Advances In Chemical Mechanical Planarization Cmp

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Advances in Chemical Mechanical Planarization (CMP)

Author : Babu Suryadevara
Publisher : Woodhead Publishing
ISBN 13 : 0128218193
Total Pages : 650 pages
Book Rating : 4.1/5 (282 download)

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Book Synopsis Advances in Chemical Mechanical Planarization (CMP) by : Babu Suryadevara

Download or read book Advances in Chemical Mechanical Planarization (CMP) written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Advances in Chemical Mechanical Planarization (CMP)

Author : Suryadevara Babu
Publisher : Woodhead Publishing
ISBN 13 : 0081002181
Total Pages : 536 pages
Book Rating : 4.0/5 (81 download)

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Book Synopsis Advances in Chemical Mechanical Planarization (CMP) by : Suryadevara Babu

Download or read book Advances in Chemical Mechanical Planarization (CMP) written by Suryadevara Babu and published by Woodhead Publishing. This book was released on 2016-01-09 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Chemical-Mechanical Planarization of Semiconductor Materials

Author : M.R. Oliver
Publisher : Springer Science & Business Media
ISBN 13 : 9783540431817
Total Pages : 444 pages
Book Rating : 4.4/5 (318 download)

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Book Synopsis Chemical-Mechanical Planarization of Semiconductor Materials by : M.R. Oliver

Download or read book Chemical-Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2004-01-26 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Advances in CMP Polishing Technologies

Author : Toshiro Doi
Publisher : William Andrew
ISBN 13 : 1437778593
Total Pages : 330 pages
Book Rating : 4.4/5 (377 download)

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Book Synopsis Advances in CMP Polishing Technologies by : Toshiro Doi

Download or read book Advances in CMP Polishing Technologies written by Toshiro Doi and published by William Andrew. This book was released on 2011-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Advances and Challenges in Chemical Mechanical Planarization: Volume 991

Author : Gerfried Zwicker
Publisher : Cambridge University Press
ISBN 13 : 9781558999510
Total Pages : 0 pages
Book Rating : 4.9/5 (995 download)

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Book Synopsis Advances and Challenges in Chemical Mechanical Planarization: Volume 991 by : Gerfried Zwicker

Download or read book Advances and Challenges in Chemical Mechanical Planarization: Volume 991 written by Gerfried Zwicker and published by Cambridge University Press. This book was released on 2007-11-13 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization (CMP) has been a leading-edge technology in semiconductor processing for the past 15−20 years. A successful CMP process is based in fundamental science across the disciplines of mechanical engineering, chemical engineering, colloid science, materials science and chemistry. Traditionally, the MRS Spring Meeting serves as a nexus for multidisciplinary interaction and discussion between CMP researchers in both industry and academia. The papers in this book are from the 2007 MRS Spring Meeting and address the fluid and wear mechanics that occur when using CMP tools and pad/slurry consumables, as well as the surface mechanisms required for effective post-CMP cleaning. It also focuses on new successes and challenges in technologies such as electrochemical mechanical planarization (eCMP), three-dimensional integration and advanced CMP process modeling and control strategies.

Microelectronic Applications of Chemical Mechanical Planarization

Author : Yuzhuo Li
Publisher : John Wiley & Sons
ISBN 13 : 0471719196
Total Pages : 764 pages
Book Rating : 4.4/5 (717 download)

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Book Synopsis Microelectronic Applications of Chemical Mechanical Planarization by : Yuzhuo Li

Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Chemical Mechanical Planarization of Microelectronic Materials

Author : Joseph M. Steigerwald
Publisher : John Wiley & Sons
ISBN 13 : 3527617752
Total Pages : 337 pages
Book Rating : 4.5/5 (276 download)

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Book Synopsis Chemical Mechanical Planarization of Microelectronic Materials by : Joseph M. Steigerwald

Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

Advances in Chemical-Mechanical Polishing: Volume 816

Author : Materials Research Society. Meeting
Publisher :
ISBN 13 :
Total Pages : 318 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Advances in Chemical-Mechanical Polishing: Volume 816 by : Materials Research Society. Meeting

Download or read book Advances in Chemical-Mechanical Polishing: Volume 816 written by Materials Research Society. Meeting and published by . This book was released on 2004-09 with total page 318 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).

Chemical-Mechanical Planarization:

Author : Duane S. Boning
Publisher : Cambridge University Press
ISBN 13 : 9781107409415
Total Pages : 364 pages
Book Rating : 4.4/5 (94 download)

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Book Synopsis Chemical-Mechanical Planarization: by : Duane S. Boning

Download or read book Chemical-Mechanical Planarization: written by Duane S. Boning and published by Cambridge University Press. This book was released on 2014-06-05 with total page 364 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.

Run-to-Run Control in Semiconductor Manufacturing

Author : James Moyne
Publisher : CRC Press
ISBN 13 : 1420040669
Total Pages : 368 pages
Book Rating : 4.4/5 (2 download)

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Book Synopsis Run-to-Run Control in Semiconductor Manufacturing by : James Moyne

Download or read book Run-to-Run Control in Semiconductor Manufacturing written by James Moyne and published by CRC Press. This book was released on 2018-10-08 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: Run-to-run (R2R) control is cutting-edge technology that allows modification of a product recipe between machine "runs," thereby minimizing process drift, shift, and variability-and with them, costs. Its effectiveness has been demonstrated in a variety of processes, such as vapor phase epitaxy, lithography, and chemical mechanical planarization. The only barrier to the semiconductor industry's widespread adoption of this highly effective process control is a lack of understanding of the technology. Run to Run Control in Semiconductor Manufacturing overcomes that barrier by offering in-depth analyses of R2R control.

Advances in Abrasive Based Machining and Finishing Processes

Author : S. Das
Publisher : Springer Nature
ISBN 13 : 3030433129
Total Pages : 282 pages
Book Rating : 4.0/5 (34 download)

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Book Synopsis Advances in Abrasive Based Machining and Finishing Processes by : S. Das

Download or read book Advances in Abrasive Based Machining and Finishing Processes written by S. Das and published by Springer Nature. This book was released on 2020-05-10 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with abrasive particles.

Chemical Mechanical Planarization IV

Author : R. L. Opila
Publisher : The Electrochemical Society
ISBN 13 : 9781566772938
Total Pages : 350 pages
Book Rating : 4.7/5 (729 download)

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Book Synopsis Chemical Mechanical Planarization IV by : R. L. Opila

Download or read book Chemical Mechanical Planarization IV written by R. L. Opila and published by The Electrochemical Society. This book was released on 2001 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Handbook of Manufacturing Engineering and Technology

Author : Andrew Y. C. Nee
Publisher : Springer
ISBN 13 : 9781447146698
Total Pages : 0 pages
Book Rating : 4.1/5 (466 download)

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Book Synopsis Handbook of Manufacturing Engineering and Technology by : Andrew Y. C. Nee

Download or read book Handbook of Manufacturing Engineering and Technology written by Andrew Y. C. Nee and published by Springer. This book was released on 2014-10-31 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Springer Reference Work Handbook of Manufacturing Engineering and Technology provides overviews and in-depth and authoritative analyses on the basic and cutting-edge manufacturing technologies and sciences across a broad spectrum of areas. These topics are commonly encountered in industries as well as in academia. Manufacturing engineering curricula across universities are now essential topics covered in major universities worldwide.

Chemical-Mechanical Planarization: Volume 867

Author : A. Kumar
Publisher :
ISBN 13 :
Total Pages : 330 pages
Book Rating : 4.3/5 (91 download)

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Book Synopsis Chemical-Mechanical Planarization: Volume 867 by : A. Kumar

Download or read book Chemical-Mechanical Planarization: Volume 867 written by A. Kumar and published by . This book was released on 2005-07-19 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.

Atomic Layer Deposition for Semiconductors

Author : Cheol Seong Hwang
Publisher : Springer Science & Business Media
ISBN 13 : 146148054X
Total Pages : 266 pages
Book Rating : 4.4/5 (614 download)

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Book Synopsis Atomic Layer Deposition for Semiconductors by : Cheol Seong Hwang

Download or read book Atomic Layer Deposition for Semiconductors written by Cheol Seong Hwang and published by Springer Science & Business Media. This book was released on 2013-10-18 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.

Advanced Interconnects for ULSI Technology

Author : Mikhail Baklanov
Publisher : John Wiley & Sons
ISBN 13 : 1119966868
Total Pages : 616 pages
Book Rating : 4.1/5 (199 download)

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Book Synopsis Advanced Interconnects for ULSI Technology by : Mikhail Baklanov

Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Eco-Friendly Corrosion Inhibitors

Author : Lei Guo
Publisher : Elsevier
ISBN 13 : 0323998429
Total Pages : 578 pages
Book Rating : 4.3/5 (239 download)

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Book Synopsis Eco-Friendly Corrosion Inhibitors by : Lei Guo

Download or read book Eco-Friendly Corrosion Inhibitors written by Lei Guo and published by Elsevier. This book was released on 2022-06-21 with total page 578 pages. Available in PDF, EPUB and Kindle. Book excerpt: Eco-Friendly Corrosion Inhibitors: Principles, Designing, and Applications wraps up new developments in corrosion inhibitors and their current applications in real-life environments such as in strong acidic pickling and petroleum-based liquids. The book covers several types of environmentally-friendly corrosion inhibitors in detail. In addition, it highlights both established research and technology on industrial scale corrosion inhibitors and their rapidly emerging aspects and future research directions. Provides fundamental basics and applied practices of corrosion prevention at industrial scale Serves as a valuable reference for scientists and engineers who are searching modern design for industrial scale corrosion inhibitors Focuses on the most advanced industrial scale corrosion inhibitors, including current challenges during manufacturing Includes up-to-date reference material such as websites of interest and information about the latest research