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Handbook Of 3d Integration Volume 1
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Book Synopsis Handbook of 3D Integration, Volume 1 by : Philip Garrou
Download or read book Handbook of 3D Integration, Volume 1 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2011-09-22 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
Book Synopsis Handbook of 3D Integration by : Philip Garrou
Download or read book Handbook of 3D Integration written by Philip Garrou and published by Wiley-VCH. This book was released on 2008-10-21 with total page 798 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of 3D Integration, Volume 3 by : Philip Garrou
Download or read book Handbook of 3D Integration, Volume 3 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2014-07-21 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-05-06 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Book Synopsis Handbook of 3D Integration, Volumes 1 and 2 by : Philip Garrou
Download or read book Handbook of 3D Integration, Volumes 1 and 2 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2012-10-22 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics into perspective with the requirements for further microelectronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon, Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.
Book Synopsis Handbook of 3D Integration, Volume 4 by : Paul D. Franzon
Download or read book Handbook of 3D Integration, Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 265 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Book Synopsis Handbook of 3D Integration by : Philip Garrou
Download or read book Handbook of 3D Integration written by Philip Garrou and published by . This book was released on 2008 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of 3D Integration, Volume 3 by : Philip Garrou
Download or read book Handbook of 3D Integration, Volume 3 written by Philip Garrou and published by John Wiley & Sons. This book was released on 2014-04-22 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Book Synopsis Handbook of 3D Integration by : John Wiley & Sons
Download or read book Handbook of 3D Integration written by John Wiley & Sons and published by . This book was released on 2014 with total page 451 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis 3D Integration for VLSI Systems by : Chuan Seng Tan
Download or read book 3D Integration for VLSI Systems written by Chuan Seng Tan and published by CRC Press. This book was released on 2016-04-19 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Book Synopsis Practical Guide to RF-MEMS by : Jacopo Iannacci
Download or read book Practical Guide to RF-MEMS written by Jacopo Iannacci and published by John Wiley & Sons. This book was released on 2013-08-12 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex networks, are presented at the beginning of the book as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. Theoretical concepts are introduced when necessary to complement the practical hints given for all RF-MEMS development stages. Provides researchers and engineers with invaluable practical hints on how to develop novel RF-MEMS device concepts Covers all critical steps, dealing with design, simulation, optimization, characterization and fabrication of MEMS for radio-frequency applications Addresses frequently disregarded issues, explicitly treating the hard to predict interplay between the three-dimensional device structure and its electromagnetic functionality Bridges theory and experiment, fundamental concepts are introduced with the application in mind, and simulation results are validated against experimental results Appeals to the practice-oriented R&D reader: design and simulation examples are based on widely known software packages such as ANSYS and the hardware description language Verilog.
Book Synopsis Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) by :
Download or read book Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) written by and published by World Scientific. This book was released on 2019-08-27 with total page 1079 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
Book Synopsis Handbook of Wafer Bonding by : Peter Ramm
Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2012-02-13 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Book Synopsis Handbook of Medical Imaging by : Jacob Beutel
Download or read book Handbook of Medical Imaging written by Jacob Beutel and published by SPIE Press. This book was released on 2000 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume describes concurrent engineering developments that affect or are expected to influence future development of digital diagnostic imaging. It also covers current developments in Picture Archiving and Communications System (PACS) technology, with particular emphasis on integration of emerging imaging technologies into the hospital environment.
Book Synopsis Hardware Protection through Obfuscation by : Domenic Forte
Download or read book Hardware Protection through Obfuscation written by Domenic Forte and published by Springer. This book was released on 2017-01-02 with total page 349 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces readers to various threats faced during design and fabrication by today’s integrated circuits (ICs) and systems. The authors discuss key issues, including illegal manufacturing of ICs or “IC Overproduction,” insertion of malicious circuits, referred as “Hardware Trojans”, which cause in-field chip/system malfunction, and reverse engineering and piracy of hardware intellectual property (IP). The authors provide a timely discussion of these threats, along with techniques for IC protection based on hardware obfuscation, which makes reverse-engineering an IC design infeasible for adversaries and untrusted parties with any reasonable amount of resources. This exhaustive study includes a review of the hardware obfuscation methods developed at each level of abstraction (RTL, gate, and layout) for conventional IC manufacturing, new forms of obfuscation for emerging integration strategies (split manufacturing, 2.5D ICs, and 3D ICs), and on-chip infrastructure needed for secure exchange of obfuscation keys- arguably the most critical element of hardware obfuscation.
Book Synopsis Security Opportunities in Nano Devices and Emerging Technologies by : Mark Tehranipoor
Download or read book Security Opportunities in Nano Devices and Emerging Technologies written by Mark Tehranipoor and published by CRC Press. This book was released on 2017-11-22 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: The research community lacks both the capability to explain the effectiveness of existing techniques and the metrics to predict the security properties and vulnerabilities of the next generation of nano-devices and systems. This book provides in-depth viewpoints on security issues and explains how nano devices and their unique properties can address the opportunities and challenges of the security community, manufacturers, system integrators, and end users. This book elevates security as a fundamental design parameter, transforming the way new nano-devices are developed. Part 1 focuses on nano devices and building security primitives. Part 2 focuses on emerging technologies and integrations.
Download or read book Resonant MEMS written by Oliver Brand and published by John Wiley & Sons. This book was released on 2015-06-08 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Part of the AMN book series, this book covers the principles, modeling and implementation as well as applications of resonant MEMS from a unified viewpoint. It starts out with the fundamental equations and phenomena that govern the behavior of resonant MEMS and then gives a detailed overview of their implementation in capacitive, piezoelectric, thermal and organic devices, complemented by chapters addressing the packaging of the devices and their stability. The last part of the book is devoted to the cutting-edge applications of resonant MEMS such as inertial, chemical and biosensors, fluid properties sensors, timing devices and energy harvesting systems.
