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Author : Per Mårtensson
Publisher : Uppsala Universitet
ISBN 13 : 9789155443771
Total Pages : 45 pages
Book Rating : 4.4/5 (437 download)
Download or read book Atomic Layer Epitaxy of Copper written by Per Mårtensson and published by Uppsala Universitet. This book was released on 1999 with total page 45 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Thomas Wächtler
Publisher : Thomas Waechtler
ISBN 13 : 3941003178
Total Pages : 247 pages
Book Rating : 4.9/5 (41 download)
Download or read book Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices written by Thomas Wächtler and published by Thomas Waechtler. This book was released on 2010 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Liqi Wu
Publisher :
ISBN 13 :
Total Pages : 167 pages
Book Rating : 4.:/5 (14 download)
Download or read book Integration of Atomic Layer Deposition-grown Copper for Advanced Interconnect Applications written by Liqi Wu and published by . This book was released on 2008 with total page 167 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Nicola Pinna
Publisher : John Wiley & Sons
ISBN 13 : 3527639926
Total Pages : 463 pages
Book Rating : 4.5/5 (276 download)
Download or read book Atomic Layer Deposition of Nanostructured Materials written by Nicola Pinna and published by John Wiley & Sons. This book was released on 2012-09-19 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: Atomic layer deposition, formerly called atomic layer epitaxy, was developed in the 1970s to meet the needs of producing high-quality, large-area fl at displays with perfect structure and process controllability. Nowadays, creating nanomaterials and producing nanostructures with structural perfection is an important goal for many applications in nanotechnology. As ALD is one of the important techniques which offers good control over the surface structures created, it is more and more in the focus of scientists. The book is structured in such a way to fi t both the need of the expert reader (due to the systematic presentation of the results at the forefront of the technique and their applications) and the ones of students and newcomers to the fi eld (through the first part detailing the basic aspects of the technique). This book is a must-have for all Materials Scientists, Surface Chemists, Physicists, and Scientists in the Semiconductor Industry.
Author : Toivo T. Kodas
Publisher : John Wiley & Sons
ISBN 13 : 3527615849
Total Pages : 562 pages
Book Rating : 4.5/5 (276 download)
Download or read book The Chemistry of Metal CVD written by Toivo T. Kodas and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: High purity, thin metal coatings have a variety of important commercial applications, for example, in the microelectronics industry, as catalysts, as protective and decorative coatings as well as in gas-diffusion barriers. This book offers detailed, up- to-date coverage of the chemistry behind the vapor deposition of different metals from organometallic precursors. In nine chapters, the CVD of metals including aluminum, tungsten, gold, silver, platinum, palladium, nickel, as well as copper from copper(I) and copper(II) compounds is covered. The synthesis and properties of the precursors, the growth process, morphology, quality and adhesion of the resulting films as well as laser- assisted, ion- assisted and plasma-assisted methods are discussed. Present applications and prospects for future developments are summarized. With ca. 1000 references and a glossary, this book is a unique source of in-depth information. It is indispensable for chemists, physicists, engineers and materials scientists working with metal- coating processes and technologies. From Reviews: 'I highly recommend this book to anyone interested in learning more about the chemistry of metal CVD.' J. Am Chem. Soc.
Author : Tobias Törndahl
Publisher :
ISBN 13 : 9789155460815
Total Pages : 57 pages
Book Rating : 4.4/5 (68 download)
Download or read book Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates written by Tobias Törndahl and published by . This book was released on 2004 with total page 57 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Cheol Seong Hwang
Publisher : Springer Science & Business Media
ISBN 13 : 146148054X
Total Pages : 266 pages
Book Rating : 4.4/5 (614 download)
Download or read book Atomic Layer Deposition for Semiconductors written by Cheol Seong Hwang and published by Springer Science & Business Media. This book was released on 2013-10-18 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.
Author : Peter J. Hesketh
Publisher : Springer Science & Business Media
ISBN 13 : 038746283X
Total Pages : 300 pages
Book Rating : 4.3/5 (874 download)
Download or read book BioNanoFluidic MEMS written by Peter J. Hesketh and published by Springer Science & Business Media. This book was released on 2007-11-15 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains biosensor development fundamentals. It also initiates awareness in engineers and scientists who would like to develop and implement novel biosensors for agriculture, biomedicine, homeland security, environmental needs, and disease identification. In addition, the book introduces and lays the basic foundation for design, fabrication, testing, and implementation of next generation biosensors through hands-on learning.
Author : Yosi Shacham-Diamand
Publisher : Springer Science & Business Media
ISBN 13 : 0387958681
Total Pages : 545 pages
Book Rating : 4.3/5 (879 download)
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Download or read book Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices written by and published by . This book was released on 2006 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Copper-based multi-level metallization systems in today's ultralarge-scale integrated electronic circuits require the fabrication of diffusion barriers and conductive seed layers for the electrochemical metal deposition. Such films of only several nanometers in thickness have to be deposited void-free and conformal in patterned dielectrics. The envisaged further reduction of the geometric dimensions of the interconnect system calls for coating techniques that circumvent the drawbacks of the well-established physical vapor deposition. The atomic layer deposition method (ALD) allows depositing films on the nanometer scale conformally both on three-dimensional objects as well as on large-area substrates. The present work therefore is concerned with the development of an ALD process to grow copper oxide films based on the metal-organic precursor bis(tri-n- butylphosphane)copper(I)acetylacetonate [(nBu3P)2Cu(acac)]. This liquid, non-fluorinated & beta;-diketonate is brought to react with a mixture of water vapor and oxygen at temperatures from 100 to 160°C. Typical ALD-like growth behavior arises between 100 and 130°C, depending on the respective substrate used. On tantalum nitride and silicon dioxide substrates, smooth films and self-saturating film growth, typical for ALD, are obtained. On ruthenium substrates, positive deposition results are obtained as well. However, a considerable intermixing of the ALD copper oxide with the underlying films takes place. Tantalum substrates lead to a fast self-decomposition of the copper precursor. As a consequence, isolated nuclei or larger particles are always obtained together with continuous films. The copper oxide films grown by ALD can be reduced to copper by vapor-phase processes. If formic acid is used as the reducing agent, these processes can already be carried out at similar temperatures as the ALD, so that agglomeration of the films is largely avoided. Also for an integration with.
Author : Ana Londergan
Publisher : The Electrochemical Society
ISBN 13 : 1566775736
Total Pages : 300 pages
Book Rating : 4.5/5 (667 download)
Download or read book Atomic Layer Deposition Applications 3 written by Ana Londergan and published by The Electrochemical Society. This book was released on 2007 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuously expanding realm of Atomic Layer Deposition (ALD) Applications is the symposium focus. ALD can enable the precise deposition of ultra-thin, highly conformal coatings over complex 3D topography, with controlled composition and properties. Following two successful years, this symposium is well on its way to becoming a forum for the sharing of cutting edge research in the various areas where ALD is used.
Author : Electrochemical Society. High Temperature Materials Division
Publisher : The Electrochemical Society
ISBN 13 : 9781566771788
Total Pages : 1686 pages
Book Rating : 4.7/5 (717 download)
Download or read book Chemical Vapor Deposition written by Electrochemical Society. High Temperature Materials Division and published by The Electrochemical Society. This book was released on 1997 with total page 1686 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Xiao Hu
Publisher :
ISBN 13 : 9783961000531
Total Pages : pages
Book Rating : 4.0/5 (5 download)
Download or read book Multiscale Simulation of Metallic Copper and Copper Oxide Atomic Layer Deposition from Cu Beta-diketonates written by Xiao Hu and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Oluwatobi Adeleke
Publisher : CRC Press
ISBN 13 : 1003803334
Total Pages : 353 pages
Book Rating : 4.0/5 (38 download)
Download or read book Machine Learning-Based Modelling in Atomic Layer Deposition Processes written by Oluwatobi Adeleke and published by CRC Press. This book was released on 2023-12-15 with total page 353 pages. Available in PDF, EPUB and Kindle. Book excerpt: While thin film technology has benefited greatly from artificial intelligence (AI) and machine learning (ML) techniques, there is still much to be learned from a full-scale exploration of these technologies in atomic layer deposition (ALD). This book provides in-depth information regarding the application of ML-based modeling techniques in thin film technology as a standalone approach and integrated with the classical simulation and modeling methods. It is the first of its kind to present detailed information regarding approaches in ML-based modeling, optimization, and prediction of the behaviors and characteristics of ALD for improved process quality control and discovery of new materials. As such, this book fills significant knowledge gaps in the existing resources as it provides extensive information on ML and its applications in film thin technology. Offers an in-depth overview of the fundamentals of thin film technology, state-of-the-art computational simulation approaches in ALD, ML techniques, algorithms, applications, and challenges. Establishes the need for and significance of ML applications in ALD while introducing integration approaches for ML techniques with computation simulation approaches. Explores the application of key techniques in ML, such as predictive analysis, classification techniques, feature engineering, image processing capability, and microstructural analysis of deep learning algorithms and generative model benefits in ALD. Helps readers gain a holistic understanding of the exciting applications of ML-based solutions to ALD problems and apply them to real-world issues. Aimed at materials scientists and engineers, this book fills significant knowledge gaps in existing resources as it provides extensive information on ML and its applications in film thin technology. It also opens space for future intensive research and intriguing opportunities for ML-enhanced ALD processes, which scale from academic to industrial applications. . .
Author : Manuel P. Soriaga
Publisher : Springer Science & Business Media
ISBN 13 : 1461507758
Total Pages : 362 pages
Book Rating : 4.4/5 (615 download)
Download or read book Thin Films: Preparation, Characterization, Applications written by Manuel P. Soriaga and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is about thin films; what they are, how they are prepared, how they are characterized, and what they are used for. The contents of this book not only showcase the diversity of thin films, but also reveals the commonality among the work performed in a variety of areas. The chapters in this volume are based on invited papers presented by prominent researchers in the field at a Symposium on "Thin Films: Preparation, Characterization, Applications" at the 221st National Meeting of the American Chemical Society held in San Diego, California. The coverage of the symposium was extensive; topics ranged from highly-ordered metal adlayers on well-defined electrode surfaces to bio-organic films on non-metallic nanoparticles. An objective of this book is for the readers to be able to draw from the experience and results of others in order to improve and expand the understanding of the science and technology of their own thin films systems.
Author : Tommi Kääriäinen
Publisher : John Wiley & Sons
ISBN 13 : 1118062779
Total Pages : 274 pages
Book Rating : 4.1/5 (18 download)
Download or read book Atomic Layer Deposition written by Tommi Kääriäinen and published by John Wiley & Sons. This book was released on 2013-05-28 with total page 274 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the first edition was published in 2008, Atomic Layer Deposition (ALD) has emerged as a powerful, and sometimes preferred, deposition technology. The new edition of this groundbreaking monograph is the first text to review the subject of ALD comprehensively from a practical perspective. It covers ALD's application to microelectronics (MEMS) and nanotechnology; many important new and emerging applications; thermal processes for ALD growth of nanometer thick films of semiconductors, oxides, metals and nitrides; and the formation of organic and hybrid materials.
Author :
Publisher :
ISBN 13 :
Total Pages : 856 pages
Book Rating : 4.3/5 (91 download)
Download or read book NASA Technical Note written by and published by . This book was released on 1969 with total page 856 pages. Available in PDF, EPUB and Kindle. Book excerpt:
