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Buoyancy Driven Two Phase Flow And Boiling Heat Transfer In Narrow Vertical Channels
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Book Synopsis Buoyancy-driven Two Phase Flow and Boiling Heat Transfer in Narrow Vertical Channels by : Karl John Larson Geisler
Download or read book Buoyancy-driven Two Phase Flow and Boiling Heat Transfer in Narrow Vertical Channels written by Karl John Larson Geisler and published by . This book was released on 2007 with total page 806 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set) by :
Download or read book Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set) written by and published by World Scientific. This book was released on 2012-09-25 with total page 1582 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Book Synopsis Cooling of Microelectronic and Nanoelectronic Equipment by : Madhusudan Iyengar
Download or read book Cooling of Microelectronic and Nanoelectronic Equipment written by Madhusudan Iyengar and published by World Scientific. This book was released on 2014-08-25 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging. Contents:A Review of Cooling Road Maps for 3D Chip Packages (Dereje Agonafer)Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks (Karl J L Geisler and Avram Bar-Cohen)Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency (Bing Shi and Ankur Srivastava)Energy Reduction and Performance Maximization Through Improved Cooling (David Copeland)Optimal Choice of Heat Sinks from an Industrial Point of View (Clemens J M Lasance)Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems (Mehmet Arik and Enes Tamdogan)Recent Advance in Thermoelectric Devices for Electronics Cooling (Peng Wang)Energy Efficient Solid-State Cooling for Hot Spot Removal (Kazuaki Yazawa, Andrei Fedorov, Yogendra Joshi and Ali Shakouri)An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges (Amy S Fleischer)Estimation of Cooling Performance of Phase Change Material (PCM) Module (Masaru Ishizuka and Tomoyuki Hatakeyama)Optimization Under Uncertainty for Electronics Cooling Design (Karthik K Bodla, Jayathi Y Murthy and Suresh V Garimella)Hydrophilic CNT-Sintered Copper Composite Wick for Enhanced Cooling (Glen A Powell, Anuradha Bulusu, Justin A Weibel, Sungwon S Kim, Suresh V Garimella and Timothy S Fisher)A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double-Sided Cooling Schemes (Qihong Nie and Yogendra Joshi)Energy Efficiency and Reliability Risk Mitigation of Data Centers Through Prognostics and Health Management (Jun Dai, Michael Ohadi and Michael Pecht)Damage Pre-Cursors Based Assessment of Accrued Thermomechanical Damage and Remaining Useful Life in Field Deployed Electronics (Pradeep Lall, Mahendra Harsha, Kai Goebel and Jim Jones)Towards Embedded Cooling — Gen 3 Thermal Packaging Technology (Avram Bar-Cohen) Readership: Researchers, practitioners, and postgraduates in mechanical engineering, nanoelectronics, computer engineering, and electrical & electronic engineering. Keywords:Electronics Cooling;Electronics Packaging;Thermal Management;Thermal Sciences;Electronics Reliability;Thermoelectrics;Computational Heat Transfer;Liquid Cooling
Book Synopsis Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) by :
Download or read book Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set) written by and published by World Scientific. This book was released on 2014-10-23 with total page 1397 pages. Available in PDF, EPUB and Kindle. Book excerpt: remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Book Synopsis Flow Boiling Heat Transfer in Narrow Vertical Channels by :
Download or read book Flow Boiling Heat Transfer in Narrow Vertical Channels written by and published by Cuvillier Verlag. This book was released on 2004-10-14 with total page 136 pages. Available in PDF, EPUB and Kindle. Book excerpt: Saturated flow boiling heat transfer and flow visualization experiments were carried out in three vertical rectangular channels with dimensions (width×height) 2.0×4.0, 0.86×2.0 and 0.54×1.60 mm² (corresponding to hydraulic diameters 2.67, 1.20 and 0.81 mm, respectively). The channels were heated from three sides. Deionized water was used as the working fluid. The channel exit was at atmospheric pressure. Benchmark experiments of single-phase flow were also conducted for pressure drop and heat transfer. Experimental results show that for the 0.54×1.60 mm² channel, the singlephase friction factor is higher than predicted by well-accepted correlations, while for the other two channels it can be well correlated. The heat transfer performance for both laminar and turbulent regimes under asymmetric heating conditions is different from that under uniform heating conditions on which the existing correlations are based. Therefore single-phase heat transfer correlations were modified so that they could be incorporated into the two-phase heat transfer correlations employed for asymmetric heating conditions. For flow boiling, three basic flow patterns are observed for all the channels, viz., bubbly, slug and annular flow. However, based on the developed flow pattern maps, the transition from slug to annular flow for the 2.0×4.0 mm² channel occurs at a lower superficial vapor velocity than for the two small channels. This suggests that the nucleate boiling mechanism, which generally corresponds to slug flow, is more important for the two small channels. Saturated flow boiling heat transfer characteristics were investigated under different heat flux, mass flux and vapor quality. The experimental local heat transfer coefficient for the 2.0×4.0 mm² channel is in good agreement with the modified Kandlikar correlation and the Shah correlation. For the smaller channels (0.86×2.0 mm² and 0.54×1.60 mm²), the heat transfer characteristics are not dominated by the convective boiling mechanism. On the contrary, the nucleate boiling term of the Kandlikar correlation predicts the experimental heat transfer coefficient relatively well. Two new correlations have been developed in which the local two-phase heat transfer coefficient is related to the single-phase heat transfer coefficient by a twophase multiplier, which is a function of the Boiling number and thermodynamic vapor quality. The developed correlations show rather good agreement with experimental results.
Download or read book Applied mechanics reviews written by and published by . This book was released on 1948 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Convective Flow Boiling by : John C. Chen
Download or read book Convective Flow Boiling written by John C. Chen and published by CRC Press. This book was released on 2019-08-16 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises selected papers from the First International Conference on Convective Flow Boiling. The purpose of the conference is to examine state-of-science and recent developments in technology of flow boiling, i.e., boiling systems which are affected by convective flows.
Book Synopsis VDI Heat Atlas by : VDI Gesellschaft
Download or read book VDI Heat Atlas written by VDI Gesellschaft and published by Springer Science & Business Media. This book was released on 2010-07-21 with total page 1608 pages. Available in PDF, EPUB and Kindle. Book excerpt: For more than 50 years, the Springer VDI Heat Atlas has been an indispensable working means for engineers dealing with questions of heat transfer. Featuring 50% more content, this new edition covers most fields of heat transfer in industrial and engineering applications. It presents the interrelationships between basic scientific methods, experimental techniques, model-based analysis and their transfer to technical applications.
Book Synopsis Nanofluidics by : Efstathios E. (Stathis) Michaelides
Download or read book Nanofluidics written by Efstathios E. (Stathis) Michaelides and published by Springer. This book was released on 2014-05-19 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume offers a comprehensive examination of the subject of heat and mass transfer with nanofluids as well as a critical review of the past and recent research projects in this area. Emphasis is placed on the fundamentals of the transport processes using particle-fluid suspensions, such as nanofluids. The nanofluid research is examined and presented in a holistic way using a great deal of our experience with the subjects of continuum mechanics, statistical thermodynamics, and non-equilibrium thermodynamics of transport processes. Using a thorough database, the experimental, analytical, and numerical advances of recent research in nanofluids are critically examined and connected to past research with medium and fine particles as well as to functional engineering systems. Promising applications and technological issues of heat/mass transfer system design with nanofluids are also discussed. This book also: Provides a deep scientific analysis of nanofluids using classical thermodynamics and statistical thermodynamics to explain and interpret experimental observations Presents the theory and experimental results for both thermodynamic and transport properties Examines all transport properties and transport processes as well as their relationships through the pertinent macroscopic coefficients Combines recent knowledge pertaining to nanofluids with the previous fifty years of research on particulate flows, including research on transient flow and heat transfer of particulate suspensions Conducts an holistic examination of the material from more than 500 archival publications
Book Synopsis Proceedings of the ASME Heat Transfer Division by : R. A. Nelson
Download or read book Proceedings of the ASME Heat Transfer Division written by R. A. Nelson and published by . This book was released on 1998 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Proceedings of the ASME Heat Transfer Division by :
Download or read book Proceedings of the ASME Heat Transfer Division written by and published by . This book was released on 1998 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Transport Phenomena in Heat and Mass Transfer by : J.A. Reizes
Download or read book Transport Phenomena in Heat and Mass Transfer written by J.A. Reizes and published by Elsevier. This book was released on 2012-12-02 with total page 833 pages. Available in PDF, EPUB and Kindle. Book excerpt: Theoretical, numerical and experimental studies of transport phenomena in heat and mass transfer are reported in depth in this volume. Papers are presented which review and discuss the most recent developments in areas such as: Mass transfer; Cooling of electronic components; Phase change processes; Instrumentation techniques; Numerical methods; Heat transfer in rotating machinery; Hypersonic flows; and Industrial applications. Bringing together the experience of specialists in these fields, the volume will be of interest to researchers and practising engineers who wish to enhance their knowledge in these rapidly developing areas.
Book Synopsis Boiling Heat Transfer And Two-Phase Flow by : L S Tong
Download or read book Boiling Heat Transfer And Two-Phase Flow written by L S Tong and published by CRC Press. This book was released on 1997-02-01 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: Completely updated, this graduate text describes the current state of boiling heat transfer and two-phase flow, in terms through which students can attain a consistent understanding. Prediction of real or potential boiling heat transfer behaviour, both in steady and transient states, is covered to aid engineering design of reliable and effective systems.
Book Synopsis Critical Heat Flux in Flow Boiling in Microchannels by : Sujoy Kumar Saha
Download or read book Critical Heat Flux in Flow Boiling in Microchannels written by Sujoy Kumar Saha and published by Springer. This book was released on 2015-06-04 with total page 62 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Brief concerns the important problem of critical heat flux in flow boiling in microchannels. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to “Heat Transfer and Pressure Drop in Flow Boiling in Microchannels,” by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.
Book Synopsis Journal of Electronic Packaging by :
Download or read book Journal of Electronic Packaging written by and published by . This book was released on 2008 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Heat Transfer 1994 by : G. F. Hewitt
Download or read book Heat Transfer 1994 written by G. F. Hewitt and published by CRC Press. This book was released on 1994 with total page 660 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Nuclear Science Abstracts written by and published by . This book was released on 1976-05 with total page 912 pages. Available in PDF, EPUB and Kindle. Book excerpt:
