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Chemical Mechanical Polishing 2001 Advances And Future Challenges Volume 671
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Book Synopsis Chemical-Mechanical Polishing 2001 - Advances and Future Challenges: Volume 671 by : Materials Research Society. Meeting
Download or read book Chemical-Mechanical Polishing 2001 - Advances and Future Challenges: Volume 671 written by Materials Research Society. Meeting and published by . This book was released on 2001-12-14 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2001.
Book Synopsis Chemical-Mechanical Polishing 2001 - Advances and Future Challenges: by : Suryadevara V. Babu
Download or read book Chemical-Mechanical Polishing 2001 - Advances and Future Challenges: written by Suryadevara V. Babu and published by Cambridge University Press. This book was released on 2014-06-05 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: With copper and barrier-layer integration firmly in place, several other exciting developments are occurring in the practice of chemical-mechanical polishing (CMP), and many advances are described in this book, first published in 2001. Discussions on CMP for shallow-trench isolation, abrasive-free slurries, improvements in pad and tool configurations including fixed abrasive pads, 'engineered' particles, effects of nanotopography, end-point studies, defect characterization and novel post-CMP cleaning methods are highlighted. Considerable progress has also been reported in modeling the complicated interactions that occur between the wafer surface and the pad and the slurry, whether containing abrasives or abrasive-free, and their influence on dishing and erosion and nonuniformity. These studies offer valuable insights for process improvements and yet many challenges remain and will provide a high level of interest for future books. Topics include: recent developments - pads and related issues; CMP abrasives; copper CMP/STI and planarization; STI and planarization - wear-rate models; low-k and integration issues - particle and process effects in CMP and issues in CMP cleaning.
Download or read book Chemical-mechanical Polishing written by and published by . This book was released on 2001 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advances in Chemical-Mechanical Polishing: Volume 816 by : Materials Research Society. Meeting
Download or read book Advances in Chemical-Mechanical Polishing: Volume 816 written by Materials Research Society. Meeting and published by . This book was released on 2004-09 with total page 318 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).
Book Synopsis Chemical-Mechanical Polishing - Fundamentals and Challenges: Volume 566 by : S. V. Babu
Download or read book Chemical-Mechanical Polishing - Fundamentals and Challenges: Volume 566 written by S. V. Babu and published by . This book was released on 2000-02-10 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Chemical-Mechanical Planarization: Volume 867 by : A. Kumar
Download or read book Chemical-Mechanical Planarization: Volume 867 written by A. Kumar and published by . This book was released on 2005-07-19 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.
Book Synopsis Si Front-End Processing: Volume 669 by : Erin C. Jones
Download or read book Si Front-End Processing: Volume 669 written by Erin C. Jones and published by . This book was released on 2001-12-14 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis GaN and Related Alloys - 2001: Volume 693 by : John E. Northrup
Download or read book GaN and Related Alloys - 2001: Volume 693 written by John E. Northrup and published by . This book was released on 2002-07-23 with total page 912 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Chemical-Mechanical Planarization: Volume 767 by : Duane S. Boning
Download or read book Chemical-Mechanical Planarization: Volume 767 written by Duane S. Boning and published by . This book was released on 2003-08-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.
Book Synopsis Ferroelectric Thin Films X: Volume 688 by : Materials Research Society. Meeting
Download or read book Ferroelectric Thin Films X: Volume 688 written by Materials Research Society. Meeting and published by . This book was released on 2002-05 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Surface Engineering 2001 - Fundamentals and Applications: Volume 697 by : Wen Jin Meng
Download or read book Surface Engineering 2001 - Fundamentals and Applications: Volume 697 written by Wen Jin Meng and published by . This book was released on 2002-08-27 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Symposium written by Ichirō Takeuchi and published by . This book was released on 2002 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advances in Materials Theory and Modeling - Bridging Over Multiple-Length and Time Scales: Volume 677 by : Vasily Bulatov
Download or read book Advances in Materials Theory and Modeling - Bridging Over Multiple-Length and Time Scales: Volume 677 written by Vasily Bulatov and published by . This book was released on 2001-09-20 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: Computer simulations of materials are rapidly moving from the level of fundamental studies into the domain of industrial research and development tools. Papers in this book provide an extensive review of advances in materials theory and modeling by addressing new frontiers for theoretical and computational research on real materials, identifying crucial areas where experimental studies have or can be complemented by theory and simulation, and establishing a blueprint for further development of multiscale methods in computational materials science. A number of algorithms for boosting the simulation of time scale of atomistic systems have been introduced but they do not quite answer the need for a solid and widely applicable method. Topics include: mechanical properties, fracture and plasticity; radiation-matter interactions; polymers and macromolecules; multiresolution and multiscale methods - microstructural evolution; new methods for materials simulation; multi-time-scale methods and applications and large-scale ab initio calculations.
Book Synopsis Index of Conference Proceedings by : British Library. Document Supply Centre
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2002 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Progress in Semiconductor Materials for Optoelectronic Applications: Volume 692 by : Eric D. Jones
Download or read book Progress in Semiconductor Materials for Optoelectronic Applications: Volume 692 written by Eric D. Jones and published by . This book was released on 2002-06-19 with total page 768 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Book Synopsis Advances in Chemical-Mechanical Polishing: by : Duane S. Boning
Download or read book Advances in Chemical-Mechanical Polishing: written by Duane S. Boning and published by Cambridge University Press. This book was released on 2014-06-05 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other metal films. Nonconventional materials include those of increasing importance in advanced semiconductor, MEMS, and nanotechnologies, such as low-k dielectrics and polymer, nickel, and ruthenium films. CMP in IC fabrication continues to pose substantial problems - for virgin silicon wafer preparation, shallow-trench isolation (STI) structures, and poly or other deep-trench structure formation, as well as copper and low-k metal interconnect. New developments in CMP pads and slurries are presented. Novel polishing methods and are described. Advances in CMP process understanding and modeling are also highlighted.
Book Synopsis Advanced Fibers, Plastics, Laminates and Composites by : Frederick T. Wallenberger
Download or read book Advanced Fibers, Plastics, Laminates and Composites written by Frederick T. Wallenberger and published by . This book was released on 2002 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: Speakers from 15 industries and 40 countries come together in this volume to offer a truly international and interdisciplinary review of advanced fibers, polymers, plastics, laminates and composites. As a result, many new scientific breakthroughs are reported and several new commercial ventures are reviewed. Discussions focus on two major areas--those devoted to advances in the fields of natural fibers, natural polymers and composites based on natural fibers and/or natural matrix materials or natural matrix precursors, and those focusing on recent advances in the fields of conventional synthetic fibers, polymers and composites. The fields of advanced natural fibers, polymers and composites represent a rapidly growing scientific and technical area. Traditionally, these topics have been reviewed in separate conferences, but not as an integral part of a conference on advanced fibers, polymers and composites in general. A comprehensive review of these topics within the framework of the larger topic of the symposium represents a first for the Materials Research Society or any professional society. The field of advanced synthetic fibers and plastics continues to diversify, affording new experimental and commercial applications. For example, a new injection molding process for making commercial polyolefin-based nanocomposites offering superior properties in car body side panels is featured. Topics include: natural fibres and properties; natural fibres and natural palstics; natural plastics and composites; composites from natural fibers and/or plastics; glass, carbon and other reinforcing fibers; polymer and resin matrix materials; polymer and ceramic matrix composites; ceramic and metalmatrix composites; advanced composite structures; and carbon nanotubes, carbon fibres and composites.
