Electrical Conductive Adhesives with Nanotechnologies

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Author :
Publisher : Springer Science & Business Media
ISBN 13 : 0387887830
Total Pages : 445 pages
Book Rating : 4.3/5 (878 download)

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Book Synopsis Electrical Conductive Adhesives with Nanotechnologies by : Yi (Grace) Li

Download or read book Electrical Conductive Adhesives with Nanotechnologies written by Yi (Grace) Li and published by Springer Science & Business Media. This book was released on 2009-10-08 with total page 445 pages. Available in PDF, EPUB and Kindle. Book excerpt: “Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Electrically Conductive Adhesives

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Author :
Publisher : BRILL
ISBN 13 : 9004165924
Total Pages : 434 pages
Book Rating : 4.0/5 (41 download)

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Book Synopsis Electrically Conductive Adhesives by : Rajesh Gomatam

Download or read book Electrically Conductive Adhesives written by Rajesh Gomatam and published by BRILL. This book was released on 2008-12-23 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).

High-performance Polymers: Conductive adhesives

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Author :
Publisher : Institut Francais Du Petrole P
ISBN 13 : 9782710807162
Total Pages : 0 pages
Book Rating : 4.8/5 (71 download)

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Book Synopsis High-performance Polymers: Conductive adhesives by : Guy Rabilloud

Download or read book High-performance Polymers: Conductive adhesives written by Guy Rabilloud and published by Institut Francais Du Petrole P. This book was released on 1997 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Please, please don't order this book from State Mutual Book and Periodical Service which lists it in Books in Print for a whopping $680. Editions Technip, a French publisher, has no designated US distributor, and no protection against such skullduggery. The volume reviews the present status of electrically conductive and thermally conductive adhesive technology, primarily for the well established die attach market, but also for the anisotropic adhesive films used to interconnect electronic drivers to liquid crystal display panels, and adhesives which are currently tested to replace soft solders in surface mount technology. Coverage includes applications, market survey, and standards; electrical and thermal conductivities; fillers and resins; properties of uncured and of cured adhesives; thermally-induced stresses; reliability concerns; and current developments. Annotation copyrighted by Book News, Inc., Portland, OR

Electrical, Thermomechanical and Reliability Modeling of Electrically Conductive Adhesives

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Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (71 download)

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Book Synopsis Electrical, Thermomechanical and Reliability Modeling of Electrically Conductive Adhesives by : Bin Su

Download or read book Electrical, Thermomechanical and Reliability Modeling of Electrically Conductive Adhesives written by Bin Su and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The first part of the dissertation focuses on understanding and modeling the conduction mechanism of conductive adhesives. The contact resistance is measured between silver rods with different coating materials, and the relationship between tunnel resistivity and contact pressure is obtained based on the experimental results. Three dimensional microstructure models and resistor networks are built to simulate electrical conduction in conductive adhesives. The bulk resistivity of conductive adhesives is calculated from the computer-simulated model. The effects of the geometric properties of filler particles, such as size, shape and distribution, on electrical conductivity are studied by the method of factorial design. The second part of the dissertation evaluates the reliability and investigates the failure mechanism of conductive adhesives subjected to fatigue loading, moisture conditioning and drop impacts. In fatigue tests it is found that electrical conduction failure occurs prior to mechanical failure. The experimental data show that electrical fatigue life can be described well by the power law equation. The electrical failure of conductive adhesives in fatigue is due to the impaired epoxy-silver interfacial adhesion. Moisture uptake in conductive adhesives is measured after moisture conditioning and moisture recovery. The fatigue life of conductive adhesives is significantly shortened after moisture conditioning and moisture recovery. The moisture accelerates the debonding of silver flakes from epoxy resin, which results in a reduced fatigue life. Drop tests are performed on test vehicles with conductive adhesive joints. The electrical conduction failure happens at the same time as joint breakage. The drop failure life is found to be correlated with the strain energy caused by the drop impact, and a power law life model is proposed for drop tests. The fracture is found to be interfacial between the conductive adhesive joints and components/substrates. This research provides a comprehensive understanding of the conduction mechanism of conductive adhesives. The computer-simulated modeling approach presents a useful design tool for the conductive adhesive industry. The reliability tests and proposed failure mechanisms are helpful to prevent failure of conductive adhesives in electronic packages. Moreover, the fatigue and impact life models provide tools in product design and failure prediction of conductive adhesives.

Advanced Adhesives in Electronics

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Author :
Publisher : Elsevier
ISBN 13 : 0857092898
Total Pages : 279 pages
Book Rating : 4.8/5 (57 download)

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Book Synopsis Advanced Adhesives in Electronics by : M O Alam

Download or read book Advanced Adhesives in Electronics written by M O Alam and published by Elsevier. This book was released on 2011-05-25 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Adhesives Technology for Electronic Applications

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Author :
Publisher : William Andrew
ISBN 13 : 1437778909
Total Pages : 415 pages
Book Rating : 4.4/5 (377 download)

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Book Synopsis Adhesives Technology for Electronic Applications by : James J. Licari

Download or read book Adhesives Technology for Electronic Applications written by James J. Licari and published by William Andrew. This book was released on 2011-06-24 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: Approx.512 pages Approx.512 pages

Evaluation of Hybrid Electrically Conductive Adhesives

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Publisher :
ISBN 13 :
Total Pages : 112 pages
Book Rating : 4.:/5 (988 download)

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Book Synopsis Evaluation of Hybrid Electrically Conductive Adhesives by : Ephraim Trinidad

Download or read book Evaluation of Hybrid Electrically Conductive Adhesives written by Ephraim Trinidad and published by . This book was released on 2016 with total page 112 pages. Available in PDF, EPUB and Kindle. Book excerpt: An electrically conductive adhesive (ECA) is a composite material acting as a conductive paste, which consists of a thermoset loaded with conductive fillers (typically silver (Ag)). Many works that focus on this line of research were successful at making strides to improve its main weakness of low electrical conductivity. Most research focused on developing better silver fillers and co-fillers, or utilizing conductive polymers to improve its electrical conductivity, however, most of these works are carried out on small scale. In this work, we aim to produce larger quantities of hybrid ECA to successfully test its properties. Industry is interested in materials with superior physical properties. As such, rheological behavior and mechanical strength were explored as it has been theoretically hinted that incorporation of exfoliated graphene within the composite could impact those factors listed in a positive manner. In the first step of this project, pre-treated sodium dodecyl sulfate (SDS)-decorated graphene's rheological properties were examined. An epoxy resin diglycidylether of bisphenol-A (DGEBA) was the main polymer used for this study: a well-known material that can behave either as a shear-thinning or shear-thickening material depending on the supplier. We showed how composites that contain graphene (Gr) had higher viscosities than ones that contained SDS decorated graphene Gr(s). Not only did we confirm that surfactant was a key factor in the decrease of viscosity, but we also report how Gr and Gr(s) had a special effect that suppresses the intrinsic shear thickening behavior of epoxy resin at weight concentrations (wt%) higher than 0.5 wt%. The results showed that Gr(s) is not only beneficial in terms of improving the conductivity of conventional ECAs, but it also acts as a solid lubricant that decreases the viscosity of the composite paste at higher weight concentrations. In the second step of the project, pre-treated SDS decorated graphene's mechanical properties were examined. In specific, its lap-shear strength (LSS) as well as the effect of residual solvent when present in our hybrid ECA system were studied in order to follow up on the thermal results obtained from a previous study. We showed that our initial suspicion was correct as the LSS did decrease for all of the solvent-assisted formulations that contained Gr(s) ranging from 66 to 84%, however, we were not able to tell whether or not that decrease was caused by lower crosslinking density. Instead, we uncovered another reason for this decrease: bubble formation during the curing step. This suspicion was confirmed qualitatively through light microscopy and quantitatively through optical profilometry, where we present an increase in surface roughness for the solvent-assisted samples. Furthermore, by using SEM, we also confirmed that this bubble formation extends throughout the entire bulk material rather than just at the interface. Lastly, we investigated whether the use of solvent to assist in the mixing process significantly improves the electrical conductivity at a lower weight loading of Ag, and compared the electrical conductivity with that of the products prepared under the same higher weight loading of Ag using a solvent-free mixing method from previous work. Thirdly, we investigated another mechanical property of our hybrid ECAs through indentation tests, where we use Hertizan equations to characterize elastic modulus. Since we learned that the addition of Ag flakes is detrimental to the mechanical strength, we focused on the difference between the elastic moduli for Gr and Gr(s) in a solvent-free environment. In the last step of this project, we explored the use of a liquid-suspended co-filler (instead of carbon filler-based materials) in Poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS): a conductive polymer that is frequently in conductive thin-films. We report that by using PEDOT:PSS as a conductive co-filler into the conventional ECA with 60 wt% of Ag, we observed higher conductivity equivalent to adding an extra 20 wt% of Ag into the system. Furthermore, we report that an increase of PEDOT:PSS in the composite appears to decrease the LSS of the material by 20%.

Advanced Flip Chip Packaging

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Publisher : Springer Science & Business Media
ISBN 13 : 1441957685
Total Pages : 562 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong

Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Study of Electrically Conductive Adhesives for Composite Systems

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Publisher :
ISBN 13 :
Total Pages : 238 pages
Book Rating : 4.:/5 (234 download)

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Book Synopsis Study of Electrically Conductive Adhesives for Composite Systems by : Hsie-Keng Liaw

Download or read book Study of Electrically Conductive Adhesives for Composite Systems written by Hsie-Keng Liaw and published by . This book was released on 1990 with total page 238 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Fundamental Understanding of Electrically Conductive Adhesives (ECA's)

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Publisher :
ISBN 13 :
Total Pages : 446 pages
Book Rating : 4.:/5 (45 download)

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Book Synopsis Fundamental Understanding of Electrically Conductive Adhesives (ECA's) by : Daoqiang Lu

Download or read book Fundamental Understanding of Electrically Conductive Adhesives (ECA's) written by Daoqiang Lu and published by . This book was released on 2000 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Nano-Bio- Electronic, Photonic and MEMS Packaging

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Publisher : Springer Science & Business Media
ISBN 13 : 1441900403
Total Pages : 761 pages
Book Rating : 4.4/5 (419 download)

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Book Synopsis Nano-Bio- Electronic, Photonic and MEMS Packaging by : C.P. Wong

Download or read book Nano-Bio- Electronic, Photonic and MEMS Packaging written by C.P. Wong and published by Springer Science & Business Media. This book was released on 2009-12-23 with total page 761 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.

Electrically Conductive Adhesives for SMT

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Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (464 download)

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Book Synopsis Electrically Conductive Adhesives for SMT by : H. L. Hvims

Download or read book Electrically Conductive Adhesives for SMT written by H. L. Hvims and published by . This book was released on 1993 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Adhesive Bonding

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Publisher : John Wiley & Sons
ISBN 13 : 3527318984
Total Pages : 433 pages
Book Rating : 4.5/5 (273 download)

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Book Synopsis Adhesive Bonding by : Walter Brockmann

Download or read book Adhesive Bonding written by Walter Brockmann and published by John Wiley & Sons. This book was released on 2009-01-07 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both solid knowledge of the basics as well as expert knowledge is needed to create rigid, long-lasting and material-specific adhesions in the industrial or trade sectors. Information that is extremely difficult and time-consuming to find in the current literature. Written by specialists in various disciplines from both academia and industry, this handbook is the very first to provide such comprehensive knowledge in a compact and well-structured form. Alongside such traditional fields as the properties, chemistry and characteristic behavior of adhesives and adhesive joints, it also treats in detail current practical questions and the manifold applications for adhesives.

Conductive Adhesives for Electronics Packaging

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Publisher :
ISBN 13 : 9780901150370
Total Pages : 432 pages
Book Rating : 4.1/5 (53 download)

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Book Synopsis Conductive Adhesives for Electronics Packaging by : Johan Liu

Download or read book Conductive Adhesives for Electronics Packaging written by Johan Liu and published by . This book was released on 1999 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials

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Author :
Publisher : McGraw Hill Professional
ISBN 13 : 9780071386241
Total Pages : 718 pages
Book Rating : 4.3/5 (862 download)

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Book Synopsis Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials by : John Lau

Download or read book Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials written by John Lau and published by McGraw Hill Professional. This book was released on 2002-08-23 with total page 718 pages. Available in PDF, EPUB and Kindle. Book excerpt: An engineer's guidebook demonstrating non-toxic electronics manufacturing processes

Elecrically Conductive Adhesive Contacts Characterised by the 1/f Noise Behaviour

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Publisher :
ISBN 13 : 9783897223431
Total Pages : 189 pages
Book Rating : 4.2/5 (234 download)

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Book Synopsis Elecrically Conductive Adhesive Contacts Characterised by the 1/f Noise Behaviour by : Ulrich Behner

Download or read book Elecrically Conductive Adhesive Contacts Characterised by the 1/f Noise Behaviour written by Ulrich Behner and published by . This book was released on 2000-02-15 with total page 189 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Adhesives, Sealants and Coatings for the Electronics Industry

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Author :
Publisher : William Andrew
ISBN 13 :
Total Pages : 1038 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Adhesives, Sealants and Coatings for the Electronics Industry by : Ernest W. Flick

Download or read book Adhesives, Sealants and Coatings for the Electronics Industry written by Ernest W. Flick and published by William Andrew. This book was released on 1992-12-31 with total page 1038 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second edition of this industrial guide contains descriptions of some 2,500 adhesive, sealants, and coatings, based on information provided by manufacturers and distributors of these products. The volume is divided into 11 sections based on end use: adhesives--general; adhesives--cyanocrylate; adhesives--epoxy; caulks and sealants; coatings; conductive compounds; encapsulating, potting, casting, impregnating compounds; films and tapes; insulating products; silicones; and miscellaneous. Each product lists, as available, company name and product category; tradename and product number; and product description/specification. Typical end uses may also be included. Includes a list of suppliers' addresses. Annotation copyrighted by Book News, Inc., Portland, OR