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Heterogeneous Integration Technology For Hybrid Optoelectronic And Electronic Device And Module Fabrication
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Book Synopsis Heterogeneous Integration Technology for Hybrid Optoelectronic and Electronic Device and Module Fabrication by : Michael Sungchun Jin
Download or read book Heterogeneous Integration Technology for Hybrid Optoelectronic and Electronic Device and Module Fabrication written by Michael Sungchun Jin and published by . This book was released on 1998 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Heterogeneous Integrations by : John H. Lau
Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Book Synopsis Dissertation Abstracts International by :
Download or read book Dissertation Abstracts International written by and published by . This book was released on 1999 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Heterogeneous Integration by : Anis Husain
Download or read book Heterogeneous Integration written by Anis Husain and published by SPIE-International Society for Optical Engineering. This book was released on 1998 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Book Synopsis Heterogeneous Optoelectronics Integration by : Elias Towe
Download or read book Heterogeneous Optoelectronics Integration written by Elias Towe and published by SPIE Press. This book was released on 2000 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: Numerous efforts are directed at investigating the use of optics at short distances--for example, at the chip-to-chip and board-to-board levels of the interconnection hierarchy. This book provides an overview of the state of the art in heterogeneous integration of electronics, optoelectronics, and micro-optics for short-distance optical interconnections.
Download or read book Labs on Chip written by Eugenio Iannone and published by CRC Press. This book was released on 2018-09-03 with total page 1351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
Book Synopsis American Doctoral Dissertations by :
Download or read book American Doctoral Dissertations written by and published by . This book was released on 1998 with total page 784 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :Xingcun Colin Tong Ph.D Publisher :Springer Science & Business Media ISBN 13 :3319015508 Total Pages :574 pages Book Rating :4.3/5 (19 download)
Book Synopsis Advanced Materials for Integrated Optical Waveguides by : Xingcun Colin Tong Ph.D
Download or read book Advanced Materials for Integrated Optical Waveguides written by Xingcun Colin Tong Ph.D and published by Springer Science & Business Media. This book was released on 2013-10-17 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.
Book Synopsis Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by : John H. Lau
Download or read book Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology written by John H. Lau and published by Springer Nature. This book was released on with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Silicon Photonics II by : David J. Lockwood
Download or read book Silicon Photonics II written by David J. Lockwood and published by Springer Science & Business Media. This book was released on 2010-10-13 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is volume II of a series of books on silicon photonics. It gives a fascinating picture of the state-of-the-art in silicon photonics from a component perspective. It presents a perspective on what can be expected in the near future. It is formed from a selected number of reviews authored by world leaders in the field, and is written from both academic and industrial viewpoints. An in-depth discussion of the route towards fully integrated silicon photonics is presented. This book will be useful not only to physicists, chemists, materials scientists, and engineers but also to graduate students who are interested in the fields of micro- and nanophotonics and optoelectronics.
Book Synopsis Thin-Film Organic Photonics by : Tetsuzo Yoshimura
Download or read book Thin-Film Organic Photonics written by Tetsuzo Yoshimura and published by CRC Press. This book was released on 2017-12-19 with total page 366 pages. Available in PDF, EPUB and Kindle. Book excerpt: Among the many atomic/molecular assembling techniques used to develop artificial materials, molecular layer deposition (MLD) continues to receive special attention as the next-generation growth technique for organic thin-film materials used in photonics and electronics. Thin-Film Organic Photonics: Molecular Layer Deposition and Applications describes how photonic/electronic properties of thin films can be improved through MLD, which enables precise control of atomic and molecular arrangements to construct a wire network that achieves "three-dimensional growth". MLD facilitates dot-by-dot—or molecule-by-molecule—growth of polymer and molecular wires, and that enhanced level of control creates numerous application possibilities. Explores the wide range of MLD applications in solar energy and optics, as well as proposed uses in biomedical photonics This book addresses the prospects for artificial materials with atomic/molecular-level tailored structures, especially those featuring MLD and conjugated polymers with multiple quantum dots (MQDs), or polymer MQDs. In particular, the author focuses on the application of artificial organic thin films to: Photonics/electronics, particularly in optical interconnects used in computers Optical switching and solar energy conversion systems Bio/ medical photonics, such as photodynamic therapy Organic photonic materials, devices, and integration processes With its clear and concise presentation, this book demonstrates exactly how MLD enables electron wavefunction control, thereby improving material performance and generating new photonic/electronic phenomena.
Book Synopsis International Aerospace Abstracts by :
Download or read book International Aerospace Abstracts written by and published by . This book was released on 1999 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Fibre Optic Communication Devices by : Norbert Grote
Download or read book Fibre Optic Communication Devices written by Norbert Grote and published by Springer Science & Business Media. This book was released on 2001-01-26 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optoelectronic devices and fibre optics are the basis of cutting-edge communication systems. This monograph deals with the various components of these systems, including lasers, amplifiers, modulators, converters, filters, sensors, and more.
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2004-05-14 with total page 524 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Book Synopsis Self-Organized 3D Integrated Optical Interconnects by : Tetsuzo Yoshimura
Download or read book Self-Organized 3D Integrated Optical Interconnects written by Tetsuzo Yoshimura and published by CRC Press. This book was released on 2021-03-09 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Download or read book Compound Semiconductor written by and published by . This book was released on 2003 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Integrated Optoelectronics by : Mario Dagenais
Download or read book Integrated Optoelectronics written by Mario Dagenais and published by . This book was released on 1995 with total page 712 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated optoelectronics is becoming ever more important to communications, computer, and consumer industries, with applications in a variety of areas, from consumer electronics to high performance information networks. The requiremets for producing low-cost, highly reliable components for deployment in these new systems have created a technology challenge. Integrated optoelectronics promises to meet the performance and cost objectives of these applications by integrating both optical and electronic components in a highly functional chip. This book provides and overview of this technology.