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Author : Man F. Yan
Publisher :
ISBN 13 :
Total Pages : 632 pages
Book Rating : 4.3/5 (91 download)
Download or read book Ceramic Substrates and Packages for Electronic Applications written by Man F. Yan and published by . This book was released on 1989 with total page 632 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Fred D. Barlow, III
Publisher : CRC Press
ISBN 13 : 1420018965
Total Pages : 456 pages
Book Rating : 4.4/5 (2 download)
Download or read book Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and published by CRC Press. This book was released on 2018-10-03 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Author : Relva C. Buchanan
Publisher : CRC Press
ISBN 13 : 1482293048
Total Pages : 692 pages
Book Rating : 4.4/5 (822 download)
Download or read book Ceramic Materials for Electronics written by Relva C. Buchanan and published by CRC Press. This book was released on 2018-10-08 with total page 692 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Third Edition of Ceramic Materials for Electronics studies a wide range of ceramic materials, including insulators, conductors, piezoelectrics, and ferroelectrics, through detailed discussion of their properties, characterization, fabrication, and applications in electronics. The author summarizes the latest trends and advancements in the field, and explores important topics such as ceramic thin film, functional device technology, and thick film technology. Edited by a leading expert on the subject, this new edition includes more than 150 pages of new information; restructured reference materials, figures, and tables; as well as additional device application-oriented segments.
Author :
Publisher : ASM International
ISBN 13 : 9780871702852
Total Pages : 1234 pages
Book Rating : 4.7/5 (28 download)
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author : Ardalan Nasiri
Publisher :
ISBN 13 :
Total Pages : 212 pages
Book Rating : 4.:/5 (125 download)
Download or read book Synthesis and Application of Ceramic Paste for High-temperature Electronic Packaging written by Ardalan Nasiri and published by . This book was released on 2020 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: This dissertation research focused on the synthesis and application of ceramic paste for high-temperature applications. An alumina paste material comprising aluminum dihydric phosphate and alumina powder was developed for high-temperature electronic packaging. Nano aluminum nitride and nano-silica powders were embedded to promote the paste curing process, limit the grain growth, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to similar commercial ceramic encapsulants. The die-attach material and encapsulation properties tested at 500°C showed no defect or additional cracks. Thermal aging and thermal cycling were carried out on the synthesized paste. XPS analysis revealed a higher oxygen bonding percentage for the 10% nanosilica ceramic sample than other samples. XRD peak broadening is largest for the 10% nano-silica ceramic which indicated smaller crystallite sizes. The smaller crystallite size for the 10% nanosilica sample introduces a larger microstrain to the alumina crystal structure. FTIR revealed the presence of alumina-silicate bonds on these samples with the largest amount present in the 10% nanosilica samples. SEM and EDX results showed a uniform bond line for the 10% sample and uniform material distribution. An electronic packaging technology that survives the Venusian condition was developed. Alumina ceramic substrates and gold conductors on alumina were evaluated for electrical and mechanical performance. The most promising die-attach materials were found to be thick-film gold and alumina-based ceramic pastes. Alumina, sapphire, silicon, and silicon carbide dice were attached to the alumina substrates using these die-attach materials and exposed to the Venusian condition for 244 hours. The devices on the packaging substrates were encapsulated by a ceramic encapsulant with no significant increase in cracks and voids after the Venusian simulator test. Wire pull strength tests were conducted on the gold bond wire to evaluate mechanical durability before and after the Venusian simulator exposure test with about 30.8% decrease which satisfied the minimum requirement for the MIL-STD-885 method. The overall wire-bond daisy-chain resistance change was 0.47% after the Venus simulator test, indicating a promising wire bond integrity. A titanium package was fabricated to house the ceramic packaging substrate and a two-level metalized feedthrough was fabricated to provide electrical interfaces to the package. A double-layer ceramic electronic packaging technology that survives the Venusian surface condition was developed using a ceramic interlayer dielectric with gold conductors. A 60-æm ceramic interlayer dielectric served as the insulator between the top and bottom gold conductors on high-purity ceramic substrates. Test devices with AuPtPd metallization were attached to the top gold pads using a thick-film gold paste. Thermal aging for 115 hours at 500°C and thermal cycling from room temperature to 450°C were performed. Dielectric leakage tests of the interlayer ceramic layer between the top and bottom gold conductors revealed a leakage current density of less than 50 10-7 A/cm2 at 600V after thermal cycling. The die shear test showed a 33% decrease in die shear strength after thermal tests but still satisfies the MIL-STD method.
Author : Richard K. Ulrich
Publisher : John Wiley & Sons
ISBN 13 : 0471466093
Total Pages : 852 pages
Book Rating : 4.4/5 (714 download)
Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Author : Michael Pecht
Publisher : CRC Press
ISBN 13 : 135183004X
Total Pages : 126 pages
Book Rating : 4.3/5 (518 download)
Download or read book Electronic Packaging Materials and Their Properties written by Michael Pecht and published by CRC Press. This book was released on 2017-12-19 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Author : Michael Pecht
Publisher : CRC Press
ISBN 13 : 1351838415
Total Pages : 904 pages
Book Rating : 4.3/5 (518 download)
Download or read book Handbook of Electronic Package Design written by Michael Pecht and published by CRC Press. This book was released on 2018-10-24 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Author : Andrew E Fletcher
Publisher : Elsevier
ISBN 13 : 1483165612
Total Pages : 231 pages
Book Rating : 4.4/5 (831 download)
Download or read book Advanced Organics for Electronic Substrates and Packages written by Andrew E Fletcher and published by Elsevier. This book was released on 2013-10-22 with total page 231 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet preserve the performance of the semiconductors with minimum package delay to the system. Trends in each of the major packaging technologies include chip level connection, providing the required connections between the chip and the semiconductor package. The power distribution to the chip and heat removal from the chip; first level packages providing all the necessary wiring; interconnections and power distribution; first-to-second level interconnections; and second level packages providing all the necessary wiring, connections, power distribution, and power supply connection are included as well. This book is a useful and informative reference to students or individuals studying or conducting research within the field of electronic engineering.
Author : Deborah D.L. Chung
Publisher : Elsevier
ISBN 13 : 0080511171
Total Pages : 383 pages
Book Rating : 4.0/5 (85 download)
Download or read book Materials for Electronic Packaging written by Deborah D.L. Chung and published by Elsevier. This book was released on 1995-03-31 with total page 383 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems. Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
Author : Mel M. Schwartz
Publisher :
ISBN 13 :
Total Pages : 424 pages
Book Rating : 4.3/5 (91 download)
Download or read book Engineering Applications of Ceramic Materials written by Mel M. Schwartz and published by . This book was released on 1985 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Xingcun Colin Tong
Publisher : Springer Science & Business Media
ISBN 13 : 1441977597
Total Pages : 633 pages
Book Rating : 4.4/5 (419 download)
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author : Hyo Tae Kim
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (115 download)
Download or read book High Thermal Conductivity Ceramics and Their Composites for Thermal Management of Integrated Electronic Packaging written by Hyo Tae Kim and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Recently, ceramic substrates have been of great interest for use in light emitting diode (LED) packaging materials because of their excellent heat transfer capability. The thermal conductivities of ceramic-based substrates are usually one or two orders of magnitude higher than those of conventional epoxy-based substrates. The demand for ceramic substrates with high mechanical strength and thermal conductivity is also growing due to their use in thin and high-power device packaging substrates. Examples are direct bonded copper or aluminum or direct plated copper substrates for insulated gate bipolar transistors; thin and robust ceramic packages for image sensor modules that are used in mobile smart phones; ceramic packages for miniaturized chip-type supercapacitors; and high-power LED packages. This chapter will cover the development and application of ceramics and ceramic composites with high thermal conductivity for the thermal management of integrated electronic packaging substrates such as high-power LED packaging, power device packaging, et cetera.
Author : Joachim Bill
Publisher : John Wiley & Sons
ISBN 13 : 3527613838
Total Pages : 313 pages
Book Rating : 4.5/5 (276 download)
Download or read book Precursor-Derived Ceramics written by Joachim Bill and published by John Wiley & Sons. This book was released on 2008-07-11 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: The production of high-purity ceramic materials from low-molecular weight, inorganic or organoelement precursors is a topic of increasing relevance within materials science. With this emerging technology it is possible to precisely tailor the properties of the ceramic material which enables new high-temperature or electronic applications. Every materials scientist and engineer involved in the research and development of new high-performance ceramic materials will find these results - presented at a recent workshop of the Max-Planck-Gesellschaft - of great importance for his own work.
Author : George Phillips
Publisher : Springer Science & Business Media
ISBN 13 : 940116973X
Total Pages : 165 pages
Book Rating : 4.4/5 (11 download)
Download or read book A Concise Introduction to Ceramics written by George Phillips and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 165 pages. Available in PDF, EPUB and Kindle. Book excerpt: To Cera1l1ics by George C. Phillips ~ V AN NOSTRAND REINHOLD ~ ~ ____ New York Copyright ('> 1991 by Van Nostrand Reinhold Softcover reprint of the hardcover 1 st edition 1991 Library of COnRreSS Catalog Card Number 91·19587 ISBN·13: 978·94·011--6975·2 All rights eserve r d. No part of this work covered by the copyright hereon may be rcproduccd or uscd in any form or by any means-graphic. electronic. or meehaniclli. including photocopying. recording. taping. or information storage and retrieval systems-without written permission of the publisher. Manufactured in the United States of America Published by Van Nostrand Reinhold 115 Fifth Avenue New York. New York 10003 Chapman and Ha ll 2-6 Boundary Row London. SEI SHN. England Thomas Nelson Australia 102 Dodds Street South Melbourne 3205 Victoria. Australia Nelson Canada 1120 Birchmounl Road Scarborough. Ontario M IK 5G4. Canada 16 15 14 13 12 II 10 9 8 7 6 5 4 3 2 Library or Congress Cataloging-in· Publication Data Phillips. George C . 1937- A concise inlrodu!;tion to ceramics/by George C. Phillips. p. cm. Includes bibliographical referen!;es and index. ISBN-13: 978-94-011--6975-2 e-ISBN-13: 978-94-011--6973-8 001:10: 1007/978-94-011--6973-8 I. Cerami!;s. L Tille.
Author : W. R. Bratschun
Publisher :
ISBN 13 :
Total Pages : 178 pages
Book Rating : 4.:/5 (31 download)
Download or read book Uses of Ceramics in Microelectronics written by W. R. Bratschun and published by . This book was released on 1971 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This survey is one of a series issued by the National Aeronautics and Space Administration as part of its Technology Utilization Program to disseminate information useful for general industrial applications. Uses of Ceramics in Microelectronics is addressed to management personnel concerned with electronic circuitry. It describes advances in the state of the art of passive components (insulators, resistors, and capacitors) of electronic devices. Requirements for the exploration of space have accelerated such advances, and they can be helpful in many additional ways. The electronics industry has become highly dependent on the interface between materials and devices. Improvements in passive components have kept pace with advances in active devices. Unanticipated benefits in design flexibility and tolerances to adverse environments have been discovered. Mass production of passive components can bring about wider use of ceramics in microelectronic systems. Both industrial processes and consumer products can thereby be improved. In the final chapter the authors have examined the interface between materials and devices as it affects microcircuitry, and have shown how technology is transferable from the aerospace community to many broad tasks in fulfilling human needs."--Foreword.
Author : Fred D. Barlow, III
Publisher : CRC Press
ISBN 13 : 1351837176
Total Pages : 373 pages
Book Rating : 4.3/5 (518 download)
Download or read book Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and published by CRC Press. This book was released on 2018-10-03 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
