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Conception Fabrication Caracterisation Et Modelisation De Transistors Mosfet Haute Tension En Technologie Avancee Soi Silicon On Insulator
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Book Synopsis Conception, fabrication, caractérisation et modélisation de transistors MOSFET haute tension en technologie avancée SOI (Silicon-On-Insulator) by : Antoine Litty
Download or read book Conception, fabrication, caractérisation et modélisation de transistors MOSFET haute tension en technologie avancée SOI (Silicon-On-Insulator) written by Antoine Litty and published by . This book was released on 2016 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: A l'heure où la miniaturisation des technologies CMOS sur substrat massif atteint des limites, la technologie FDSOI (silicium sur isolant totalement déserté) s'impose comme une alternative pour l'industrie en raison de ses meilleures performances. Dans cette technologie, l'utilisation d'un substrat SOI ultramince améliore le comportement des transistors MOSFETs et garantit leur intégrité électrostatique pour des dimensions en deçà de 28nm. Afin de lui intégrer de nouvelles fonctionnalités, il devient nécessaire de développer des applications dites « haute tension » comme les convertisseurs DC/DC, les régulateurs de tension ou encore les amplificateurs de puissance. Cependant les composants standards de la technologie CMOS ne sont pas capables de fonctionner sous les hautes tensions requises. Pour répondre à cette limitation, ces travaux portent sur le développement et l'étude de transistors MOS haute tension en technologie FDSOI. Plusieurs solutions sont étudiées à l'aide de simulations numériques et de caractérisations électriques : l'hybridation du substrat (gravure localisée de l'oxyde enterré) et la transposition sur le film mince. Une architecture innovante sur SOI, le Dual Gound Plane EDMOS, est alors proposée, caractérisée et modélisée. Cette architecture repose sur la polarisation d'une seconde grille arrière pour offrir un compromis RON.S/BV prometteur pour les applications visées.
Book Synopsis Silicon and Beyond by : Michael Shur
Download or read book Silicon and Beyond written by Michael Shur and published by World Scientific. This book was released on 2000 with total page 196 pages. Available in PDF, EPUB and Kindle. Book excerpt: The steady downscaling of device-feature size combined with a rapid increase in circuit complexity as well as the introduction of new device concepts based on non-silicon-material systems poses great challenges for device and circuit designers. One of the major tasks is the development of new and improved device models needed for accurate device and circuit design. Another task is the development of new circuit-simulation tools to handle very large and complex circuits. This book addresses both these issues with up-to-date reviews written by leading experts in the field. The first three chapters of the book discuss advanced device models both for existing technologies and for new, emerging technologies. Among the topics covered are models for MOSFETs, thin-film transitors (TFTs), and compound semiconductor devices, including GaAs HEMTs and HFETs, heterodimensional devices, quantum-tunneling devices, as well as wide-bandgap devices. Chapters 4 and 5 discuss advanced circuit simulators that hold promise for,handling circuits of much higher complexity than what is possible for typical state-of-the-art circuit simulators today.
Book Synopsis Modeling and SPICE Implementation of Silicon-on-insulator (SOI) Four Gate (G4FET) Transistor by : Md Sakib Hasan
Download or read book Modeling and SPICE Implementation of Silicon-on-insulator (SOI) Four Gate (G4FET) Transistor written by Md Sakib Hasan and published by . This book was released on 2017 with total page 183 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the device dimensions have reduced from micrometer to nanometer range, new bulk silicon devices are now facing many undesirable effects of scaling leading device engineers to look for new process technologies. Silicon-on-insulator (SOI) has emerged as a very promising candidate for resolving the major problems plaguing the bulk silicon technology. G4FET [G4FET] is a SOI transistor with four independent gates. Although G4FET has already shown great potential in different applications, the widespread adoption of a technology in circuit design is heavily dependent upon good SPICE (Simulation Program with Integrated Circuit Emphasis) models. CAD (Computer Aided Design) tools are now ubiquitous in circuit design and a fast, robust and accurate SPICE model is absolutely necessary to transform G4FET into a mainstream technology. The research goal is to develop suitable SPICE models for G4FET to aid circuit designers in designing innovative analog and digital circuits using this new transistor. The first phase of this work is numerical modeling of the G4FET where four different numerical techniques are implemented, each with its merits and demerits. The first two methods are based on multivariate Lagrange interpolation and multidimensional Bernstein polynomial. The third numerical technique is based on multivariate regression polynomial to aid modeling with dense gridded data. Another suitable alternative namely multidimensional linear and cubic spline interpolation is explored as the fourth numerical modeling approach to solve some of the problems resulting from single polynomial approximation. The next phase of modeling involves developing a macromodel combining already existing SPICE models of MOSFET (metal-oxide-semiconductor field-effect transistor) and JFET (junction-gate field-effect transistor). This model is easy to implement in circuit simulators and provides good results compared to already demonstrated experimental works with innovative G4FET circuits. The final phase of this work involves the development of a physics-based compact model of G4FET with some empirical fitting parameters. A model for depletion-all-around operation is implemented in circuit simulator based on previous work. Another simplified model, combining MOS and JFET action, is implemented in circuit simulator to model the accumulation mode operation of G4FET.
Book Synopsis Fabrication and Characterization of Lon-sensitive Field-effect Transistors Using Silicon-on-insulator Technology by : Kristine Bedner
Download or read book Fabrication and Characterization of Lon-sensitive Field-effect Transistors Using Silicon-on-insulator Technology written by Kristine Bedner and published by . This book was released on 2013 with total page 101 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Silicon on Ferroelectric Insulator Field Effect Transistor (SOF-FET) a New Device for the Next Generation Ultra Low Power Circuits by : Azzedin D. Es-Sakhi
Download or read book Silicon on Ferroelectric Insulator Field Effect Transistor (SOF-FET) a New Device for the Next Generation Ultra Low Power Circuits written by Azzedin D. Es-Sakhi and published by . This book was released on 2013 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt: Field effect transistors (FETs) are the foundation for all electronic circuits and processors. These devices have progressed massively to touch its final steps in subnanometer level. Left and right proposals are coming to rescue this progress. Emerging nano-electronic devices (resonant tunneling devices, single-atom transistors, spin devices, Heterojunction Transistors rapid flux quantum devices, carbon nanotubes, and nanowire devices) took a vast share of current scientific research. Non-Si electronic materials like III-V heterostructure, ferroelectric, carbon nanotubes (CNTs), and other nanowire based designs are in developing stage to become the core technology of non-classical CMOS structures. FinFET present the current feasible commercial nanotechnology. The scalability and low power dissipation of this device allowed for an extension of silicon based devices. High short channel effect (SCE) immunity presents its major advantage. Multi-gate structure comes to light to improve the gate electrostatic over the channel. The new structure shows a higher performance that made it the first candidate to substitute the conventional MOSFET. The device also shows a future scalability to continue Moor's Law. Furthermore, the device is compatible with silicon fabrication process. Moreover, the ultra-low-power (ULP) design required a subthreshold slope lower than the thermionic-emission limit of 60mV/ decade (KT/q). This value was unbreakable by the new structure (SOI-FinFET). On the other hand most of the previews proposals show the ability to go beyond this limit. However, those pre-mentioned schemes have publicized a very complicated physics, design difficulties, and process non-compatibility. The objective of this research is to discuss various emerging nano-devices proposed for ultra-low-power designs and their possibilities to replace the silicon devices as the core technology in the future integrated circuit. This thesis proposes a novel design that exploits the concept of negative capacitance. The new field effect transistor (FET) based on ferroelectric insulator named Silicon-On-Ferroelectric Insulator Field Effect Transistor (SOF-FET). This proposal is a promising methodology for future ultra-lowpower applications, because it demonstrates the ability to replace the silicon-bulk based MOSFET, and offers subthreshold swing significantly lower than 60mV/decade and reduced threshold voltage to form a conducting channel. The SOF-FET can also solve the issue of junction leakage (due to the presence of unipolar junction between the top plate of the negative capacitance and the diffused areas that form the transistor source and drain). In this device the charge hungry ferroelectric film already limits the leakage.
Book Synopsis Modeling, Fabrication and Characterization of Silicon Tunnel Field-effect Transistors by : Christian Philipp Sandow
Download or read book Modeling, Fabrication and Characterization of Silicon Tunnel Field-effect Transistors written by Christian Philipp Sandow and published by . This book was released on 2010 with total page 112 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Silicon on Ferroelectric Insulator Field Effect Transistor (SOFFET) by : Azzedin D. Es-Sakhi
Download or read book Silicon on Ferroelectric Insulator Field Effect Transistor (SOFFET) written by Azzedin D. Es-Sakhi and published by . This book was released on 2016 with total page 182 pages. Available in PDF, EPUB and Kindle. Book excerpt: The path of down-scaling traditional MOSFET is reaching its technological, economic and, most importantly, fundamental physical limits. Before the dead-end of the roadmap, it is imperative to conduct a broad research to find alternative materials and new architectures to the current technology for the MOSFET devices. Beyond silicon electronic materials like group III-V heterostructure, ferroelectric material, carbon nanotubes (CNTs), and other nanowire-based designs are in development to become the core technology for non-classical CMOS structures. Field effect transistors (FETs) in general have made unprecedented progress in the last few decades by down-scaling device dimensions and power supply level leading to extremely high numbers of devices in a single chip. High density integrated circuits are now facing major challenges related to power management and heat dissipation due to excessive leakage, mainly due to subthreshold conduction. Over the years, planar MOSFET dimensional reduction was the only process followed by the semiconductor industry to improve device performance and to reduce the power supply. Further scaling increases short-channel-effect (SCE), and off-state current makes it difficult for the industry to follow the well-known Moore’s Law with bulk devices. Therefore, scaling planar MOSFET is no longer considered as a feasible solution to extend this law. The down-scaling of metal-oxide-semiconductor field effect transistors (MOSFETs) leads to severe short-channel-effects and power leakage at large-scale integrated circuits (LSIs). The device, which is governed by the thermionic emission of the carriers injected from the source to the channel region, has set a limitation of the subthreshold swing (S) of 60 mV/decade at room temperature. Devices with ‘S’ below this limit is highly desirable to reduce the power consumption and maintaining a high Ion/Ioff current ratio. Therefore, the future of semiconductor industry hangs on new architectures, new materials or even new physics to govern the flow of carriers in new switches. As the subthreshold swing is increasing at every technology node, new structures using SOI, multi-gate, nanowire approach, and new channel materials such as III–V semiconductor have not satisfied the targeted values of subthreshold swing. Moreover, the ultra-low-power (ULP) design required a subthreshold slope lower than the thermionic emission limit of 60 mV/decade. This value was unbreakable by the new structure (SOI FinFET). On the other hand, most of the preview proposals show the ability to go beyond this limit. However, those pre-mentioned schemes have publicized very complicated physics, design difficulties, and process non-compatibility. The objective of this research is to discuss various emerging nano-devices proposed for sub-60 mV/decade designs and their possibilities to replace the silicon devices as the core technology in the future integrated circuit. This dissertation also proposes a novel design that exploits the concept of negative capacitance. The new field-effect-transistor (FET) based on ferroelectric insulator named Silicon-On-Ferroelectric Insulator Field effect-transistor (SOFFET). This proposal is a promising methodology for future ultra low-power applications because it demonstrates the ability to replace the silicon-bulk based MOSFET, and offers a subthreshold swing significantly lower than 60 mV/decade and reduced threshold voltage to form a conducting channel. The proposed SOFFET design, which utilizes the negative capacitance of a ferroelectric insulator in the body-stack, is completely different from the FeFET and NCFET designs. In addition to having the NC effect, the proposed device will have all the advantages of an SOI device. Body-stack that we are intending in this research has many advantages over the gate-stack. First, it is more compatible with the existing processes. Second, the gate and the working area of the proposed SOFFET is like the planar MOSFET. Third, the complexity and ferroelectric material interferences are shifted to the body of the device from the gate and the working area. The proposed structure offers better scalability and superior constructability because of the high-dielectric buried insulator. Here we are providing a very simplified model for the structure. Silicon-on-ferroelectric leads to several advantages including low off-state current and shift in the threshold voltage with the decrease of the ferroelectric material thickness. Moreover, having an insulator in the body of the device increases the controllability over the channel, which leads to the reduction in the short-channel-effect (SCE). The proposed SOFFET offers low value of subthreshold swing (S) leading to better performance in the on-state. The off-state current is directly related to S. So, the off-state current is also minimum in the proposed structure.
Book Synopsis Investigation on the Short Channel Silicon on Insulator (SOI) MOSFET Towards 0,1 _m63m [mym] Gate Length for Future VLSI Applications by : Hans-Oliver Joachim
Download or read book Investigation on the Short Channel Silicon on Insulator (SOI) MOSFET Towards 0,1 _m63m [mym] Gate Length for Future VLSI Applications written by Hans-Oliver Joachim and published by . This book was released on 1996 with total page 202 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Field Effect Transistor Fabrication with Silicon-on-insulator Methods by : Franklin Bradley Sharer
Download or read book Field Effect Transistor Fabrication with Silicon-on-insulator Methods written by Franklin Bradley Sharer and published by . This book was released on 2000 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: ABSTRACT: The growth of consumer electronics over the past few decades has been directly related to the advances in semiconductor technology. Devices have consistently grown smaller, faster, and cheaper at regular intervals leading to revolutionary new products reaching the market place. The basic building block of digital systems, such as the personal computer, is the Field Effect Transistor (FET). This thesis describes some of the silicon fabrication methods that are used to produce the FET and other related devices. The silicon-on-insulator technique that has been used to improve device performance is also discussed and a brief overview of the operation of various forms of the FET follows. An array of FETs was fabricated and tested using the clean room facility at the University of North Carolina at Charlotte and this thesis concludes with a description of the fabrication sequence and the results. The fabrication sequence includes mask design and generation, photolithography, doping, contact formation, and device testing.
Book Synopsis Characterization of Silicon - on - Insulator (SOI) Mosfet Using TCAD Tools by : Chun Jern Yeoh
Download or read book Characterization of Silicon - on - Insulator (SOI) Mosfet Using TCAD Tools written by Chun Jern Yeoh and published by . This book was released on 2007 with total page 109 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Low-Power CMOS Circuits by : Christian Piguet
Download or read book Low-Power CMOS Circuits written by Christian Piguet and published by CRC Press. This book was released on 2018-10-03 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt: The power consumption of microprocessors is one of the most important challenges of high-performance chips and portable devices. In chapters drawn from Piguet's recently published Low-Power Electronics Design, Low-Power CMOS Circuits: Technology, Logic Design, and CAD Tools addresses the design of low-power circuitry in deep submicron technologies. It provides a focused reference for specialists involved in designing low-power circuitry, from transistors to logic gates. The book is organized into three broad sections for convenient access. The first examines the history of low-power electronics along with a look at emerging and possible future technologies. It also considers other technologies, such as nanotechnologies and optical chips, that may be useful in designing integrated circuits. The second part explains the techniques used to reduce power consumption at low levels. These include clock gating, leakage reduction, interconnecting and communication on chips, and adiabatic circuits. The final section discusses various CAD tools for designing low-power circuits. This section includes three chapters that demonstrate the tools and low-power design issues at three major companies that produce logic synthesizers. Providing detailed examinations contributed by leading experts, Low-Power CMOS Circuits: Technology, Logic Design, and CAD Tools supplies authoritative information on how to design and model for high performance with low power consumption in modern integrated circuits. It is a must-read for anyone designing modern computers or embedded systems.
Book Synopsis Laser Annealing Processes in Semiconductor Technology by : Fuccio Cristiano
Download or read book Laser Annealing Processes in Semiconductor Technology written by Fuccio Cristiano and published by Woodhead Publishing. This book was released on 2021-04-21 with total page 426 pages. Available in PDF, EPUB and Kindle. Book excerpt: Laser Annealing Processes in Semiconductor Technology: Theory, Modeling and Applications in Nanoelectronics synthesizes the scientific and technological advances of laser annealing processes for current and emerging nanotechnologies. The book provides an overview of the laser-matter interactions of materials and recent advances in modeling of laser-related phenomena, with the bulk of the book focusing on current and emerging (beyond-CMOS) applications. Reviewed applications include laser annealing of CMOS, group IV semiconductors, superconducting materials, photonic materials, 2D materials. This comprehensive book is ideal for post-graduate students, new entrants, and experienced researchers in academia, research and development in materials science, physics and engineering. Introduces the fundamentals of laser materials and device fabrication methods, including laser-matter interactions and laser-related phenomena Addresses advances in physical modeling and in predictive simulations of laser annealing processes such as atomistic modeling and TCAD simulations Reviews current and emerging applications of laser annealing processes such as CMOS technology and group IV semiconductors
Book Synopsis TOF Range-Imaging Cameras by : Fabio Remondino
Download or read book TOF Range-Imaging Cameras written by Fabio Remondino and published by Springer Science & Business Media. This book was released on 2013-04-09 with total page 243 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today the cost of solid-state two-dimensional imagers has dramatically dropped, introducing low cost systems on the market suitable for a variety of applications, including both industrial and consumer products. However, these systems can capture only a two-dimensional projection (2D), or intensity map, of the scene under observation, losing a variable of paramount importance, i.e., the arrival time of the impinging photons. Time-Of-Flight (TOF) Range-Imaging (TOF) is an emerging sensor technology able to deliver, at the same time, depth and intensity maps of the scene under observation. Featuring different sensor resolutions, RIM cameras serve a wide community with a lot of applications like monitoring, architecture, life sciences, robotics, etc. This book will bring together experts from the sensor and metrology side in order to collect the state-of-art researchers in these fields working with RIM cameras. All the aspects in the acquisition and processing chain will be addressed, from recent updates concerning the photo-detectors, to the analysis of the calibration techniques, giving also a perspective onto new applications domains.
Book Synopsis Low-Power Electronics Design by : Christian Piguet
Download or read book Low-Power Electronics Design written by Christian Piguet and published by CRC Press. This book was released on 2018-10-03 with total page 912 pages. Available in PDF, EPUB and Kindle. Book excerpt: The power consumption of integrated circuits is one of the most problematic considerations affecting the design of high-performance chips and portable devices. The study of power-saving design methodologies now must also include subjects such as systems on chips, embedded software, and the future of microelectronics. Low-Power Electronics Design covers all major aspects of low-power design of ICs in deep submicron technologies and addresses emerging topics related to future design. This volume explores, in individual chapters written by expert authors, the many low-power techniques born during the past decade. It also discusses the many different domains and disciplines that impact power consumption, including processors, complex circuits, software, CAD tools, and energy sources and management. The authors delve into what many specialists predict about the future by presenting techniques that are promising but are not yet reality. They investigate nanotechnologies, optical circuits, ad hoc networks, e-textiles, as well as human powered sources of energy. Low-Power Electronics Design delivers a complete picture of today's methods for reducing power, and also illustrates the advances in chip design that may be commonplace 10 or 15 years from now.
Book Synopsis BSIM4 and MOSFET Modeling for IC Simulation by : Weidong Liu
Download or read book BSIM4 and MOSFET Modeling for IC Simulation written by Weidong Liu and published by World Scientific. This book was released on 2011 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the art of advanced MOSFET modeling for integrated circuit simulation and design. It provides the essential mathematical and physical analyses of all the electrical, mechanical and thermal effects in MOS transistors relevant to the operation of integrated circuits. Particular emphasis is placed on how the BSIM model evolved into the first ever industry standard SPICE MOSFET model for circuit simulation and CMOS technology development. The discussion covers the theory and methodology of how a MOSFET model, or semiconductor device models in general, can be implemented to be robust and efficient, turning device physics theory into a production-worthy SPICE simulation model. Special attention is paid to MOSFET characterization and model parameter extraction methodologies, making the book particularly useful for those interested or already engaged in work in the areas of semiconductor devices, compact modeling for SPICE simulation, and integrated circuit design.
Book Synopsis Superconductivity and Applications by : Yi-Han Kao
Download or read book Superconductivity and Applications written by Yi-Han Kao and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 795 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Proceedings is a collection of papers presented at the Third Annual Conference on Superconductivity and Applications organized by the New York State Institute on Superconductivity. This year the Conference was held at the Buffalo Hilton Hotel on September 19- 21, 1989, with previous meetings on September 28-29,1987, and April 18-20, 1988. As in previous years, this meeting was highly successful, with an attendance of over three hundred researchers participating in lively scientific exchanges and discussions. The high quality of the talks is evident in this Proceedings. The field of high temperature superconductivity has matured considerably since its early days of media frenzy and rapid new discoveries. However, the enthusiasm and pace of research have not slowed down. A much better picture of the nature of high temperature superconductivity, the properties of these new materials and where they may find their eventual use has emerged. Processing techniques, especially thin film deposition, have been perfected nearly to the point of allowing commercial applications. We expect continued phenomenal growth of the field of high temperature superconductivity, both in terms of research and applications for many years to come.
Download or read book ESD Testing written by Steven H. Voldman and published by John Wiley & Sons. This book was released on 2016-10-07 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). Describes both conventional testing and new testing techniques for both chip and system level evaluation. Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors’ series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work.
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