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Electronic Packaging Materials Science X Volume 515
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Book Synopsis Electronic Packaging Materials Science X: Volume 515 by : Daniel J. Belton
Download or read book Electronic Packaging Materials Science X: Volume 515 written by Daniel J. Belton and published by . This book was released on 1998-10 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR
Book Synopsis Electronic Packaging Materials Science by :
Download or read book Electronic Packaging Materials Science written by and published by . This book was released on 1998 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Molecular Modeling and Multiscaling Issues for Electronic Material Applications by : Artur Wymyslowski
Download or read book Molecular Modeling and Multiscaling Issues for Electronic Material Applications written by Artur Wymyslowski and published by Springer. This book was released on 2014-11-20 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.
Book Synopsis Composite Materials by : Deborah D.L. Chung
Download or read book Composite Materials written by Deborah D.L. Chung and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal management, smart structures and other timely technologies rarely covered in existing books on composites. It also treats materials with polymer, metal, cement, carbon and ceramics matrices, contrasting with others that emphasise polymer-matrix composites. This functional approach will be useful to both practitioners and students. A good selection of example problems, solutions and figures, together with a new and vibrant approach, provides a valuable reference source for all engineers working with composite materials.
Download or read book Ferroelectric Thin Films written by and published by . This book was released on 1999 with total page 802 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Microcrystalline and Nanocrystalline Semiconductors by :
Download or read book Microcrystalline and Nanocrystalline Semiconductors written by and published by . This book was released on 1999 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Quasicrystals written by and published by . This book was released on 1998 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book GaN and Related Alloys written by and published by . This book was released on 1999 with total page 1074 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Hydrogen in Semiconductors and Metals by : Norbert H. Nickel
Download or read book Hydrogen in Semiconductors and Metals written by Norbert H. Nickel and published by . This book was released on 1998 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Nanostructured Powders and Their Industrial Applications by : Gregory Beaucage
Download or read book Nanostructured Powders and Their Industrial Applications written by Gregory Beaucage and published by . This book was released on 1998 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: Industrial and academic researchers describe their experience with synthesizing and using such powders as fumed silica, pyrolytic titania, precipitated silica, and less conventional species such as exfoliated clays. Of the 38 papers, the first four provide an overview and the rest focus on physical aspects, synthesis, and applications. Topics of invited papers include drying nano-size materials, synthesis by a room-temperature aerosol process, and gel mineralization as a model for bone formation. Annotation copyrighted by Book News, Inc., Portland, OR
Download or read book Solid State Ionics written by and published by . This book was released on 1999 with total page 752 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis High-Temperature Ordered Intermetallic Alloys VIII: Volume 552 by : Easo P. George
Download or read book High-Temperature Ordered Intermetallic Alloys VIII: Volume 552 written by Easo P. George and published by . This book was released on 1999-07-19 with total page 864 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Fundamental Aspects of Electrochemical Deposition and Dissolution by : M. Matlosz
Download or read book Fundamental Aspects of Electrochemical Deposition and Dissolution written by M. Matlosz and published by The Electrochemical Society. This book was released on 2000 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Composite Materials for Electronic Functions by : Deborah D. L. Chung
Download or read book Composite Materials for Electronic Functions written by Deborah D. L. Chung and published by . This book was released on 2000 with total page 100 pages. Available in PDF, EPUB and Kindle. Book excerpt: Composite materials are traditionally designed for the mechanical properties, due to their structural applications. However, composite materials are increasingly used in non-structural applications, such as electronic packaging and thermal management. Moreover, structual composite materials that are multifunctional are increasingly needed, due to the demand of smart structures and the importance of weight saving. As a consequence, structural materials that can provide electronic functions are needed. Thus, electronic functions are desirable for boht non-structural and structural composite materials.
Book Synopsis Lead-Free Solder Interconnect Reliability by : Dongkai Shangguan
Download or read book Lead-Free Solder Interconnect Reliability written by Dongkai Shangguan and published by ASM International. This book was released on 2005 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis The International Journal of Microcircuits and Electronic Packaging by :
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 1998 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Silicon Front-end Technology--materials Processing and Modelling by : Nicholas E. B. Cowern
Download or read book Silicon Front-end Technology--materials Processing and Modelling written by Nicholas E. B. Cowern and published by . This book was released on 1998 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt:
