Author : John H. Lau
Publisher : McGraw Hill Professional
ISBN 13 : 9780070383043
Total Pages : 600 pages
Book Rating : 4.3/5 (83 download)
Book Synopsis Chip Scale Package (CSP) by : John H. Lau
Download or read book Chip Scale Package (CSP) written by John H. Lau and published by McGraw Hill Professional. This book was released on 1999 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring the latest design techniques, plus details on more than 40 different types of CSP, hands engineers and designers the complete, professional set of working tools to: solve technical and design issues; find the most efficient, cost-effective CSP solutions for deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, and other major companies; and learn about CSP products under development.