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Automated Inspection Of Solder Joints For Surface Mount Technology
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Book Synopsis Automated Inspection of Solder Joints for Surface Mount Technology by : National Aeronautics and Space Adm Nasa
Download or read book Automated Inspection of Solder Joints for Surface Mount Technology written by National Aeronautics and Space Adm Nasa and published by . This book was released on 2020-07 with total page 38 pages. Available in PDF, EPUB and Kindle. Book excerpt: Researchers at NASA/GSFC evaluated various automated inspection systems (AIS) technologies using test boards with known defects in surface mount solder joints. These boards were complex and included almost every type of surface mount device typical of critical assemblies used for space flight applications: X-ray radiography; X-ray laminography; Ultrasonic Imaging; Optical Imaging; Laser Imaging; and Infrared Inspection. Vendors, representative of the different technologies, inspected the test boards with their particular machine. The results of the evaluation showed limitations of AIS. Furthermore, none of the AIS technologies evaluated proved to meet all of the inspection criteria for use in high-reliability applications. It was found that certain inspection systems could supplement but not replace manual inspection for low-volume, high-reliability, surface mount solder joints. Savage, Robert M. and Park, Hyun Soo and Fan, Mark S. Goddard Space Flight Center NASA-TM-104580, NAS 1.15:104580, REPT-93B00035 RTOP 310-39-09-01-25 AUTOMATIC CONTROL; DEFECTS; INSPECTION; NONDESTRUCTIVE TESTS; SOLDERS; SUPPORTS; IMAGING TECHNIQUES; INFRARED INSPECTION; LASER APPLICATIONS; RADIOGRAPHY; ULTRASONICS; X RAYS
Book Synopsis Automated Inspection of Solder Joints for Surface Mount Technology by : Robert M. Savage
Download or read book Automated Inspection of Solder Joints for Surface Mount Technology written by Robert M. Savage and published by . This book was released on 1993 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Automated Inspection of Soldered Joints for Surface Mount Technology by : Robert M. Savage
Download or read book Automated Inspection of Soldered Joints for Surface Mount Technology written by Robert M. Savage and published by . This book was released on 1993 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Automatic Inspection of Solder Joints on Surface Mount PCBs by : James Mahon
Download or read book Automatic Inspection of Solder Joints on Surface Mount PCBs written by James Mahon and published by . This book was released on 1991 with total page 15 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Automated Optical Inspection by : Fouad Sabry
Download or read book Automated Optical Inspection written by Fouad Sabry and published by One Billion Knowledgeable. This book was released on 2024-05-14 with total page 137 pages. Available in PDF, EPUB and Kindle. Book excerpt: What is Automated Optical Inspection Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) manufacture where a camera autonomously scans the device under test for both catastrophic failure and quality defects. It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-re-flow as well as other stages. How you will benefit (I) Insights, and validations about the following topics: Chapter 1: Automated Optical Inspection Chapter 2: Printed Circuit Board Chapter 3: Ball Grid Array Chapter 4: Surface-mount Technology Chapter 5: Gerber Format Chapter 6: Reflow Oven Chapter 7: Reflow Soldering Chapter 8: Rework (Electronics) Chapter 9: Solder Paste Chapter 10: Selective Soldering (II) Answering the public top questions about automated optical inspection. (III) Real world examples for the usage of automated optical inspection in many fields. Who this book is for Professionals, undergraduate and graduate students, enthusiasts, hobbyists, and those who want to go beyond basic knowledge or information for any kind of Automated Optical Inspection.
Book Synopsis Automatic Surface Mount Solder Joints Inspection by : Zhu Liu
Download or read book Automatic Surface Mount Solder Joints Inspection written by Zhu Liu and published by . This book was released on 1992 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Surface Mount Technology by : Ray Prasad
Download or read book Surface Mount Technology written by Ray Prasad and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 791 pages. Available in PDF, EPUB and Kindle. Book excerpt: A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Book Synopsis Improving SMT (Surface Mount Technology) Circuit Board Inspection with 3D Vision by : Mike Juha
Download or read book Improving SMT (Surface Mount Technology) Circuit Board Inspection with 3D Vision written by Mike Juha and published by . This book was released on 1987 with total page 12 pages. Available in PDF, EPUB and Kindle. Book excerpt: Automated inspection has been a topic of great interest for the past several years, particularly when it addressed surface mount technology (SMT). While SMT makes smaller, lighter, more capable products possible, SMT also makes assembling circuits more challenging. With closer contact spacings, complex device packages, and many contacts under the devices themselves, automated SMT assembly has become a necessity. Robots or dedicated machines place components automatically on substrates. In turn, these substrates are wave or reflow soldered with automated equipment. However, inspection automation has not kept up with progress in automated component placement and soldering. This paper explores the reasons for the lag in automating inspection, and suggests a solution using 3D vision and quantitative quality models similar to those used by inspection personnel. (Author).
Book Synopsis Surface-mount Technology for PC Boards by : Glenn R. Blackwell
Download or read book Surface-mount Technology for PC Boards written by Glenn R. Blackwell and published by Delmar Thomson Learning. This book was released on 2006 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to generate high manufacturing yields, low testing costs, and reproducible designs using the latest components of surface mount technology (SMT)! Manufacturers, managers, engineers, students, and others who work with printed-circuit boards will find a wealth of cutting-edge information about SMT and fine pitch technology (FPT) in this new edition. Practical data and clear illustrations combine to clearly and accurately present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for today's miniaturized electronics packaging.
Book Synopsis Advancing Surface Mount Technology by : Stephen McClelland
Download or read book Advancing Surface Mount Technology written by Stephen McClelland and published by . This book was released on 1988 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is devoted to the study of univariate distributions appropriate for the analyses of data known to be nonnegative. The book includes much material from reliability theory in engineering and survival analysis in medicine.
Book Synopsis Fine Pitch Surface Mount Technology by : Phil Marcoux
Download or read book Fine Pitch Surface Mount Technology written by Phil Marcoux and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.
Book Synopsis Handbook of Surface Mount Technology by : Stephen W. Hinch
Download or read book Handbook of Surface Mount Technology written by Stephen W. Hinch and published by Longman Scientific and Technical. This book was released on 1988 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Surface Mount and Related Technologies by : Gerald L. Ginsberg
Download or read book Surface Mount and Related Technologies written by Gerald L. Ginsberg and published by CRC Press. This book was released on 1989-04-24 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Lead-free Soldering Process Development and Reliability by : Jasbir Bath
Download or read book Lead-free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-07-28 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Book Synopsis Solder Paste in Electronics Packaging by : Jennie Hwang
Download or read book Solder Paste in Electronics Packaging written by Jennie Hwang and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
Book Synopsis Surface Mount Technology by : Charles-Henri Mangin
Download or read book Surface Mount Technology written by Charles-Henri Mangin and published by Springer. This book was released on 1987 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Soldering Handbook For Printed Circuits and Surface Mounting by : Howard H. Manko
Download or read book Soldering Handbook For Printed Circuits and Surface Mounting written by Howard H. Manko and published by Springer Science & Business Media. This book was released on 1995-10-31 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
