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An Experimental Study Of The Behavior Of Additives Cl Peg And Sps During Acidic Copper Electrodeposition
Download An Experimental Study Of The Behavior Of Additives Cl Peg And Sps During Acidic Copper Electrodeposition full books in PDF, epub, and Kindle. Read online An Experimental Study Of The Behavior Of Additives Cl Peg And Sps During Acidic Copper Electrodeposition ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Book Synopsis An Experimental Study of the Behavior of Additives (Cl-, PEG and SPS) During Acidic Copper Electrodeposition by : Min Tan
Download or read book An Experimental Study of the Behavior of Additives (Cl-, PEG and SPS) During Acidic Copper Electrodeposition written by Min Tan and published by . This book was released on 2004 with total page 164 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II by : G. S. Mathad
Download or read book Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics II written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2003 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrochemical Processes in ULSI and MEMS by : Hariklia Deligianni
Download or read book Electrochemical Processes in ULSI and MEMS written by Hariklia Deligianni and published by The Electrochemical Society. This book was released on 2005 with total page 494 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics by :
Download or read book Copper Interconnects, New Contact Metallurgies/structures, and Low-k Interlevel Dielectrics written by and published by The Electrochemical Society. This book was released on 2003 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Meeting Abstracts by : Electrochemical Society
Download or read book Meeting Abstracts written by Electrochemical Society and published by . This book was released on 2002 with total page 1020 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by : Yosi Shacham-Diamand
Download or read book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Book Synopsis Microelectronic Packaging by : M. Datta
Download or read book Microelectronic Packaging written by M. Datta and published by CRC Press. This book was released on 2004-12-20 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Book Synopsis Electrodeposition of Copper Using Additive-containing Low Metal Ion Concentration Electrolytes for EnFACE Applications by : Eden May B. Dela Pena
Download or read book Electrodeposition of Copper Using Additive-containing Low Metal Ion Concentration Electrolytes for EnFACE Applications written by Eden May B. Dela Pena and published by . This book was released on 2017 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decade a new electrodeposition process called Electrochemical nano and micro Fabrication by flow and Chemistry (EnFACE) was developed which enabled mask-less pattern transfers onto a metallic substrate. EnFACE uses a novel acid-free, additive-free plating electrolyte containing low concentrations of metal salts (0.1 MCuSO4), as the process requires electroplating under conditions of fast kinetics and low electrolyte conductivity. However, for electronic applications,industry requires the use of additives, which improve deposit properties such as thickness uniformity, strength, ductility, and conductivity. The use of pulsed current is also known to improve deposit properties such as grain structure, mechanical strength and throwing power. Therefore, in order to use EnFACE for fabrication of industrially useful products, the effect of additives on the electrochemical behaviour and deposit properties of this process needs to be assessed. In addition, the influence of current modulation; i.e. direct current vs pulsed current, on deposit properties also warrants investigation. Potentiodynamic polarisation experiments were performed on additive-free and additive-containing EnFACE electrolyte (0.1 M CuSO4). The additives tested were Copper Gleam A, Copper Gleam B, and chloride ions (Cl−). The effect of two parameters: (i) additive type and (ii) additive concentration, on cathode polarisation were studied.Copper films were electroplated on stainless steel substrates from electrolytes containing different concentrations of plating additives (0%, 17%, 33%, 50%, 100%,200% of the industry recommended additive concentration). Both direct current (DC)ABSTRACT|ii and pulsed current (PC) plating were used. The deposit was characterised using scanning electron microscope (SEM), electron back scattered diffraction (EBSD),tensile test machine (UTM), four-point probe and X-ray diffraction (XRD).Cathode polarisation occurred when the additives were used individually. Thecombination of Copper Gleam B and Cl- suggested synergistic inhibition, particularly in the diffusion-limited region. The addition of Copper Gleam A to the CopperGleam B-Cl− mix increased the limiting current and suggested plating acceleration.These effects are interpreted in terms of the adsorption-desorption behavior of the additives on the cathode surface. SEM and EBSD images indicated that additives caused a concentration dependent decrease in the grain size of the deposit in both the DC and PC plated deposit. This grain refinement resulted in an increase in yield and tensile strength,but reduced the ductility and resistivity of deposits. The PC-plated copper from theEnFACE electrolytes generally possessed better mechanical properties than its DC-plated counterparts, though both plating modes created copper films that can meet industry standards. The optimum additive concentration for the EnFACE electrolyte was 50% of the recommended value when using DC plating; while the optimum was only 33% when using PC plating.
Book Synopsis Influence of Current Density Upon Additive Agent Behavior During Acid Copper Electrodeposition by : Colin Lloyd Edwards
Download or read book Influence of Current Density Upon Additive Agent Behavior During Acid Copper Electrodeposition written by Colin Lloyd Edwards and published by . This book was released on 1997 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Journal of the Electrochemical Society by :
Download or read book Journal of the Electrochemical Society written by and published by . This book was released on 2009 with total page 1020 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Dissertation Abstracts International by :
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2003 with total page 860 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis An in Situ Surface Stress Study of Electrochemical Phenomena by : Thomas Heaton
Download or read book An in Situ Surface Stress Study of Electrochemical Phenomena written by Thomas Heaton and published by . This book was released on 2011 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the last decade copper electrodeposition has become the dominant process by which microelectronic interconnects are made. Replacing ultra-high vacuum evaporative film growth, the technology known as the Cu damascene process has been widely implemented in the microelectronics industry since the early 2000s. The transition from vacuum film growth to electrodeposition was enabled by solution chemistries that provide "bottom-up" or superfilling capability of vias and trenches. While the process has been and is used widely, the actual mechanisms responsible for superfilling remain relatively unknown. This dissertation presents and discusses the background and results of experimental investigations that have been done using in situ electrochemical surface stress monitoring techniques to study the evolution of stress on Cu{111} thin film electrodes. Because of its extreme sensitivity to the structure on both the electrode and solution sides of the interface, surface stress monitoring as analytical technique is well suited for the study of electrodeposition. These ultra-high resolution stress measurements reveal the dynamic response of copper electrodes to a number of electrochemical and chemical experimental variables. In the case of constant current pulsed deposition and stripping, the surface stress evolution depends not only on the magnitude of the current pulse, but also shows a marked response to plating bath composition. The plating bath chemistries used in this work include (1) additive free, (2) deposition suppressing solutions that include polyethylene glycol (PEG) and sodium chloride (NaCl) as well as (3) full additive solution combinations which contain PEG, NaCl, and a one of two deposition accelerating species (bis-(sodiumsulfopropyl)disulfide (SPS) or mercaptopropane sulfonic acid (MPS)). The development of thin film stress is further investigated through a series of solution exchange experiments that correlate the magnitude of electrode exchange current density and the stress state of the film. Remarkably, stress changes as large as ~8.5 N/m are observed during solution exchanges at the open circuit potential. Overall, this research demonstrates that solution chemistry can have a large impact on thin film stress evolution, even for very small deposition thicknesses (e.g.
Book Synopsis The Decomposition of the Sulfonate Additive SPS in Acid Copper Electroplating Chemistries by : Aaron Frank
Download or read book The Decomposition of the Sulfonate Additive SPS in Acid Copper Electroplating Chemistries written by Aaron Frank and published by . This book was released on 2002 with total page 182 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Novel Alkaline Copper Electroplating Processes for Applications in Interconnect Metallization by : Aniruddha A. Joi
Download or read book Novel Alkaline Copper Electroplating Processes for Applications in Interconnect Metallization written by Aniruddha A. Joi and published by . This book was released on 2013 with total page 170 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electrical interconnects in microchips, present in just about every electronic device, are currently formed by bottom-up electroplating of copper within etched nano-scale features. The copper is plated from an acidified copper plating bath in the presence of special additives that provide the current distribution essential bottom-up fill. However, as the copper interconnects will become smaller in future generation microprocessors, a drastic redesign of the current process steps is required. Achieving a uniform copper seed layer by vapor deposition techniques becomes increasingly difficult at geometries that are less than about 20 nanometers wide. A proposed alternative is the bottom-up fill of features by directly plating copper onto a vapor deposited ruthenium barrier layer that can be deposited uniformly and provides the requisite conductivity. However, the conventional acidic copper plating solution cannot provide sufficient adhesion and uniformity on top of ruthenium. A chemistry that provides high nucleation density of Cu on Ru needs to be designed. Furthermore, bottom-up fill capability from this chemistry is also desired. We describe here a novel alkaline, tartrate-complexed copper electrolyte that provides high nucleation density on ruthenium and in the presence of special additives, also provides bottom-up fill. High nucleation density (> 1011 nuclei/cm2) on ruthenium is obtained by current pulsing in the alkaline tartrate-complexed electrolyte. Bottom-up fill is achieved using a mixture of two additives: bis-(3-sulfopropyl) disulfide (SPS) and polyethyleneimine (PEI). Chronopotentiometric studies indicate that, unlike in conventional acidic electrolytes, SPS acts as a s̀uppressor{8217} and PEI acts as an ànti-suppressor{8217} in the alkaline media. Partial-fill experiments on patterned structures confirm the required SPS-PEI interaction leading to bottom-up fill from the tartrate-complexed copper electrolyte. Furthermore, we extend the versatility of these alkaline complexed electrolytes by reporting electrodeposition of copper germanide (Cu3Ge) thin films from an alkaline tartrate-complexed electrolyte. Using current pulsing, co-deposition of copper and germanium in the stoichiometric ratio Cu:Ge=3:1 is achieved while maintaining a smooth and compact electrodeposit. X-ray diffraction confirms the presence of e-Cu3Ge phase with a monoclinic crystal structure in the as-deposited films. Effects of mass-transfer and kinetics in Cu3Ge pulse plating are modeled providing good agreement with the experimental data.
Book Synopsis In Situ Vibrational Spectroscopic and Electrochemical Study of Electrodeposition Additives on Copper Surfaces by : Mary Ellen Biggin
Download or read book In Situ Vibrational Spectroscopic and Electrochemical Study of Electrodeposition Additives on Copper Surfaces written by Mary Ellen Biggin and published by . This book was released on 2001 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrochemical Processing in ULSI Fabrication and Semiconductor/metal Deposition II by : Panayotis C. Andricacos
Download or read book Electrochemical Processing in ULSI Fabrication and Semiconductor/metal Deposition II written by Panayotis C. Andricacos and published by The Electrochemical Society. This book was released on 1999 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Handbook of Surface Plasmon Resonance by : Richard B. M. Schasfoort
Download or read book Handbook of Surface Plasmon Resonance written by Richard B. M. Schasfoort and published by Royal Society of Chemistry. This book was released on 2017-05-30 with total page 555 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface plasmon resonance (SPR) plays a dominant role in real-time interaction sensing of biomolecular binding events, this book provides a total system description including optics, fluidics and sensor surfaces for a wide researcher audience.
