Experimental And Mechanistic Study Of Copper Electrodeposition In The Absence And Presence Of Chloride Ions And Polyethylene Glycol

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Experimental and Mechanistic Study of Copper Electrodeposition in the Absence and Presence of Chloride Ions and Polyethylene Glycol

Author : Maria Eugenia Huerta Garrido
Publisher :
ISBN 13 : 9780494432808
Total Pages : 163 pages
Book Rating : 4.4/5 (328 download)

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Book Synopsis Experimental and Mechanistic Study of Copper Electrodeposition in the Absence and Presence of Chloride Ions and Polyethylene Glycol by : Maria Eugenia Huerta Garrido

Download or read book Experimental and Mechanistic Study of Copper Electrodeposition in the Absence and Presence of Chloride Ions and Polyethylene Glycol written by Maria Eugenia Huerta Garrido and published by . This book was released on 2007 with total page 163 pages. Available in PDF, EPUB and Kindle. Book excerpt: The trend to miniaturize electronic devices has led to the development of new fabrication processes. Copper electrodeposition has been used extensively in the fabrication of microelectronic circuits due to the excellent conducting properties of this metal. Control of the operating conditions and understanding of the mechanism of metal deposition is necessary in order to successfully produce the micron-scale features required in these new devices. The implementation of new processes and operating conditions in the fabrication of microelectronic devices has spurred a considerable amount of research into their understanding and improvement. An approach to achieve the desired electrodeposits is the incorporation of mixtures of chemical additives into the electroplating solutions. Many modeling and experimental studies have been devoted to exploring the mechanisms by which additives operate. However, details of these mechanisms are not completely understood. A part of this study focuses on the investigation of the conditions and dynamics of the adsorption and desorption of the additives chloride ions and polyethylene glycol (PEG) on copper substrates in voltammetry and multi-step voltammetry-chronoamperometry experiments. Voltammetry scans are classified into three categories according to the range of potentials where the inhibition of Cu2+ reduction in the presence of various concentrations of Cl- and PEG is observed. Each type is explained based on the results of this study and the ideas presented in the literature on how the conformation of adsorbed PEG on the substrate can change during the course of deposition. One of the techniques that is widely used to study electrochemical processes is electrochemical impedance spectroscopy (EIS). Insight into these processes gained from measured EIS data is better when it is combined with the use of a physicochemical model. However, the models typically used involve a number of simplifying assumptions, partly due to mathematical complications. One of the purposes of this study is to relax some of these assumptions such as the neglect of convection, migration and homogeneous reactions and investigate their effect by comparing the model results to experimental data. This approach is applied to Cu2+ reduction onto a rotating disk electrode in acidic additive-free solutions. Estimates of the kinetic parameters are obtained with the non-linear least squares method. A statistical analysis reveals that the model is further improved by accounting for the correlation between consecutive residuals. The experimental data are found to be poorly predicted when the parameters estimated from the full model are used in simpler models that do not include convection and/or homogeneous reactions. The model of Cu2+ reduction in additive-free solutions is extended to account for the presence of Cl- and PEG under transient conditions. The model accounts for the formation of the inhibiting film, blockage of adsorption sites on the electrode surface and displacement of the inhibiting film by depositing copper. A distinction is made between the condition when the electrode is completely covered with the inhibiting film and when it is only partially covered. Estimates of the kinetic parameters are obtained from fitting the model to electrode responses of linear potential scans obtained at various Cl- and PEG concentrations. The model is able to predict both the sudden loss of inhibition that occurs at intermediate Cl- and PEG concentrations and the more gradual increases in current at low and high additive levels. EIS spectra are also predicted and compared to measured ones.

Copper Electrodeposition for Nanofabrication of Electronics Devices

Author : Kazuo Kondo
Publisher : Springer Science & Business Media
ISBN 13 : 1461491762
Total Pages : 280 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Copper Electrodeposition for Nanofabrication of Electronics Devices by : Kazuo Kondo

Download or read book Copper Electrodeposition for Nanofabrication of Electronics Devices written by Kazuo Kondo and published by Springer Science & Business Media. This book was released on 2013-11-20 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

Distribution of Electrodeposited Copper on Patterned Substrates in the Presence of Additives

Author : Erik Gretler Lindberg
Publisher :
ISBN 13 :
Total Pages : 169 pages
Book Rating : 4.:/5 (114 download)

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Book Synopsis Distribution of Electrodeposited Copper on Patterned Substrates in the Presence of Additives by : Erik Gretler Lindberg

Download or read book Distribution of Electrodeposited Copper on Patterned Substrates in the Presence of Additives written by Erik Gretler Lindberg and published by . This book was released on 2018 with total page 169 pages. Available in PDF, EPUB and Kindle. Book excerpt: Commercial plating systems typically utilize an electrolyte containing the plated ion in combination with additive mixtures consisting of multiple organic surface active species. These additives adsorb on the plated electrode, modifying the deposit properties, texture, and distribution. While some of the mechanistic details of the additives adsorption and interactions have been characterized, the effects of convective flow and particularly of complex current waveforms remain uncharted. A specific motivation for the research reported herein, is the preferential fill, by electroplated copper, of blind and open vias in printed circuit boards that is achieved utilizing special additives in combination with the application of periodic reverse current waveform in the presence of ferric ions and complex flow. The process, which is widely utilized, has been developed empirically. Its optimization requires understanding the effects of each process parameter, its quantification, and the development of a comprehensive quantitative model. The additives utilized in this study are polyethylene glycol (PEG) which is a copper deposition inhibitor, and bis-sodiumsulfopropyl-disulfide (SPS), which is a weak accelerator. Those very same additives enable the bottom-up metallization of semiconductor interconnects; however, due to the much larger metallized features (hundreds of microns vs. few nanometers) and much longer deposition time (order of hour instead of a few seconds), the challenges facing the plating process herein, are different and, in many cases, more complex. A quantitative model describing competitive adsorption of additives and polarization effects was developed to address deficiencies in current theories. This model, invoking heterogeneous adsorption energy sites, accounts for the steady-state additives (SPS and polyethylene glycol, `PEG') coverages, subject to competitive adsorption, as a function of additives concentration in solution, and accurately predicts polarization as a function of time. An extension of this model has been applied to periodic reverse plating, explaining and quantitatively modeling the preservation of increased polarization associated with pulsing as compared to DC. This maintained polarization, which is generated by the periodic reverse current, is the key to enabling the continued bottom-up plating over time periods exceeding a few minutes. The model qualitatively explains the polarization dependence on the magnitude of the anodic pulse potential or current, and lack of dependence on the anodic pulse length. Another effect of the periodic reverse pulsed current is in enhancing the deposit thickness uniformity. This is achieved due to the preferential dissolution at the short high current anodic pulses, of any deposit asperities produced during the regular longer term deposition at the lower cathodic current densities of the pulse waveform. This effect has been quantified and modeled. The significance of the addition of ferrous/ferric ions to the process has been analyzed. The ferrous ions depolarize the dimensionally stable anodes, preventing the rapid oxidation of the sulfur-containing additive bis-sodiumsulfopropyl-disulfide (SPS). Perhaps more importantly, the ferric ions etch the plated copper through a transport limited reaction. Determining quantitatively the transport dependence of this reaction, and applying this to analyze current efficiency data obtained in a commercial plating machine which incorporates complex flow, it was possible to determine quantitatively the average transport rates prevailing in the industrial scale machine. This determination allows the use of lab-scale rotating disk electrodes (RDE) to simulate industrially relevant plating conditions. Furthermore, this transport information enabled the detailed simulation of the flow and transport rates in and around the plated vias, an essential component for quantitative modeling of the process. A computer implemented model has been used to simulate feature fill incorporating the effects of periodic pulse reverse plating, the additives induced polarization effects, and the transport dependent etching of the plated copper. The simulation results agree well with via fill plating experiments conducted in the lab, using a PCB coupon mounted on a RDE.

An Experimental Study of the Behavior of Additives (Cl-, PEG and SPS) During Acidic Copper Electrodeposition

Author : Min Tan
Publisher :
ISBN 13 :
Total Pages : 164 pages
Book Rating : 4.:/5 (57 download)

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Book Synopsis An Experimental Study of the Behavior of Additives (Cl-, PEG and SPS) During Acidic Copper Electrodeposition by : Min Tan

Download or read book An Experimental Study of the Behavior of Additives (Cl-, PEG and SPS) During Acidic Copper Electrodeposition written by Min Tan and published by . This book was released on 2004 with total page 164 pages. Available in PDF, EPUB and Kindle. Book excerpt:

A Study of the Influence of Variables on the Structure of Electrodeposited Copper

Author : Arthur Kenneth Graham
Publisher :
ISBN 13 :
Total Pages : 24 pages
Book Rating : 4.:/5 (31 download)

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Book Synopsis A Study of the Influence of Variables on the Structure of Electrodeposited Copper by : Arthur Kenneth Graham

Download or read book A Study of the Influence of Variables on the Structure of Electrodeposited Copper written by Arthur Kenneth Graham and published by . This book was released on 1927 with total page 24 pages. Available in PDF, EPUB and Kindle. Book excerpt:

An Investigation of the Mechanism Controlling the Co-deposition of Aluminas with Copper During Electrodeposition of Copper

Author : James Edward Hoffmann
Publisher :
ISBN 13 :
Total Pages : 144 pages
Book Rating : 4.:/5 (143 download)

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Book Synopsis An Investigation of the Mechanism Controlling the Co-deposition of Aluminas with Copper During Electrodeposition of Copper by : James Edward Hoffmann

Download or read book An Investigation of the Mechanism Controlling the Co-deposition of Aluminas with Copper During Electrodeposition of Copper written by James Edward Hoffmann and published by . This book was released on 1965 with total page 144 pages. Available in PDF, EPUB and Kindle. Book excerpt: Experimental work was undertaken to determine the mechanism controUing the co-deposition of aluminas with copper during electrode-position of copper. The aluminas were present in the copper plating electrolytes as an insoluble disperse phase. Three possible mechanisms for co-deposition of aluminas were studied, They were mechanical inclusion, electrophoretic deposition, and adsorption. The results of experimental studies established that mechanical inclusion was not a significant factor in the mechanism controlling co-deposition of aluminas with copper. Theoretical considerations of the compositions of the copper plating electrolytes indicated that co-deposition of aluminas by an electrophoretic mechanism was highly unlikely. The conclusions arrived at by theoretical considerations were substantiated by experimental measurements of the zeta potential of the aluminas. The alumina content of the copper electra deposits was also studied as a function of the pH of the plating bath, The results of these tests in conjunction with sedimentation studies demonstrated the absence of an isoelectric point for the aluminas over the pH range studied. The presence of thiourea in the electrolytic plating baths (a sub stance known to be adsorbed on a copper cathode during electrodeposition tion), profoundly affected the amount of alumina in the electrodepasit, however, no adsorption of thiourea on aluminas in aqueous dispersions was detected.

In Situ Studies of Copper Electrodeposition in the Presence of Organic Additives Using Atomic Force Microscopy

Author : Wolfgang Uwe Schmidt
Publisher :
ISBN 13 :
Total Pages : 610 pages
Book Rating : 4.:/5 (382 download)

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Book Synopsis In Situ Studies of Copper Electrodeposition in the Presence of Organic Additives Using Atomic Force Microscopy by : Wolfgang Uwe Schmidt

Download or read book In Situ Studies of Copper Electrodeposition in the Presence of Organic Additives Using Atomic Force Microscopy written by Wolfgang Uwe Schmidt and published by . This book was released on 1996 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the present study we investigated electrodeposition of Cu from sulfuric acid solutions. Three different substrates were used to investigate the effect of various variables on electrodeposition. In situ atomic force microscopy (AFM) in a fluid flow environment was used to follow electrodeposition of Cu on Pt(100). Imaging dimensions in a flow environment were not affected by fluid flow down to the atomic level. A lifting force was found to influence the AFM tip during imaging. Electrodeposition in a flow environment was observed to proceed through the formation of smaller and a larger number of nuclei than observed to form during electrodeposition in a stagnant solution resulting in a more uniform and smoother deposit. The initial nucleation and growth of Cu on HOPG was not affected by BTA and thiourea. After full coverage of the surface by Cu, growth proceeded uniquely for each system. (i) Electrodeposition from additive free systems was found to be well represented by diffusion limited three-dimensional nucleation and growth. (ii) BTA containing solutions were found to be well represented by a two rate nucleation model describing growth in the vertical direction as inhibited and lateral growth as charge transfer limited. (iii) Nuclei developing from thiourea containing solutions were found to be well represented by a two rate nucleation model describing vertical growth as inhibited and lateral growth as diffusion limited. Electrodeposition of Cu on Au(111) was investigated on three levels. Observation of in situ AFM images, scaling analysis of the growing surface and spectral decomposition of the autocovariance description of the surface. The three levels of analysis were found to agree in their description of Cu electrodeposition and mediating effects of the additives BTA and thiourea. Cu electrodeposition from additive free solutions was observed to be surface diffusion dominated. BTA was observed to inhibit surface diffusion of Cu adatom species on the surface and thus limited the formation of large nuclei. Cu deposits from thiourea containing solutions were observed to proceed through an initial step growth mechanism after which further development of the deposit proceeded through three dimensional nucleation and growth.

An in Situ Surface Stress Study of Electrochemical Phenomena

Author : Thomas Heaton
Publisher :
ISBN 13 :
Total Pages : 295 pages
Book Rating : 4.:/5 (814 download)

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Book Synopsis An in Situ Surface Stress Study of Electrochemical Phenomena by : Thomas Heaton

Download or read book An in Situ Surface Stress Study of Electrochemical Phenomena written by Thomas Heaton and published by . This book was released on 2011 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the last decade copper electrodeposition has become the dominant process by which microelectronic interconnects are made. Replacing ultra-high vacuum evaporative film growth, the technology known as the Cu damascene process has been widely implemented in the microelectronics industry since the early 2000s. The transition from vacuum film growth to electrodeposition was enabled by solution chemistries that provide "bottom-up" or superfilling capability of vias and trenches. While the process has been and is used widely, the actual mechanisms responsible for superfilling remain relatively unknown. This dissertation presents and discusses the background and results of experimental investigations that have been done using in situ electrochemical surface stress monitoring techniques to study the evolution of stress on Cu{111} thin film electrodes. Because of its extreme sensitivity to the structure on both the electrode and solution sides of the interface, surface stress monitoring as analytical technique is well suited for the study of electrodeposition. These ultra-high resolution stress measurements reveal the dynamic response of copper electrodes to a number of electrochemical and chemical experimental variables. In the case of constant current pulsed deposition and stripping, the surface stress evolution depends not only on the magnitude of the current pulse, but also shows a marked response to plating bath composition. The plating bath chemistries used in this work include (1) additive free, (2) deposition suppressing solutions that include polyethylene glycol (PEG) and sodium chloride (NaCl) as well as (3) full additive solution combinations which contain PEG, NaCl, and a one of two deposition accelerating species (bis-(sodiumsulfopropyl)disulfide (SPS) or mercaptopropane sulfonic acid (MPS)). The development of thin film stress is further investigated through a series of solution exchange experiments that correlate the magnitude of electrode exchange current density and the stress state of the film. Remarkably, stress changes as large as ~8.5 N/m are observed during solution exchanges at the open circuit potential. Overall, this research demonstrates that solution chemistry can have a large impact on thin film stress evolution, even for very small deposition thicknesses (e.g.

Effect of Commercial Electrowinning Additives on the Nucleation and Growth of Copper on Stainless Steel

Author : Wenyuan Cui
Publisher :
ISBN 13 :
Total Pages : 71 pages
Book Rating : 4.:/5 (894 download)

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Book Synopsis Effect of Commercial Electrowinning Additives on the Nucleation and Growth of Copper on Stainless Steel by : Wenyuan Cui

Download or read book Effect of Commercial Electrowinning Additives on the Nucleation and Growth of Copper on Stainless Steel written by Wenyuan Cui and published by . This book was released on 2014 with total page 71 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This thesis is to understand and compare the effects and interactions of modified polysaccharide (HydroStar), polyacrylamide (Cyquest N-900) and chloride ion on copper electrowinning. A study of the nucleation and growth was conducted in a synthetic electrolyte (40 g/L Cu, 160 g/L H2SO4, 20 mg/L Cl- ) with the addition of HydroStar or Cyquest N-900 using potential step measurements. The current responses generated were compared to theoretical models of nucleation and growth mechanisms. The nucleation and growth mechanism changed as function of potential and the presence of organic additives. The nucleation and growth mechanisms were confirmed using scanning electron microscopy (SEM). At low overpotentials, electrodeposition from the electrolyte without additives proceeded by progressive nucleation with three-dimensional (3-D) growth. The addition of HydroStar produced smaller nuclei and changed the mechanism to progressive nucleation and 2-D growth. Cyquest N-900 used there appeared to be progressive nucleation with 2-D growth and polarize the cathodes. In addition, instantaneous nucleation under diffusion control occurred at high overpotentials. Chloride ion and its interaction with HydroStar and Cyquest N-900 were further characterized by cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS). The trends observed from Nyquist plots and equivalent circuit models were consistent with the CV results. Chloride, on its own, depolarized copper electrodeposition, while chloride ion associated with Cyquest N-900 inhibited the reaction. It is proposed that Cl- acted as a bridging ligand between copper and Cyquest N-900. The addition of HydroStar depolarized copper deposition, but it did not interact with"--Abstract, page iv.

Advanced Electrochemical Characterization of Copper Deposition

Author : Mary Elizabeth Wagner (S.B.)
Publisher :
ISBN 13 :
Total Pages : 55 pages
Book Rating : 4.:/5 (994 download)

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Book Synopsis Advanced Electrochemical Characterization of Copper Deposition by : Mary Elizabeth Wagner (S.B.)

Download or read book Advanced Electrochemical Characterization of Copper Deposition written by Mary Elizabeth Wagner (S.B.) and published by . This book was released on 2016 with total page 55 pages. Available in PDF, EPUB and Kindle. Book excerpt: The electrodeposition of copper metal in a concentrated sulfuric acid solution is reported to occur through a four-step mechanism: (I) the dehydration of Cu2+ (H2O)6, (II) the reduction of Cu2+ to cu+, (III) the dehydration cu+ (H2O)6-x, (IV) the reduction of Cu+ to copper metal. The dehydration steps have been found to be responsible for the pH-dependence of the electrodeposition reaction. It is also reported, although not well understood, that the presence of Fe2+ ions affects the reaction kinetics. In this work, the kinetics of copper electrodeposition were studied using alternating current cyclic voltammetry. The reaction was studied at a copper rotating disk electrode with varying concentrations of Cu2+ and Fe2+ . At sufficiently low pH, and a sufficiently high concentration of Fe2+ , the deposition kinetics may be slowed enough to separately observe the two electron transfer steps involved in copper reduction. It was found that Fe2+ ions affect the electrodeposition kinetic by slowing down reaction kinetics, particularly the second electron transfer reaction.

Mass Transport Enhancement in Copper Electrodeposition Due to Gas Co-evolution

Author : Omar Israel Gonzalez-Pena
Publisher :
ISBN 13 :
Total Pages : 185 pages
Book Rating : 4.:/5 (93 download)

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Book Synopsis Mass Transport Enhancement in Copper Electrodeposition Due to Gas Co-evolution by : Omar Israel Gonzalez-Pena

Download or read book Mass Transport Enhancement in Copper Electrodeposition Due to Gas Co-evolution written by Omar Israel Gonzalez-Pena and published by . This book was released on 2015 with total page 185 pages. Available in PDF, EPUB and Kindle. Book excerpt: Metal electrodeposition is often associated with simultaneous hydrogen co-evolution. The presence of bubbles complicates the design and control of electrodeposition processes. This is particularly relevant to the electrodeposition from aqueous electrolytes of numerous metals with standard potentials that are negative to hydrogen. As shown in this study, hydrogen co-evolution enhances the transport rates of the metal deposition reaction beyond those predicted by the classical, steady-state mass transport model. Available models addressing transport in the presence of gas co-evolution are based on free convection that is enhanced by the rising bubble cloud. However, there are no models that address mass transfer enhancement by bubbles under forced convection, such as analyzed here for the commonly used, facing-down rotating disk electrode (RDE). This study characterizes experimentally the phenomenon and introduces a model for quantifying it. Experimental data was collected in plating copper at high cathodic overpotentials (-0.4 to -1.0V vs SHE) from acidified copper sulfate on a RDE. The transport enhancement (~2-6 fold) was determined by measuring the copper deposition by gravimetry. Pulse experiments, where the current decay was measured following a short bubble generation confirmed the linkage between the current enhancement and the presence of bubbles. A model based on fresh electrolyte replenishing the volume vacated by the translating bubbles and thus subjecting regions of the electrode to enhanced transient currents has been derived. The model correlates the experimental data indicating higher transport enhancement with increasing cathodic polarization and dependence of the enhancement on the rotation rate and on the bulk copper concentration.

Electrodeposition of Copper Using Additive-containing Low Metal Ion Concentration Electrolytes for EnFACE Applications

Author : Eden May B. Dela Pena
Publisher :
ISBN 13 :
Total Pages : 0 pages
Book Rating : 4.:/5 (141 download)

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Book Synopsis Electrodeposition of Copper Using Additive-containing Low Metal Ion Concentration Electrolytes for EnFACE Applications by : Eden May B. Dela Pena

Download or read book Electrodeposition of Copper Using Additive-containing Low Metal Ion Concentration Electrolytes for EnFACE Applications written by Eden May B. Dela Pena and published by . This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decade a new electrodeposition process called Electrochemical nano and micro Fabrication by flow and Chemistry (EnFACE) was developed which enabled mask-less pattern transfers onto a metallic substrate. EnFACE uses a novel acid-free, additive-free plating electrolyte containing low concentrations of metal salts (0.1 MCuSO4), as the process requires electroplating under conditions of fast kinetics and low electrolyte conductivity. However, for electronic applications,industry requires the use of additives, which improve deposit properties such as thickness uniformity, strength, ductility, and conductivity. The use of pulsed current is also known to improve deposit properties such as grain structure, mechanical strength and throwing power. Therefore, in order to use EnFACE for fabrication of industrially useful products, the effect of additives on the electrochemical behaviour and deposit properties of this process needs to be assessed. In addition, the influence of current modulation; i.e. direct current vs pulsed current, on deposit properties also warrants investigation. Potentiodynamic polarisation experiments were performed on additive-free and additive-containing EnFACE electrolyte (0.1 M CuSO4). The additives tested were Copper Gleam A, Copper Gleam B, and chloride ions (Cl−). The effect of two parameters: (i) additive type and (ii) additive concentration, on cathode polarisation were studied.Copper films were electroplated on stainless steel substrates from electrolytes containing different concentrations of plating additives (0%, 17%, 33%, 50%, 100%,200% of the industry recommended additive concentration). Both direct current (DC)ABSTRACT|ii and pulsed current (PC) plating were used. The deposit was characterised using scanning electron microscope (SEM), electron back scattered diffraction (EBSD),tensile test machine (UTM), four-point probe and X-ray diffraction (XRD).Cathode polarisation occurred when the additives were used individually. Thecombination of Copper Gleam B and Cl- suggested synergistic inhibition, particularly in the diffusion-limited region. The addition of Copper Gleam A to the CopperGleam B-Cl− mix increased the limiting current and suggested plating acceleration.These effects are interpreted in terms of the adsorption-desorption behavior of the additives on the cathode surface. SEM and EBSD images indicated that additives caused a concentration dependent decrease in the grain size of the deposit in both the DC and PC plated deposit. This grain refinement resulted in an increase in yield and tensile strength,but reduced the ductility and resistivity of deposits. The PC-plated copper from theEnFACE electrolytes generally possessed better mechanical properties than its DC-plated counterparts, though both plating modes created copper films that can meet industry standards. The optimum additive concentration for the EnFACE electrolyte was 50% of the recommended value when using DC plating; while the optimum was only 33% when using PC plating.

Electrochemistry of Metal Complexes

Author : Arvydas Survila
Publisher : John Wiley & Sons
ISBN 13 : 352769126X
Total Pages : 304 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Electrochemistry of Metal Complexes by : Arvydas Survila

Download or read book Electrochemistry of Metal Complexes written by Arvydas Survila and published by John Wiley & Sons. This book was released on 2015-04-13 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: A systematic analysis of electrochemical processes involving metal complexes. Starting with general considerations on equilibria in solutions and at interfaces as well as on mass transport, the text acquaints readers with the theory and common experimental practice for studying electrochemical reactions of metals complexes. The core part of the book deals with all important aspects of electroplating, including a systematic discussion of co-deposition of metals and formation of alloys. It also discusses such related subjects as oxide layer formation and hydrogen evolution as a side reaction.

Modern Surface Engineering Treatments

Author : Mahmood Aliofkhazraei
Publisher : BoD – Books on Demand
ISBN 13 : 9535111493
Total Pages : 242 pages
Book Rating : 4.5/5 (351 download)

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Book Synopsis Modern Surface Engineering Treatments by : Mahmood Aliofkhazraei

Download or read book Modern Surface Engineering Treatments written by Mahmood Aliofkhazraei and published by BoD – Books on Demand. This book was released on 2013-05-22 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface engineering can be defined as an enabling technology used in a wide range of industrial activities. Surface engineering was founded by detecting surface features which destroy most of pieces, e.g. abrasion, corrosion, fatigue, and disruption; then it was recognized, more than ever, that most technological advancements are constrained with surface requirements. In a wide range of industry (such as gas and oil exploitation, mining, and manufacturing), the surfaces generate an important problem in technological advancement. Passing time shows us new interesting methods in surface engineering. These methods usually apply to enhance the surface properties, e.g. wear rate, fatigue, abrasion, and corrosion resistance. This book collects some of new methods in surface engineering.

Copper and Bronze in Art

Author : David A. Scott
Publisher : Getty Publications
ISBN 13 : 9780892366385
Total Pages : 536 pages
Book Rating : 4.3/5 (663 download)

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Book Synopsis Copper and Bronze in Art by : David A. Scott

Download or read book Copper and Bronze in Art written by David A. Scott and published by Getty Publications. This book was released on 2002 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a review of 190 years of literature on copper and its alloys. It integrates information on pigments, corrosion and minerals, and discusses environmental conditions, conservation methods, ancient and historical technologies.

Electrodeposition from Ionic Liquids

Author : Frank Endres
Publisher : John Wiley & Sons
ISBN 13 : 3527622926
Total Pages : 410 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Electrodeposition from Ionic Liquids by : Frank Endres

Download or read book Electrodeposition from Ionic Liquids written by Frank Endres and published by John Wiley & Sons. This book was released on 2008-09-08 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reflecting the dramatic rise in interest shown in this field over the last few years, this book collates the widespread knowledge into one handy volume. It covers in depth all classes of ionic liquids thus far in existence, with the individual chapters written by internationally recognized experts. The text is written to suit several levels of difficulty, containing information on basic physical chemistry in ionic liquids, a theory on the conductivity as well as plating protocols suited to undergraduate courses. The whole is rounded off with an appendix providing experimental procedures to enable readers to experiment with ionic liquids for themselves.

Electrodeposition of Alloys

Author : Abner Brenner
Publisher : Elsevier
ISBN 13 : 1483223116
Total Pages : 735 pages
Book Rating : 4.4/5 (832 download)

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Book Synopsis Electrodeposition of Alloys by : Abner Brenner

Download or read book Electrodeposition of Alloys written by Abner Brenner and published by Elsevier. This book was released on 2013-10-22 with total page 735 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrodeposition of Alloys: Principles and Practice, Volume I covers the general and theoretical aspects of the electrodeposition of alloy containing silver and/or copper. This book is organized into three parts encompassing 21 chapters. The first part considers first the history of electrodeposition, the applications of electrodeposited alloys, and the practical considerations involved in electrodeposition. This part also deals with the effect of operating variables on composition of electrodeposited alloys, and the physico-chemical properties of the alloy. The second part focuses on the theoretical aspects of alloy electrodeposition. This part includes discussions on the role of cathode diffusion layer, the effects of complexing agents, and the concept of alloy plating. The third part discusses the practical aspects of the electrodeposition of alloys, focusing primarily on the electrodeposition of alloys from aqueous solutions. This part examines first brass and bronze plating, followed by the electrodeposition of copper-tin, silver, and iron containing alloys. This book is directed toward electrochemists and researchers.