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Author : Lai Wang
Publisher :
ISBN 13 :
Total Pages : 176 pages
Book Rating : 4.:/5 (385 download)
Download or read book Formation and Stress Analysis of Through-hole Solder Joints written by Lai Wang and published by . This book was released on 1997 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mohd N. Tamin
Publisher : Springer Science & Business
ISBN 13 : 3319000926
Total Pages : 179 pages
Book Rating : 4.3/5 (19 download)
Download or read book Solder Joint Reliability Assessment written by Mohd N. Tamin and published by Springer Science & Business. This book was released on 2014-04-26 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.
Author : Darrel R. Frear
Publisher : Springer Science & Business Media
ISBN 13 : 9780442015053
Total Pages : 434 pages
Book Rating : 4.0/5 (15 download)
Download or read book Mechanics of Solder Alloy Interconnects written by Darrel R. Frear and published by Springer Science & Business Media. This book was released on 1994-01-31 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Author : Patrick N. Espy
Publisher :
ISBN 13 :
Total Pages : 100 pages
Book Rating : 4.:/5 (317 download)
Download or read book Testing of Printed Circuit Board Solder Joints by Optical Correlation written by Patrick N. Espy and published by . This book was released on 1975 with total page 100 pages. Available in PDF, EPUB and Kindle. Book excerpt: An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints has been evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.
Author : Gautam Arvind Pagedar
Publisher :
ISBN 13 :
Total Pages : 410 pages
Book Rating : 4.:/5 (274 download)
Download or read book Finite Element Stress Analysis of a Surface-mount Solder Joint with Automatic Mesh Generation written by Gautam Arvind Pagedar and published by . This book was released on 1992 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Erdogan Madenci
Publisher : Springer Science & Business Media
ISBN 13 : 1461502551
Total Pages : 201 pages
Book Rating : 4.4/5 (615 download)
Download or read book Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® written by Erdogan Madenci and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 201 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 9780442002602
Total Pages : 504 pages
Book Rating : 4.0/5 (26 download)
Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 1991-05-31 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Author : John H. Lau
Publisher : Springer Science & Business Media
ISBN 13 : 1461539102
Total Pages : 649 pages
Book Rating : 4.4/5 (615 download)
Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Author : John Lau
Publisher : Springer Science & Business Media
ISBN 13 : 1468477676
Total Pages : 904 pages
Book Rating : 4.4/5 (684 download)
Download or read book Thermal Stress and Strain in Microelectronics Packaging written by John Lau and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author : Peter Kojo Bernasko
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (847 download)
Download or read book Study of Intermetallic Compound Layer Formation, Growth and Evaluation of Shear Strength of Lead-free Solder Joints written by Peter Kojo Bernasko and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Solder joints play a very important role in electronic products as the integrity of electronics packaging and assembly rests on the quality of these connections. The increasing demands for higher performance, lower cost, and miniaturisation in hand-held and consumer electronic products have led to the use of dense interconnections. This miniaturization trend means that solder joint reliability remains an important challenge with surface mount electronics assembly, especially those used in hostile environments, and applications such as automobile, aerospace and other safety critical operations. One of the most important factors which are known to affect solder joint reliability is the thickness of intermetallic compound (IMC) layer formed between the solder and the substrate. Although the formation of an IMC layer signifies good bonding between the solder and substrate, its main disadvantage is that it is also known to be the most brittle part of the solder joint. Thus as the miniaturisation trend continues, and solder joints become even smaller in size, the nature and impact of IMC layer thickness on solder joint reliability becomes even more of a concern with the introduction of new lead-free soldering. Other factors which are known to affect solder joint reliability include the bonding strength, the voiding percentage in joints, the size of the voids and their location within the joint. The work reported in this thesis on formation and growth of intermetallic compound layer, and evaluation of the shear strength of lead-free solder joints is divided into four main parts. The first part of the study is concerned with understanding of the effect of pad sizes on Inter-metallic compound layer formation and growth for lead-free solder joints. The second part concerns the study of the effect of temperature cycling and reflow profiles on intermetallic growth between Sn-Ag-Cu alloy and Cu substrate. The third part of the study concerns the investigation of the effect of reflow soldering profile optimization on solder volumes using design of experiment technique. The focus of the final part of the study is the investigation of the effect of Inter-metallic Compound thickness on shear strength of 1206 surface mount chip resistor. The results from the experimental work showed that the pad size has very little influence on the growth of the IMC. The result also shows that the growth of IMC depends on diffusion rate, temperature and time according to the power-law model; and that the IMC layer thickness is independent of pad size. The significance of this result is that with further reductions in joint size (with IMC layer thickness remaining the same), the ratio of the IMC layer thickness to solder joint size will increase and adversely impact the joint reliability. The work carried out on ageing temperatures and reflow profiles of Sn-Ag-Cu alloy and Cu substrate also showed the reaction-diffusion mechanism of intermetallic compound formation and growth in solder joints. The study also showed that the most significant factor in achieving lower IMC layer thickness and fine microstructures is the time to peak temperature of the reflow soldering process. The effect of IMC layer thickness on the shear strength of Sn-Ag-Cu solder joints was investigated. The relationship of shear strength, interfacial microstructures and fracture surfaces was considered. It is clear that formation of continuous Cu-Sn and SnNiCu layers are the reason for the weak interface strength. The results show that the shear strength of solder joints decreases with increasing ageing time. The results of this study have been disseminated through journal and conference publications and will be of interest to R&D personnel working in the area of high temperature electronics and in particular those working in the field of automotive electronics.
Author :
Publisher :
ISBN 13 :
Total Pages : 87 pages
Book Rating : 4.:/5 (684 download)
Download or read book A Microstructural Analysis of Solder Joints from the Electronic Assemblies of Dismantled Nuclear Weapons written by and published by . This book was released on 1997 with total page 87 pages. Available in PDF, EPUB and Kindle. Book excerpt: MC1814 Interconnection Boxes from dismantled B57 bombs, and MC2839 firing Sets from retired W70-1 warheads were obtained from the Pantex facility. Printed circuit boards were selected from these components for microstructural analysis of their solder joints. The analysis included a qualitative examination of the solder joints and quantitative assessments of (1) the thickness of the intermetallic compound layer that formed between the solder and circuit board Cu features, and (2) the Pb-rich phase particle distribution within the solder joint microstructure. The MC2839 solder joints had very good workmanship qualities. The intermetallic compound layer stoichiometry was determined to be that of Cu6Sn5. The mean intermetallic compound layer thickness for all solder joints was 0.885 mm. The magnitude of these values did not indicate significant growth over the weapon lifetime. The size distribution of the Pb-rich phase particles for each of the joints were represented by the mean of 9.85 x 10−6 mm2. Assuming a spherical geometry, the mean particle diameter would be 3.54 mm. The joint-to-joint difference of intermetallic compound layer thickness and Pb-rich particle size distribution was not caused by varying thermal environments, but rather, was a result of natural variations in the joint microstructure that probably existed at the time of manufacture. The microstructural evaluation of the through-hole solder joints form the MC2839 and MC1814 components indicated that the environmental conditions to which these electronic units were exposed in the stockpile, were benign regarding solder joint aging. There was an absence of thermal fatigue damage in MC2839 circuit board, through-hole solder joints. The damage to the eyelet solder joints of the MC1814 more likely represented infant mortality failures at or very near the time of manufacture, resulting from a marginal design status of this type of solder joint design.
Author : Perry L. Martin
Publisher : McGraw Hill Professional
ISBN 13 : 9780070410442
Total Pages : 770 pages
Book Rating : 4.4/5 (14 download)
Download or read book Electronic Failure Analysis Handbook written by Perry L. Martin and published by McGraw Hill Professional. This book was released on 1999 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.
Author : Shilak Shakya
Publisher :
ISBN 13 :
Total Pages : 228 pages
Book Rating : 4.:/5 (342 download)
Download or read book Simplified Stress Analysis of Axisymmetric Solder Joint Under Thermal Loading written by Shilak Shakya and published by . This book was released on 1995 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 400 pages
Book Rating : 4.3/5 (243 download)
Download or read book Applied mechanics reviews written by and published by . This book was released on 1948 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Syed Ali Naved Naqvi
Publisher :
ISBN 13 :
Total Pages : 98 pages
Book Rating : 4.:/5 (238 download)
Download or read book Transient Thermal Stress Analysis of Plated Through Holes Subjected to Wave Soldering written by Syed Ali Naved Naqvi and published by . This book was released on 1990 with total page 98 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : American Society of Mechanical Engineers. Winter Annual Meeting
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (139 download)
Download or read book Solder Joint Reliability written by American Society of Mechanical Engineers. Winter Annual Meeting and published by . This book was released on 1989 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: An extensive finite element modeling and experimental testing program has been carried out to determine the most optimum design parameters for solder joints in surface mount applications. Although the analysis and testing (power cycling and thermal cycling) has been carried out for a variety of package styles, particular attention will be paid to the result for leadless ceramic chip carriers. This package is particularly useful in certain high performance military and commercial applications. Analysis and experimentation indicate that increased fatigue life under power cycling can be attained by fabricating solder joints with large fillets and low standoff heights. The large fillet geometry significantly reduces harmful stress concentrations while increasing the net cross-sectional area within the joint. Both factors tend to improve the fracture toughness of the joint. The temperature and frequency dependencies of solder joint fatigue life under power cycling testing is discussed. The observed frequency dependence can be minimized by eliminating harmful tensile strain components thus reducing harmful stress relaxation and tensile induced oxygen embrittlement of grain boundaries. Temperature cycling studies indicate joints with slightly higher standoffs and low fillet angles are more resistant to cyclic fatigue than pillar type joints which tend to focus shear strains at the interfaces. Solder joints can be tapered to improve overall reliability but, in most cases, tapering will provide only a small increase in fracture toughness of the joint through the elimination of stress concentrations. Additional fatigue life increases can be obtained only through an enlargement of the joint cross-sectional area. Aspects of the above results will be presented in detail along with design guidelines for creating high reliability solder joints for various application scenarios.
