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Author :
Publisher :
ISBN 13 :
Total Pages : 52 pages
Book Rating : 4.:/5 (717 download)
Download or read book Developments in Electronic and Photonic Packaging Research and Manufacturing written by and published by . This book was released on 2005 with total page 52 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Y.C. Lee
Publisher : Springer Science & Business Media
ISBN 13 : 1461558034
Total Pages : 270 pages
Book Rating : 4.4/5 (615 download)
Download or read book Manufacturing Challenges in Electronic Packaging written by Y.C. Lee and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 270 pages. Available in PDF, EPUB and Kindle. Book excerpt: About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Author : Gerald Gerlach
Publisher : Springer Science & Business Media
ISBN 13 : 3642285228
Total Pages : 619 pages
Book Rating : 4.6/5 (422 download)
Download or read book Bio and Nano Packaging Techniques for Electron Devices written by Gerald Gerlach and published by Springer Science & Business Media. This book was released on 2012-07-16 with total page 619 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers.
Author : Beth Keser
Publisher : John Wiley & Sons
ISBN 13 : 1119313988
Total Pages : 579 pages
Book Rating : 4.1/5 (193 download)
Download or read book Advances in Embedded and Fan-Out Wafer Level Packaging Technologies written by Beth Keser and published by John Wiley & Sons. This book was released on 2019-02-20 with total page 579 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author : R.R. Tummala
Publisher : Springer
ISBN 13 : 9789048150854
Total Pages : 0 pages
Book Rating : 4.1/5 (58 download)
Download or read book Electronic Packaging for High Reliability, Low Cost Electronics written by R.R. Tummala and published by Springer. This book was released on 2010-12-03 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
Author : National Research Council
Publisher : National Academies Press
ISBN 13 : 0309263778
Total Pages : 280 pages
Book Rating : 4.3/5 (92 download)
Download or read book Optics and Photonics written by National Research Council and published by National Academies Press. This book was released on 2013-03-19 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optics and photonics technologies are ubiquitous: they are responsible for the displays on smart phones and computing devices, optical fiber that carries the information in the internet, advanced precision manufacturing, enhanced defense capabilities, and a plethora of medical diagnostics tools. The opportunities arising from optics and photonics offer the potential for even greater societal impact in the next few decades, including solar power generation and new efficient lighting that could transform the nation's energy landscape and new optical capabilities that will be essential to support the continued exponential growth of the Internet. As described in the National Research Council report Optics and Photonics: Essential Technologies for our Nation, it is critical for the United States to take advantage of these emerging optical technologies for creating new industries and generating job growth. The report assesses the current state of optical science and engineering in the United States and abroad-including market trends, workforce needs, and the impact of photonics on the national economy. It identifies the technological opportunities that have arisen from recent advances in, and applications of, optical science and engineering. The report also calls for improved management of U.S. public and private research and development resources, emphasizing the need for public policy that encourages adoption of a portfolio approach to investing in the wide and diverse opportunities now available within photonics. Optics and Photonics: Essential Technologies for our Nation is a useful overview not only for policymakers, such as decision-makers at relevant Federal agencies on the current state of optics and photonics research and applications but also for individuals seeking a broad understanding of the fields of optics and photonics in many arenas.
Author : Hengyun Zhang
Publisher : Woodhead Publishing
ISBN 13 : 0081025335
Total Pages : 436 pages
Book Rating : 4.0/5 (81 download)
Download or read book Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore written by Hengyun Zhang and published by Woodhead Publishing. This book was released on 2019-11-14 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging
Author : United States. Congress. House. Committee on Energy and Commerce. Subcommittee on Energy and Power
Publisher :
ISBN 13 :
Total Pages : 236 pages
Book Rating : 4.3/5 (121 download)
Download or read book DOE's Multiprogram Restructuring written by United States. Congress. House. Committee on Energy and Commerce. Subcommittee on Energy and Power and published by . This book was released on 1994 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Daniel Lu
Publisher : Springer
ISBN 13 : 3319450980
Total Pages : 974 pages
Book Rating : 4.3/5 (194 download)
Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : Charles Ume
Publisher :
ISBN 13 :
Total Pages : 322 pages
Book Rating : 4.3/5 (91 download)
Download or read book Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products written by Charles Ume and published by . This book was released on 2001 with total page 322 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 :
Total Pages : 680 pages
Book Rating : 4.3/5 (91 download)
Download or read book Electronics Manufacturing written by John H. Lau and published by McGraw Hill Professional. This book was released on 2003 with total page 680 pages. Available in PDF, EPUB and Kindle. Book excerpt: An engineer's guidebook demonstrating non-toxic electronics manufacturing processes
Author : Y C Lee
Publisher :
ISBN 13 : 9781461558040
Total Pages : 276 pages
Book Rating : 4.5/5 (58 download)
Download or read book Manufacturing Challenges in Electronic Packaging written by Y C Lee and published by . This book was released on 1997-12-31 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
Author : United States. Congress. House. Committee on Appropriations. Subcommittee on VA, HUD, and Independent Agencies
Publisher :
ISBN 13 :
Total Pages : 624 pages
Book Rating : 4.:/5 ( download)
Download or read book Departments of Veterans Affairs and Housing and Urban Development, and Independent Agencies Appropriations for 1993: National Science Foundation, Office of Science and Technology Policy written by United States. Congress. House. Committee on Appropriations. Subcommittee on VA, HUD, and Independent Agencies and published by . This book was released on 1992 with total page 624 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Lawrence L. Rosine
Publisher : Springer
ISBN 13 : 1489973079
Total Pages : 303 pages
Book Rating : 4.4/5 (899 download)
Download or read book Advances in Electronic Circuit Packaging written by Lawrence L. Rosine and published by Springer. This book was released on 2013-12-01 with total page 303 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : United States. Congress. House. Committee on Appropriations. Subcommittee on VA, HUD, and Independent Agencies
Publisher :
ISBN 13 :
Total Pages : 1506 pages
Book Rating : 4.F/5 ( download)
Download or read book Departments of Veterans Affairs and Housing and Urban Development, and Independent Agencies Appropriations for 1993 written by United States. Congress. House. Committee on Appropriations. Subcommittee on VA, HUD, and Independent Agencies and published by . This book was released on 1992 with total page 1506 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 484 pages
Book Rating : 4.:/5 (318 download)
Download or read book Journal of Electronic Packaging written by and published by . This book was released on 2003 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : National Research Council
Publisher : National Academies Press
ISBN 13 : 0309087007
Total Pages : 660 pages
Book Rating : 4.3/5 (9 download)
Download or read book Materials Research to Meet 21st-Century Defense Needs written by National Research Council and published by National Academies Press. This book was released on 2003-03-25 with total page 660 pages. Available in PDF, EPUB and Kindle. Book excerpt: In order to achieve the revolutionary new defense capabilities offered by materials science and engineering, innovative management to reduce the risks associated with translating research results will be needed along with the R&D. While payoff is expected to be high from the promising areas of materials research, many of the benefits are likely to be evolutionary. Nevertheless, failure to invest in more speculative areas of research could lead to undesired technological surprises. Basic research in physics, chemistry, biology, and materials science will provide the seeds for potentially revolutionary technologies later in the 21st century.
