Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

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Publisher : Springer Science & Business Media
ISBN 13 : 1475731590
Total Pages : 195 pages
Book Rating : 4.4/5 (757 download)

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Book Synopsis Benefiting from Thermal and Mechanical Simulation in Micro-Electronics by : G.Q. Zhang

Download or read book Benefiting from Thermal and Mechanical Simulation in Micro-Electronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 195 pages. Available in PDF, EPUB and Kindle. Book excerpt: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

Benefiting from thermal and mechanical simulation in (micro)-electronics

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ISBN 13 : 9782780398065
Total Pages : pages
Book Rating : 4.3/5 (98 download)

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Book Synopsis Benefiting from thermal and mechanical simulation in (micro)-electronics by : GQ Zhang

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Annual Report

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Publisher :
ISBN 13 : 9780780370548
Total Pages : 699 pages
Book Rating : 4.3/5 (75 download)

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Book Synopsis Annual Report by : Conference on Electrical Insulation and Dielectric Phenomena

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Special Issue: Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems

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Publisher :
ISBN 13 :
Total Pages : 172 pages
Book Rating : 4.:/5 (249 download)

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Book Synopsis Special Issue: Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems by : L. J. Ernst

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2004 International Conference on Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems

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ISBN 13 :
Total Pages : pages
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Book Synopsis 2004 International Conference on Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems by : IEEE Components, Packaging and Manufacturing Technology Society Staff

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Eurosim[E] 2000

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ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (112 download)

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Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (EuroSimE)

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Publisher :
ISBN 13 :
Total Pages : 167 pages
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Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Micro-systems (EuroSimE 2009)

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ISBN 13 :
Total Pages : 0 pages
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2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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ISBN 13 :
Total Pages : pages
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Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Micro-systems (EuroSimE 2010)

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Total Pages : 0 pages
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2006 International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Micro-Systems

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ISBN 13 :
Total Pages : 382 pages
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Book Synopsis 2006 International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Micro-Systems by : Institute of Electrical and Electronics Engineers

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Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-Electronics and Micro-Systems

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ISBN 13 :
Total Pages : 0 pages
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Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Microsystems (EuroSimE 2014)

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ISBN 13 :
Total Pages : 140 pages
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Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

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ISBN 13 :
Total Pages : 61 pages
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Thermal & Mechanical Simulation and Modeling on Nano- and Micro-scale Materials for Applications in Electronics Packaging

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ISBN 13 :
Total Pages : 26 pages
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Book Synopsis Thermal & Mechanical Simulation and Modeling on Nano- and Micro-scale Materials for Applications in Electronics Packaging by : Zhili Hu

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Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Micro-systems (EuroSimE 2007)

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Total Pages : pages
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Book Synopsis Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Micro-systems (EuroSimE 2007) by : Artur Wymysłowski

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Thermal, Mechanical and Multi-physics Simulation and Experiments in Micro-electronics and Micro-systems (EuroSimE 2006).

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ISBN 13 :
Total Pages : 58 pages
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