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Hardening Semiconductor Components Against Radiation And Temperature
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Book Synopsis Hardening Semiconductor Components Against Radiation and Temperature by : William R. Dawes
Download or read book Hardening Semiconductor Components Against Radiation and Temperature written by William R. Dawes and published by William Andrew. This book was released on 1989 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes hardening of semiconductor components against radiation and temperature. Basic mechanisms of radiation effects on electronic materials and devices are discussed first, followed by such practical topics as hardening technologies, circuit design for hardening, and, finally, hardness assurance. Discussions center mainly on silicon technology.
Book Synopsis Integrated Circuit Design for Radiation Environments by : Stephen J. Gaul
Download or read book Integrated Circuit Design for Radiation Environments written by Stephen J. Gaul and published by John Wiley & Sons. This book was released on 2019-12-03 with total page 514 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-electronics used in harsh environments.
Book Synopsis Quality Conformance and Qualification of Microelectronic Packages and Interconnects by : Michael Pecht
Download or read book Quality Conformance and Qualification of Microelectronic Packages and Interconnects written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-12-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Book Synopsis Extreme Environment Electronics by : John D. Cressler
Download or read book Extreme Environment Electronics written by John D. Cressler and published by CRC Press. This book was released on 2017-12-19 with total page 1041 pages. Available in PDF, EPUB and Kindle. Book excerpt: Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.
Book Synopsis Materials for High-Temperature Semiconductor Devices by : National Research Council
Download or read book Materials for High-Temperature Semiconductor Devices written by National Research Council and published by National Academies Press. This book was released on 1995-10-14 with total page 136 pages. Available in PDF, EPUB and Kindle. Book excerpt: Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.
Download or read book Nuclear Science Abstracts written by and published by . This book was released on 1976 with total page 934 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Semiconductors and Superconductors by : Ron Legarski
Download or read book Semiconductors and Superconductors written by Ron Legarski and published by SolveForce. This book was released on 2024-09-22 with total page 567 pages. Available in PDF, EPUB and Kindle. Book excerpt: "Semiconductors and Superconductors: From Invention to Innovation" is a comprehensive exploration of the fundamental technologies that power modern electronics, energy systems, and computing. Written by Ron Legarski, a leading expert in telecommunications and technology solutions, this book delves into the discovery, evolution, and future applications of semiconductors and superconductors—two cornerstones of modern science and engineering. The book is designed for a wide audience, from professionals in the tech industry and academic researchers to students and general readers interested in understanding the science and technology that drive today’s digital world. Semiconductors are the building blocks of every microchip, transistor, and integrated circuit—essential components in everything from smartphones to solar cells. Superconductors, on the other hand, have the potential to revolutionize fields like energy transmission, quantum computing, and medical imaging by enabling technologies that operate with zero electrical resistance. This book covers the key milestones in the development of semiconductors and superconductors, starting with the invention of the transistor and the discovery of superconductivity. It also dives into the applications of these technologies in industries such as telecommunications, computing, energy systems, and medical technology, demonstrating their far-reaching impact on society. Key topics include: The physics of semiconductors and superconductors, explained in accessible language. The history and evolution of transistors, integrated circuits, and quantum devices. How superconducting materials are used in applications ranging from MRI machines to high-speed trains. The role of semiconductors in smartphones, AI systems, and energy-efficient power grids. Future research directions, including the pursuit of room-temperature superconductors and wide-bandgap semiconductors like SiC and GaN. The convergence of AI, machine learning, and nanotechnology in designing next-generation semiconductor and superconductor devices. The book also provides a forward-looking perspective on how these technologies will shape the future, particularly in fields like quantum computing, artificial intelligence, and renewable energy systems. With chapters organized for easy navigation, technical glossaries, and suggested reading for further exploration, "Semiconductors and Superconductors: From Invention to Innovation" is an essential resource for anyone looking to understand the technological forces that are driving the world forward.
Download or read book Cumulative Book Index written by and published by . This book was released on 1990 with total page 2280 pages. Available in PDF, EPUB and Kindle. Book excerpt: A world list of books in the English language.
Book Synopsis Microcircuit Reliability Bibliography by :
Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1978 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1991 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Energy Research Abstracts written by and published by . This book was released on 1990 with total page 840 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Catalog of National Bureau of Standards Publications, 1966-1976 by : United States. National Bureau of Standards
Download or read book Catalog of National Bureau of Standards Publications, 1966-1976 written by United States. National Bureau of Standards and published by . This book was released on 1978 with total page 788 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book NBS Special Publication written by and published by . This book was released on 1968 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Publications of the National Bureau of Standards ... Catalog by : United States. National Bureau of Standards
Download or read book Publications of the National Bureau of Standards ... Catalog written by United States. National Bureau of Standards and published by . This book was released on 1978 with total page 788 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Catalog of National Bureau of Standards Publications, 1966-1976: pt. 1-2. Key word index by : United States. National Bureau of Standards
Download or read book Catalog of National Bureau of Standards Publications, 1966-1976: pt. 1-2. Key word index written by United States. National Bureau of Standards and published by . This book was released on 1978 with total page 788 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Space Vehicle Maneuvering, Propulsion, Dynamics and Control by : Ranjan Vepa
Download or read book Space Vehicle Maneuvering, Propulsion, Dynamics and Control written by Ranjan Vepa and published by Springer Nature. This book was released on with total page 553 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Microengineering Technology for Space Systems by : Henry Helvajian
Download or read book Microengineering Technology for Space Systems written by Henry Helvajian and published by AIAA. This book was released on 1997 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: A follow-on to Micro- and Nanotechnology for Space Systems, this second monograph in the series uses the more universal term microengineering to define the discipline and processes that lead to the development of an integrated and intelligent microinstrument. Microengineering Technology for Space Systems addresses specific issues concerning areas for ASIM application in current space systems, operation in the space environment, ultra-high-density packaging and nonsilicon materials-processing tools, and the feasibility of the nanosatellite concept.
