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Author : Narendra Shamkant Borgharkar
Publisher :
ISBN 13 :
Total Pages : 368 pages
Book Rating : 4.:/5 (382 download)
Download or read book Chemical Vapor Deposition of Copper Films written by Narendra Shamkant Borgharkar and published by . This book was released on 1997 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Raman Thiruvenkatachari
Publisher :
ISBN 13 :
Total Pages : 266 pages
Book Rating : 4.:/5 (132 download)
Download or read book Chemical Vapor Deposition of Copper Thin Films written by Raman Thiruvenkatachari and published by . This book was released on 2000 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Wing-Cheong Gilbert Lai
Publisher :
ISBN 13 :
Total Pages : 286 pages
Book Rating : 4.:/5 (267 download)
Download or read book Chemical Vapor Deposition of Copper Thin Films written by Wing-Cheong Gilbert Lai and published by . This book was released on 1991 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Reginald Bernard Little
Publisher :
ISBN 13 :
Total Pages : 310 pages
Book Rating : 4.:/5 (286 download)
Download or read book Chemical Vapor Deposition of Copper Thin Films written by Reginald Bernard Little and published by . This book was released on 1992 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Wei-Shang King
Publisher :
ISBN 13 :
Total Pages : 122 pages
Book Rating : 4.:/5 (325 download)
Download or read book Low Pressure Chemical Vapor Deposition of Copper Films from CU(I)(HFAC)(TMVS) written by Wei-Shang King and published by . This book was released on 1995 with total page 122 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Thomas Wächtler
Publisher : Thomas Waechtler
ISBN 13 : 3941003178
Total Pages : 247 pages
Book Rating : 4.9/5 (41 download)
Download or read book Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices written by Thomas Wächtler and published by Thomas Waechtler. This book was released on 2010 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Toivo T. Kodas
Publisher : John Wiley & Sons
ISBN 13 : 3527615849
Total Pages : 562 pages
Book Rating : 4.5/5 (276 download)
Download or read book The Chemistry of Metal CVD written by Toivo T. Kodas and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: High purity, thin metal coatings have a variety of important commercial applications, for example, in the microelectronics industry, as catalysts, as protective and decorative coatings as well as in gas-diffusion barriers. This book offers detailed, up- to-date coverage of the chemistry behind the vapor deposition of different metals from organometallic precursors. In nine chapters, the CVD of metals including aluminum, tungsten, gold, silver, platinum, palladium, nickel, as well as copper from copper(I) and copper(II) compounds is covered. The synthesis and properties of the precursors, the growth process, morphology, quality and adhesion of the resulting films as well as laser- assisted, ion- assisted and plasma-assisted methods are discussed. Present applications and prospects for future developments are summarized. With ca. 1000 references and a glossary, this book is a unique source of in-depth information. It is indispensable for chemists, physicists, engineers and materials scientists working with metal- coating processes and technologies. From Reviews: 'I highly recommend this book to anyone interested in learning more about the chemistry of metal CVD.' J. Am Chem. Soc.
Author : Yu-Neng Chang
Publisher :
ISBN 13 :
Total Pages : 290 pages
Book Rating : 4.:/5 (276 download)
Download or read book Organometallic Chemical Vapor Deposition of Copper Oxide Thin Films written by Yu-Neng Chang and published by . This book was released on 1992 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jorge Ramírez-Ortiz
Publisher : LAP Lambert Academic Publishing
ISBN 13 : 9783659199820
Total Pages : 96 pages
Book Rating : 4.1/5 (998 download)
Download or read book Chemical Vapor Deposition of Copper and Copper Oxides written by Jorge Ramírez-Ortiz and published by LAP Lambert Academic Publishing. This book was released on 2012-08 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical vapor deposition (CVD) is a very versatile process widely used in the production of thin solid films and surface coating. It is also used to produce powders, fibers and monolithic components. In addition, the majority of chemical elements in the periodic table has been deposited, as well as compounds such as carbides, nitrides, oxides, intermetallic and many others. Chemical vapor deposition has been a critical technology in silicon microelectronics processes, fabrication of thin films of metals, semiconductors, and insulators. With increasing packing density in microelectronic devices, copper is used as an interconnecting metal due to its superior electrical conductivity and excellent resistance against electromigration. One of the advantages of chemcial vapor deposition is that selective deposition onto one surface, often defined as the growth surface, in the presence of another surface, often defined as non-growth surface is possible. The high optical absorption coefficient and low cost of production of Cu2O thin films have they made good candidates for electrochromic devices, solar cells and oxygen sensors.
Author : Jong-Hee Park
Publisher : ASM International
ISBN 13 : 161503224X
Total Pages : 477 pages
Book Rating : 4.6/5 (15 download)
Download or read book Chemical Vapor Deposition written by Jong-Hee Park and published by ASM International. This book was released on 2001 with total page 477 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Dojun Kim
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (61 download)
Download or read book Chemical Vapor Deposition of Tungsten-based Diffusion Barrier Thin Films for Copper Metallization written by Dojun Kim and published by . This book was released on 2009 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: ABSTRACT: The ternary material WN[subscript x]C[subscript y] was investigated for Cu diffusion barrier application. Thin films were deposited from tungsten diorganohydrazido(2- ) complexes Cl4(CH3CN)W(NNR22) (1: R2=-(CH2)5-; 2: R2=Ph2; 3: R22=Me2) using metal-organic aerosol-assisted CVD. The films deposited from these novel precursors were characterized for their composition, bonding state, structure, resistivity, and barrier quality. WN[subscript x]C[subscript y] films from 1, 2 and 3 were successfully deposited in the absence and the presence of NH3 in H2 carrier in the temperature range 300 to 700 °C. All WN[subscript x]C[subscript y] films contained W, N, C, and a small amount of O as determined by XPS. The Cl content of the film was below the XPS detection limit (~ 1 at. %). The chemical composition of films deposited with 1 in H2/NH3 exhibited increased N levels and decreased C levels over the entire temperature range of this study as compared with to films deposited 1 in H2. As determined by XPS, W is primarily bonded to N and C for films deposited at 400 C, but at lower deposition temperature the binding energy of the W-O bond becomes more evident. The films deposited at 400 °C were X-ray amorphous and Cu/WN[subscript x]C[subscript y]/Si stacks annealed under N2 at 500 °C for 30 min maintained the integrity of both the Cu/WN[subscript x]C[subscript y] and WN[subscript x]C[subscript y]/Si interfaces.
Author :
Publisher :
ISBN 13 :
Total Pages : 14 pages
Book Rating : 4.:/5 (227 download)
Download or read book Aerosol-Assisted Chemical Vapor Deposition of Copper: A Liquid Delivery Approach to Metal Thin Films written by and published by . This book was released on 1994 with total page 14 pages. Available in PDF, EPUB and Kindle. Book excerpt: Aerosol-Assisted Chemical Vapor Deposition (AACVD) has been used to attain high deposition rates (1000 A/min, up to 800 A/min at 140 deg C) of Cu films at low temperatures (120-200 deg C) from toluene solutions of (hfac)Cu(1, 5-COD) in a warm-wall reactor. The films are crystalline and exhibit resistivities close to bulk (1.7-3.5 micro omega cm). Activation energies calculated from the deposition rate as a function of the preheating temperature and the substrate temperature (varying also the nozzle-substrate distance) were 6.8, 8.9 (0.7 cm) and 9.1 (1.7 cm) kcal/mol, respectively.
Author : Alan Thomas Stephens
Publisher :
ISBN 13 :
Total Pages : 274 pages
Book Rating : 4.:/5 (317 download)
Download or read book Chemical Vapor Deposition Reactor Design and Process Optimization for the Deposition of Copper Thin Films written by Alan Thomas Stephens and published by . This book was released on 1994 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt: "A chemical vapor deposition reactor has been designed, built, and optimized for the deposition of copper thin films. The single wafer, stagnation point flow reactor features: six inch substrate capacity; direct metering and vaporization of liquid precursor; reactant introduction into the reactor chamber through a multi-zone precursor injection manifold; optional variable power (0-300W) RF plasma assist; manual loadlock; and, a computer control interface. Substrate temperature uniformity has been measured to be better than 1% across the substrate over a wide range of temperatures. The injection manifold was designed for precise tailoring of gas flow characteristics across the substrate, incorporating four concentric, independently adjustable zones, each of which is controlled by a metering valve. Both Cu(I) trimethylvinylsilane hexaf luoroacetylacetonate (tmvs hfac) and Cu(II) hfac precursor chemistries have been used. Film properties were determined by four-point probe, surface profilometer, and scanning electron microscope (SEM). The Cu(I) tmvs hfac chemistry yielded the best results with deposition rates exceeding lOOOA/min, average film resistivities below 1.80 ^Q*cm, excellent step coverage, and complete gap fill."--Abstract.
Author : Pietro Mandracci
Publisher : BoD – Books on Demand
ISBN 13 : 1789849608
Total Pages : 166 pages
Book Rating : 4.7/5 (898 download)
Download or read book Chemical Vapor Deposition for Nanotechnology written by Pietro Mandracci and published by BoD – Books on Demand. This book was released on 2019-01-10 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical vapor deposition (CVD) techniques have played a major role in the development of modern technology, and the rise of nanotechnology has further increased their importance, thanks to techniques such as atomic layer deposition (ALD) and vapor liquid solid growth, which are able to control the growth process at the nanoscale. This book aims to contribute to the knowledge of recent developments in CVD technology and its applications. To this aim, important process innovations, such as spatial ALD, direct liquid injection CVD, and electron cyclotron resonance CVD, are presented. Moreover, some of the most recent applications of CVD techniques for the growth of nanomaterials, including graphene, nanofibers, and diamond-like carbon, are described in the book.
Author : Y. Pauleau
Publisher : Springer Science & Business Media
ISBN 13 : 940100353X
Total Pages : 372 pages
Book Rating : 4.4/5 (1 download)
Download or read book Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies written by Y. Pauleau and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: An up-to-date collection of tutorial papers on the latest advances in the deposition and growth of thin films for micro and nano technologies. The emphasis is on fundamental aspects, principles and applications of deposition techniques used for the fabrication of micro and nano devices. The deposition of thin films is described, emphasising the gas phase and surface chemistry and its effects on the growth rates and properties of films. Gas-phase phenomena, surface chemistry, growth mechanisms and the modelling of deposition processes are thoroughly described and discussed to provide a clear understanding of the growth of thin films and microstructures via thermally activated, laser induced, photon assisted, ion beam assisted, and plasma enhanced vapour deposition processes. A handbook for engineers and scientists and an introduction for students of microelectronics.
Author : Daewon Yang
Publisher :
ISBN 13 :
Total Pages : 184 pages
Book Rating : 4.:/5 (115 download)
Download or read book Investigation of Nucleation and Film Growth Using Programmed Rate Chemical Vapor Deposition of Aluminum and Copper written by Daewon Yang and published by . This book was released on 1999 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : S. Sivaram
Publisher : Springer
ISBN 13 :
Total Pages : 312 pages
Book Rating : 4.3/5 (91 download)
Download or read book Chemical Vapor Deposition written by S. Sivaram and published by Springer. This book was released on 1995-03-31 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: In early 1987 I was attempting to develop a CVD-based tungsten process for Intel. At every step ofthe development, information that we were collecting had to be analyzed in light of theories and hypotheses from books and papers in many unrelated subjects. Thesesources were so widely different that I came to realize there was no unifying treatment of CVD and its subprocesses. More interestingly, my colleagues in the industry were from many disciplines (a surface chemist, a mechanical engineer, a geologist, and an electrical engineer werein my group). To help us understand the field of CVD and its players, some of us organized the CVD user's group of Northern California in 1988. The idea for writing a book on the subject occurred to me during that time. I had already organized my thoughts for a course I taught at San Jose State University. Later Van Nostrand agreed to publish my book as a text intended for students at the senior/first year graduate level and for process engineers in the microelectronics industry, This book is not intended to be bibliographical, and it does not cover every new material being studied for chemical vapor deposition. On the other hand, it does present the principles of CVD at a fundamental level while uniting them with the needs of the microelectronics industry.
