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Author :
Publisher :
ISBN 13 :
Total Pages : 370 pages
Book Rating : 4.0/5 ( download)
Download or read book IEEE/CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 2004 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Author :
Publisher :
ISBN 13 :
Total Pages : 194 pages
Book Rating : 4.3/5 (91 download)
Download or read book IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. written by and published by . This book was released on 1998 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt:
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Author :
Publisher :
ISBN 13 :
Total Pages : 470 pages
Book Rating : 4.3/5 (91 download)
Download or read book IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. written by and published by . This book was released on 2003 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Walt Trybula
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 536 pages
Book Rating : 4.:/5 (318 download)
Download or read book Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 2-4, 1995, Austin, TX, USA written by Walt Trybula and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1995 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEMT
Publisher :
ISBN 13 : 9780780366213
Total Pages : 388 pages
Book Rating : 4.3/5 (662 download)
Download or read book Electronics Manufacturing Technology (Iemt), 2000 Ieee/Cpmt 26th written by IEMT and published by . This book was released on 2000 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Shen Liu
Publisher : John Wiley & Sons
ISBN 13 : 0470828412
Total Pages : 586 pages
Book Rating : 4.4/5 (78 download)
Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Author : M.A. Rahim
Publisher : Springer Science & Business Media
ISBN 13 : 1461516358
Total Pages : 452 pages
Book Rating : 4.4/5 (615 download)
Download or read book Integrated Models in Production Planning, Inventory, Quality, and Maintenance written by M.A. Rahim and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 452 pages. Available in PDF, EPUB and Kindle. Book excerpt: Production planning, inventory management, quality control, and maintenance policy are critical components of the manufacturing system. The effective integration of these four components gives a manufacturing operation the competitive edge in today's global market place. Integrated Models in Production Planning, Inventory, Quality, and Maintenance provides, in one volume, the latest developments in the integration of production, quality, and maintenance models. Prominent researchers, who are actively engaged in these areas, have contributed the topical chapters focused on the most recent issues in the area. In Part I, Ben-Daya and Rahim provide an overview of the literature dealing with integrated models for production, quality, and maintenance. Directions for future research are outlined. Part II contains six chapters (chapters 2 to 6) dealing with integrated models for production and maintenance. Part III deals with integrated production/inventory and quality models in chapters 7-11. Part IV focuses on quality and maintenance integrated models and contains two chapters. Part V deals with warranty, manufacturing, and quality and contains two chapters. Part VI addresses issues related to quality and contains three chapters (chapters 16-18).
Author : John H. Lau
Publisher : Springer
ISBN 13 : 9811088845
Total Pages : 319 pages
Book Rating : 4.8/5 (11 download)
Download or read book Fan-Out Wafer-Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
Author : Albert Blodgett
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 : 9780780314245
Total Pages : 504 pages
Book Rating : 4.3/5 (142 download)
Download or read book Fifteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium written by Albert Blodgett and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1993 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : S. W. Ricky Lee
Publisher : John Wiley & Sons
ISBN 13 : 1118881559
Total Pages : 256 pages
Book Rating : 4.1/5 (188 download)
Download or read book From LED to Solid State Lighting written by S. W. Ricky Lee and published by John Wiley & Sons. This book was released on 2021-09-17 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
Author : Preeti S Chauhan
Publisher : Springer Science & Business Media
ISBN 13 : 1461457610
Total Pages : 254 pages
Book Rating : 4.4/5 (614 download)
Download or read book Copper Wire Bonding written by Preeti S Chauhan and published by Springer Science & Business Media. This book was released on 2013-09-20 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Author : Eugenio Iannone
Publisher : CRC Press
ISBN 13 : 1466560738
Total Pages : 1178 pages
Book Rating : 4.4/5 (665 download)
Download or read book Labs on Chip written by Eugenio Iannone and published by CRC Press. This book was released on 2018-09-03 with total page 1178 pages. Available in PDF, EPUB and Kindle. Book excerpt: Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
Author : Nam P. Suh
Publisher : Oxford University Press, USA
ISBN 13 : 0195178769
Total Pages : 313 pages
Book Rating : 4.1/5 (951 download)
Download or read book Complexity written by Nam P. Suh and published by Oxford University Press, USA. This book was released on 2005 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: Suh (mechanical engineering, Massachusetts, Institute of Technology) offers a general theoretical framework that may be used to solve complexity problems in engineering, science, and even in certain nontechnical areas.
Author : Christopher Corti
Publisher : CRC Press
ISBN 13 : 1420065262
Total Pages : 446 pages
Book Rating : 4.4/5 (2 download)
Download or read book Gold written by Christopher Corti and published by CRC Press. This book was released on 2009-12-02 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gold is used in a wide range of industrial and medical applications and accounts for over 10 percent of the annual demand for metal, worth billions of dollars annually. While much has been written about the mystique and trade of gold, very little has been written about the science and technology in which it is involved. Edited by two respected auth
Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9819721407
Total Pages : 515 pages
Book Rating : 4.8/5 (197 download)
Download or read book Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology written by John H. Lau and published by Springer Nature. This book was released on with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Fabio Giudice
Publisher : CRC Press
ISBN 13 : 1420001043
Total Pages : 517 pages
Book Rating : 4.4/5 (2 download)
Download or read book Product Design for the Environment written by Fabio Giudice and published by CRC Press. This book was released on 2006-01-13 with total page 517 pages. Available in PDF, EPUB and Kindle. Book excerpt: In recent years the increased awareness of environmental issues has led to the development of new approaches to product design, known as Design for Environment and Life Cycle Design. Although still considered emerging and in some cases radical, their principles will become, by necessity, the wave of the future in design. A thorough exploration of t
Author : Jan S. Iwanczyk
Publisher : CRC Press
ISBN 13 : 149876682X
Total Pages : 331 pages
Book Rating : 4.4/5 (987 download)
Download or read book Radiation Detectors for Medical Imaging written by Jan S. Iwanczyk and published by CRC Press. This book was released on 2015-10-16 with total page 331 pages. Available in PDF, EPUB and Kindle. Book excerpt: Radiation Detectors for Medical Imaging discusses the current state of the art and future prospects of photon-counting detectors for medical imaging applications. Featuring contributions from leading experts and pioneers in their respective fields, this book:Describes x-ray spectral imaging detectors based on cadmium zinc telluride (CdZnTe) and cad
