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Author : Intel Corporation
Publisher :
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.:/5 (45 download)
Download or read book CHMOS Components Handbook written by Intel Corporation and published by . This book was released on 1985 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Intel Corporation
Publisher :
ISBN 13 :
Total Pages : 1732 pages
Book Rating : 4.:/5 (43 download)
Download or read book Microsystem Components Handbook written by Intel Corporation and published by . This book was released on 1985 with total page 1732 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Intel Corporation
Publisher :
ISBN 13 : 9781555120016
Total Pages : 1284 pages
Book Rating : 4.1/5 (2 download)
Download or read book Microsystem Components Handbook 1986 written by Intel Corporation and published by . This book was released on 1986 with total page 1284 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Intel Corporation
Publisher :
ISBN 13 :
Total Pages : 440 pages
Book Rating : 4.:/5 (45 download)
Download or read book CHMOS Components Handbook written by Intel Corporation and published by . This book was released on 1985 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 166 pages
Book Rating : 4.0/5 ( download)
Download or read book Memory Components Handbook written by and published by . This book was released on 1984-06 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : K.H.J. Buschow
Publisher : Elsevier
ISBN 13 : 0444537805
Total Pages : 456 pages
Book Rating : 4.4/5 (445 download)
Download or read book Handbook of Magnetic Materials written by K.H.J. Buschow and published by Elsevier. This book was released on 2011-03-02 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 19 of the Handbook of Magnetic Materials, as the preceding volumes, has a dual purpose. As a textbook it is intended to help those who wish to be introduced to a given topic in the field of magnetism without the need to read the vast amount of literature published. As a work of reference it is intended for scientists active in magnetism research. To this dual purpose, Volume 19 is composed of topical review articles written by leading authorities. In each of these articles an extensive description is given in graphical as well as in tabular form, much emphasis being placed on the discussion of the experimental material in the framework of physics, chemistry and material science. It provides readers with novel trends and achievements in magnetism. Composed of topical review articles written by leading authorities Intended to be of assistance to those who wish to be introduced to a given topic in the field of magnetism As a work of reference it is intended for scientists active in magnetism research Provide the readership with novel trends and achievements in magnetism
Author : Intel Corporation
Publisher :
ISBN 13 :
Total Pages : 116 pages
Book Rating : 4.0/5 ( download)
Download or read book Product Guide written by Intel Corporation and published by . This book was released on 1985 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microcomputer components; Microprocessors; Development tools; Peripherals; Microcommunications components; Embedded controllers; Automotive products; Express (Extended reliability); Application specific integrated circuits (ASIC). Microcomputer systems; Single board computers; Personal computer enhacement products; OEM systems; Microcommunications systems; Parallel supercomputers; Software.
Author : Massimo Rudan
Publisher : Springer Nature
ISBN 13 : 3030798275
Total Pages : 1680 pages
Book Rating : 4.0/5 (37 download)
Download or read book Springer Handbook of Semiconductor Devices written by Massimo Rudan and published by Springer Nature. This book was released on 2022-11-10 with total page 1680 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Springer Handbook comprehensively covers the topic of semiconductor devices, embracing all aspects from theoretical background to fabrication, modeling, and applications. Nearly 100 leading scientists from industry and academia were selected to write the handbook's chapters, which were conceived for professionals and practitioners, material scientists, physicists and electrical engineers working at universities, industrial R&D, and manufacturers. Starting from the description of the relevant technological aspects and fabrication steps, the handbook proceeds with a section fully devoted to the main conventional semiconductor devices like, e.g., bipolar transistors and MOS capacitors and transistors, used in the production of the standard integrated circuits, and the corresponding physical models. In the subsequent chapters, the scaling issues of the semiconductor-device technology are addressed, followed by the description of novel concept-based semiconductor devices. The last section illustrates the numerical simulation methods ranging from the fabrication processes to the device performances. Each chapter is self-contained, and refers to related topics treated in other chapters when necessary, so that the reader interested in a specific subject can easily identify a personal reading path through the vast contents of the handbook.
Author : Markku Tilli
Publisher : Elsevier
ISBN 13 : 0815519885
Total Pages : 670 pages
Book Rating : 4.8/5 (155 download)
Download or read book Handbook of Silicon Based MEMS Materials and Technologies written by Markku Tilli and published by Elsevier. This book was released on 2009-12-08 with total page 670 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: - Silicon as MEMS material - Material properties and measurement techniques - Analytical methods used in materials characterization - Modeling in MEMS - Measuring MEMS - Micromachining technologies in MEMS - Encapsulation of MEMS components - Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. - Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. - Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. - Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. - Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Author : Glenn R. Blackwell
Publisher : CRC Press
ISBN 13 : 9781420049848
Total Pages : 648 pages
Book Rating : 4.0/5 (498 download)
Download or read book The Electronic Packaging Handbook written by Glenn R. Blackwell and published by CRC Press. This book was released on 2017-12-19 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Author : Intel Corporation
Publisher :
ISBN 13 :
Total Pages : 356 pages
Book Rating : 4.0/5 ( download)
Download or read book IAPX 86/88, 186/188 User's Manual Hardware Reference written by Intel Corporation and published by . This book was released on 1985 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author : S. Kevin Zhou
Publisher : Academic Press
ISBN 13 : 0128165863
Total Pages : 1074 pages
Book Rating : 4.1/5 (281 download)
Download or read book Handbook of Medical Image Computing and Computer Assisted Intervention written by S. Kevin Zhou and published by Academic Press. This book was released on 2019-10-18 with total page 1074 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Medical Image Computing and Computer Assisted Intervention presents important advanced methods and state-of-the art research in medical image computing and computer assisted intervention, providing a comprehensive reference on current technical approaches and solutions, while also offering proven algorithms for a variety of essential medical imaging applications. This book is written primarily for university researchers, graduate students and professional practitioners (assuming an elementary level of linear algebra, probability and statistics, and signal processing) working on medical image computing and computer assisted intervention. - Presents the key research challenges in medical image computing and computer-assisted intervention - Written by leading authorities of the Medical Image Computing and Computer Assisted Intervention (MICCAI) Society - Contains state-of-the-art technical approaches to key challenges - Demonstrates proven algorithms for a whole range of essential medical imaging applications - Includes source codes for use in a plug-and-play manner - Embraces future directions in the fields of medical image computing and computer-assisted intervention
Author : Rao Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 9780412084515
Total Pages : 662 pages
Book Rating : 4.0/5 (845 download)
Download or read book Microelectronics Packaging Handbook written by Rao Tummala and published by Springer Science & Business Media. This book was released on 1997-01-31 with total page 662 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Author : Sergey Edward Lyshevski
Publisher : CRC Press
ISBN 13 : 1351837567
Total Pages : 1032 pages
Book Rating : 4.3/5 (518 download)
Download or read book Nano and Molecular Electronics Handbook written by Sergey Edward Lyshevski and published by CRC Press. This book was released on 2018-10-03 with total page 1032 pages. Available in PDF, EPUB and Kindle. Book excerpt: There are fundamental and technological limits of conventional microfabrication and microelectronics. Scaling down conventional devices and attempts to develop novel topologies and architectures will soon be ineffective or unachievable at the device and system levels to ensure desired performance. Forward-looking experts continue to search for new paradigms to carry the field beyond the age of microelectronics, and molecular electronics is one of the most promising candidates. The Nano and Molecular Electronics Handbook surveys the current state of this exciting, emerging field and looks toward future developments and opportunities. Molecular and Nano Electronics Explained Explore the fundamentals of device physics, synthesis, and design of molecular processing platforms and molecular integrated circuits within three-dimensional topologies, organizations, and architectures as well as bottom-up fabrication utilizing quantum effects and unique phenomena. Technology in Progress Stay current with the latest results and practical solutions realized for nanoscale and molecular electronics as well as biomolecular electronics and memories. Learn design concepts, device-level modeling, simulation methods, and fabrication technologies used for today's applications and beyond. Reports from the Front Lines of Research Expert innovators discuss the results of cutting-edge research and provide informed and insightful commentary on where this new paradigm will lead. The Nano and Molecular Electronics Handbook ranks among the most complete and authoritative guides to the past, present, and future of this revolutionary area of theory and technology.
Author : Robert H. Bishop
Publisher : CRC Press
ISBN 13 : 1439833206
Total Pages : 1416 pages
Book Rating : 4.4/5 (398 download)
Download or read book The Mechatronics Handbook - 2 Volume Set written by Robert H. Bishop and published by CRC Press. This book was released on 2018-10-08 with total page 1416 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first comprehensive reference on mechatronics, The Mechatronics Handbook was quickly embraced as the gold standard in the field. From washing machines, to coffeemakers, to cell phones, to the ubiquitous PC in almost every household, what, these days, doesn’t take advantage of mechatronics in its design and function? In the scant five years since the initial publication of the handbook, the latest generation of smart products has made this even more obvious. Too much material to cover in a single volume Originally a single-volume reference, the handbook has grown along with the field. The need for easy access to new material on rapid changes in technology, especially in computers and software, has made the single volume format unwieldy. The second edition is offered as two easily digestible books, making the material not only more accessible, but also more focused. Completely revised and updated, Robert Bishop’s seminal work is still the most exhaustive, state-of-the-art treatment of the field available.
Author : Intel Corporation
Publisher : Intel Corporation (CA)
ISBN 13 :
Total Pages : 820 pages
Book Rating : 4.:/5 (41 download)
Download or read book Development Tools Handbook written by Intel Corporation and published by Intel Corporation (CA). This book was released on 1987 with total page 820 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microcomputer development language; Microcomputer software development tools; In circuit emulators; Network development systems; Microcomputer development systems; System design kits; PROM programming; EPLD development tools.
