3/5 (194 download)
Download or read book Fracture, Fatigue, Failure and Damage Evolution, Volume 8 written by Alan T. Zehnder and published by Springer. This book was released on 2016-09-20 with total page 155 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fracture, Fatigue, Failure and Damage Evolution, Volume 8 of the Proceedings of the 2016 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the eighth volume of ten from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: In-situ Techniques for Fracture & Fatigue General Topics in Fracture & Fatigue Fracture & Fatigue of Composites Damage, Fracture, Fatigue & Durability Interfacial Effects in Fracture & Fatigue Damage Detection in Fracture & Fatigue
Author : Mohd Mustafa Al Bakri Abdullah
Publisher : Trans Tech Publications Ltd
ISBN 13 : 3035730202
Total Pages : 624 pages
Book Rating : 4.0/5 (357 download)
Download or read book Advanced Materials Engineering and Technology IV written by Mohd Mustafa Al Bakri Abdullah and published by Trans Tech Publications Ltd. This book was released on 2016-05-20 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt: Selected peer reviewed papers from the 2015 International Conference on Advanced Materials Engineering and Technology (ICAMET 2015), December 4-5, 2015, Kaohsiung,Taiwan
Author : Yoshihiko Imanaka
Publisher : Springer Science & Business Media
ISBN 13 : 0387233148
Total Pages : 252 pages
Book Rating : 4.3/5 (872 download)
Download or read book Multilayered Low Temperature Cofired Ceramics (LTCC) Technology written by Yoshihiko Imanaka and published by Springer Science & Business Media. This book was released on 2006-05-28 with total page 252 pages. Available in PDF, EPUB and Kindle. Book excerpt: The only book to concentrate solely on low temperature cofired ceramics, an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices.
