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Design And Process Integration For Microelectronic Manufacturing Ii Sic
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Book Synopsis Design and Process Integration for Microelectronic Manufacturing II [sic] by : Lars W. Liebmann
Download or read book Design and Process Integration for Microelectronic Manufacturing II [sic] written by Lars W. Liebmann and published by SPIE-International Society for Optical Engineering. This book was released on 2004 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Book Synopsis Design and Process Integration for Microelectronic Manufacturing II by : Alexander Starikov
Download or read book Design and Process Integration for Microelectronic Manufacturing II written by Alexander Starikov and published by Society of Photo Optical. This book was released on 2003 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design and Process Integration for Microelectronic Manufacturing by :
Download or read book Design and Process Integration for Microelectronic Manufacturing written by and published by . This book was released on 2006 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design and Process Integration for Microelectronic Manufacturing 4 by : Alfred K. K. Wong
Download or read book Design and Process Integration for Microelectronic Manufacturing 4 written by Alfred K. K. Wong and published by . This book was released on 2006-02-15 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design and Process Integration for Microelectronic Manufacturing IV by : Alfred Kwok-Kit Wong
Download or read book Design and Process Integration for Microelectronic Manufacturing IV written by Alfred Kwok-Kit Wong and published by Society of Photo Optical. This book was released on 2006 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Book Synopsis Design, Process Integration, and Characterization for Microelectronics by :
Download or read book Design, Process Integration, and Characterization for Microelectronics written by and published by . This book was released on 2002 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design, Process Integration, and Characterization for Microelectronics by : Alexander Starikov
Download or read book Design, Process Integration, and Characterization for Microelectronics written by Alexander Starikov and published by Society of Photo Optical. This book was released on 2002 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design and Process Integration for Microelectronic Manufacturing by :
Download or read book Design and Process Integration for Microelectronic Manufacturing written by and published by . This book was released on 2005 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Semiconductors by : Artur Balasinski
Download or read book Semiconductors written by Artur Balasinski and published by CRC Press. This book was released on 2018-09-03 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That’s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotlight on detailed engineering enhancements and their implications for device functionality, in contrast, this one offers, among other things, crucial, valuable historical background and roadmapping, all illustrated with examples. Presents actual test cases that illustrate product challenges, examine possible solution strategies, and demonstrate how to select and implement the right one This book shows that DfM is a powerful generic engineering concept with potential extending beyond its usual application in automated layout enhancements centered on proximity correction and pattern density. This material explores the concept of ICD for production by breaking down its major steps: product definition, design, layout, and manufacturing. Averting extended discussion of technology, techniques, or specific device dimensions, the author also avoids the clumsy chapter architecture that can hinder other books on this subject. The result is an extremely functional, systematic presentation that simplifies existing approaches to DfM, outlining a clear set of criteria to help readers assess reliability, functionality, and yield. With careful consideration of the economic and technical trade-offs involved in ICD for manufacturing, this reference addresses techniques for physical, electrical, and logical design, keeping coverage fresh and concise for the designers, manufacturers, and researchers defining product architecture and research programs.
Book Synopsis Design for Manufacturability Through Design-process Integration II by :
Download or read book Design for Manufacturability Through Design-process Integration II written by and published by . This book was released on 2008 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design and Analysis of Integrated Manufacturing Systems by : W. Dale Compton
Download or read book Design and Analysis of Integrated Manufacturing Systems written by W. Dale Compton and published by National Academies Press. This book was released on 1988-02-01 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design and Analysis of Integrated Manufacturing Systems is a fresh look at manufacturing from a systems point of view. This collection of papers from a symposium sponsored by the National Academy of Engineering explores the need for new technologies, the more effective use of new tools of analysis, and the improved integration of all elements of manufacturing operations, including machines, information, and humans. It is one of the few volumes to include detailed proposals for research that match the needs of industry.
Book Synopsis American Book Publishing Record by :
Download or read book American Book Publishing Record written by and published by . This book was released on 2003 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Through-Silicon Vias for 3D Integration by : John H. Lau
Download or read book Through-Silicon Vias for 3D Integration written by John H. Lau and published by McGraw Hill Professional. This book was released on 2012-08-05 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging
Book Synopsis Design for Manufacturability Through Design-process Integration V by : Michael L. Rieger
Download or read book Design for Manufacturability Through Design-process Integration V written by Michael L. Rieger and published by . This book was released on 2011 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: Includes Proceedings Vol. 7821
Book Synopsis Fundamentals of Semiconductor Manufacturing and Process Control by : Gary S. May
Download or read book Fundamentals of Semiconductor Manufacturing and Process Control written by Gary S. May and published by Wiley-IEEE Press. This book was released on 2006-05-22 with total page 488 pages. Available in PDF, EPUB and Kindle. Book excerpt: A practical guide to semiconductor manufacturing from process control to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Control covers all issues involved in manufacturing microelectronic devices and circuits, including fabrication sequences, process control, experimental design, process modeling, yield modeling, and CIM/CAM systems. Readers are introduced to both the theory and practice of all basic manufacturing concepts. Following an overview of manufacturing and technology, the text explores process monitoring methods, including those that focus on product wafers and those that focus on the equipment used to produce wafers. Next, the text sets forth some fundamentals of statistics and yield modeling, which set the foundation for a detailed discussion of how statistical process control is used to analyze quality and improve yields. The discussion of statistical experimental design offers readers a powerful approach for systematically varying controllable process conditions and determining their impact on output parameters that measure quality. The authors introduce process modeling concepts, including several advanced process control topics such as run-by-run, supervisory control, and process and equipment diagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and management of overall manufacturing systems * Chapters include case studies, sample problems, and suggested exercises * Instructor support includes electronic copies of the figures and an instructor's manual Graduate-level students and industrial practitioners will benefit from the detailed exami?nation of how electronic materials and supplies are converted into finished integrated circuits and electronic products in a high-volume manufacturing environment. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department. An Instructor Support FTP site is also available.
Book Synopsis Microelectronic Processing by : Walter Scot Ruska
Download or read book Microelectronic Processing written by Walter Scot Ruska and published by McGraw-Hill Companies. This book was released on 1987 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Design for Manufacturability Through Design-process Integration VII by : Mark E. Mason
Download or read book Design for Manufacturability Through Design-process Integration VII written by Mark E. Mason and published by . This book was released on 2013-04-18 with total page 277 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE offer access to the latest innovations in research and technology and are among the most cited references in patent literature.
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