Read Books Online and Download eBooks, EPub, PDF, Mobi, Kindle, Text Full Free.
Download A Thin Film Multifunction Sensor For Harsh Environments full books in PDF, epub, and Kindle. Read online A Thin Film Multifunction Sensor For Harsh Environments ebook anywhere anytime directly on your device. Fast Download speed and no annoying ads. We cannot guarantee that every ebooks is available!
Author : John D. Wrbanek
Publisher :
ISBN 13 :
Total Pages : 14 pages
Book Rating : 4.:/5 (317 download)
Download or read book A Thin Film Multifunction Sensor for Harsh Environments written by John D. Wrbanek and published by . This book was released on 2001 with total page 14 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book A Thin Film Multifunction Sensor for Harsh Environments... NASA written by and published by . This book was released on 1998 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book A THIN FILM MULTIFUNCTION SENSOR FOR HARSH ENVIRONMENTS... NASA/TM-2001-211075... DEC. 6, 2001 written by and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 450 pages
Book Rating : 4.0/5 ( download)
Download or read book 37th AIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit written by and published by . This book was released on 2001 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : National Aeronautics and Space Administration (NASA)
Publisher : Createspace Independent Publishing Platform
ISBN 13 : 9781721283651
Total Pages : 24 pages
Book Rating : 4.2/5 (836 download)
Download or read book Thin Film Sensors for Surface Measurements written by National Aeronautics and Space Administration (NASA) and published by Createspace Independent Publishing Platform. This book was released on 2018-06-20 with total page 24 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced thin film sensors that can provide accurate surface temperature, strain, and heat flux measurements have been developed at NASA Glenn Research Center. These sensors provide minimally intrusive characterization of advanced propulsion materials and components in hostile, high-temperature environments as well as validation of propulsion system design codes. The sensors are designed for applications on different material systems and engine components for testing in engine simulation facilities. Thin film thermocouples and strain gauges for the measurement of surface temperature and strain have been demonstrated on metals, ceramics and advanced ceramic-based composites of various component configurations. Test environments have included both air-breathing and space propulsion-based engine and burner rig environments at surface temperatures up to 1100 C and under high gas flow and pressure conditions. The technologies developed for these sensors as well as for a thin film heat flux gauge have been integrated into a single multifunctional gauge for the simultaneous real-time measurement of surface temperature, strain, and heat flux. This is the first step toward the development of smart sensors with integrated signal conditioning and high temperature electronics that would have the capability to provide feedback to the operating system in real-time. A description of the fabrication process for the thin film sensors and multifunctional gauge will be provided. In addition, the material systems on which the sensors have been demonstrated, the test facilities and the results of the tests to-date will be described. Finally, the results will be provided of the current effort to demonstrate the capabilities of the multifunctional gauge. Martin, Lisa C. and Wrbanek, John D. and Fralick, Gustave C. Glenn Research Center NASA/TM-2001-211149, E-13001, NAS 1.15:211149
Author : Jih-Fen Lei
Publisher :
ISBN 13 :
Total Pages : pages
Book Rating : 4.:/5 (11 download)
Download or read book Thin Film Sensors for Minimally-intrusive Measurements in Harsh High Temperature Environment written by Jih-Fen Lei and published by . This book was released on 1998 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 16 pages
Book Rating : 4.:/5 (317 download)
Download or read book Thin Film Sensors for Surface Measurements written by and published by . This book was released on 2001 with total page 16 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Erma Yulihastin
Publisher : Springer Nature
ISBN 13 : 9811903085
Total Pages : 1006 pages
Book Rating : 4.8/5 (119 download)
Download or read book Proceedings of the International Conference on Radioscience, Equatorial Atmospheric Science and Environment and Humanosphere Science, 2021 written by Erma Yulihastin and published by Springer Nature. This book was released on 2022-09-29 with total page 1006 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents recent advances in the area of Radioscience, Equatorial Atmospheric Science and Environment from the international symposium for equatorial atmosphere of the celebration of the Equatorial Atmosphere Radar (EAR) 20th Anniversary, conducted by Indonesian National Institute of Aeronautics and Space (LAPAN) and Kyoto University, in 2021. It provides a scientific platform for all participants to discuss ideas and current issues as well as to design solutions in the areas of atmospheric science, environmental science, space science, and related fields.
Author : Amanda Schrand
Publisher : CRC Press
ISBN 13 : 1003857183
Total Pages : 187 pages
Book Rating : 4.0/5 (38 download)
Download or read book Resilient Hybrid Electronics for Extreme/Harsh Environments written by Amanda Schrand and published by CRC Press. This book was released on 2024-06-06 with total page 187 pages. Available in PDF, EPUB and Kindle. Book excerpt: The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.
Author :
Publisher :
ISBN 13 :
Total Pages : 942 pages
Book Rating : 4.3/5 (243 download)
Download or read book Monthly Catalog of United States Government Publications written by and published by . This book was released on 1995 with total page 942 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Bin Li
Publisher : Open Dissertation Press
ISBN 13 : 9781374721616
Total Pages : 166 pages
Book Rating : 4.7/5 (216 download)
Download or read book STUDY OF INTEGRATED SEMICONDUC written by Bin Li and published by Open Dissertation Press. This book was released on 2017-01-27 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt: This dissertation, "A study of integrated semiconductor thin-film sensors on sio2/si substrate" by Bin, Li, 李斌, was obtained from The University of Hong Kong (Pokfulam, Hong Kong) and is being sold pursuant to Creative Commons: Attribution 3.0 Hong Kong License. The content of this dissertation has not been altered in any way. We have altered the formatting in order to facilitate the ease of printing and reading of the dissertation. All rights not granted by the above license are retained by the author. Abstract: Abstract of thesis entitled A STUDY OF INTERGATED SEMICONDUCTOR THIN-FILM SENSORS ON SiO /Si SUBSTRATE submitted by Bin Li for the degree of Doctor of Philosophy at the University of Hong Kong in April 2001 With the development of the information technology, the need for miniaturized, intelligent and programmable sensors is rapidly increasing. To meet this trend, developing thin-film sensors on silicon substrate is of great importance. In this thesis, two areas are focused on. One is spreading-resistance temperature (SRT) sensor on silicon on insulator (SOI), while the other is the multi-function thin-film microsensor on SiO /Si substrate. Based on the principle of minority-carrier exclusion effect, SRT sensor on bulk Si is intensively studied. Optimizations of structural parameters and processing conditions on thermal characteristics of SRT sensors are carried out. With appropriately small electrode and high substrate doping, bulk SRT sensor can function at temperatures up to 400 C at a low current of 2 mA. ii SRT sensor on SOI is then investigated with emphasis on its resistance versus temperature (R-T), low-temperature and AC characteristics. Moreover, the effect of Si- film thickness on the maximum operating temperature (T ) is simulated and verified by max experiment results. When the silicon film is sufficiently thin, i.e. 0.1 μm, T can be max significantly raised up to 550 C, even at a very low bias current of 1 μA. Measurements under low-temperature or AC condition reveal that SRT sensor behaves like a conventional resistor. A new microsensor consisting of a thin-film resistor and a metal-insulator- semiconductor (MIS) capacitor is developed by depositing perovskite-type thin film on SiO /Si substrate. SrNb Ti O, Ba La TiO and Ba La Nb Ti O chosen as the 2 x 1-x 3 1-x x 3 1-x x y 1-y 3 sensing film present reasonable multi-function sensitivities to light, heat and humidity. Differences in the sensing properties of the films are related to their chemical compositions and grain boundaries. It is hoped that by varying the chemical composition, processing conditions of the film, better performance could be obtained. Finally, the effects of device structure on the sensitivities of perovskite thin-film microsensors are discussed. A new physical model is proposed for humidity-sensitive MIS capacitor with a metal-perovskite-SiO -Si structure. Based on this model, it is deduced that higher sensitivity of thinner film is due to higher porosity of the film. However, thinner film results in lower sensitivity to illumination due to poorer absorption, iii while the film thickness only has minor effects on the thermal sensitivity. The effects of SiO thickness are studied and experimental results demonstrate that an optimal value of 250 A gives rise to good multi-function sensitivities. The dependence of electrical properties of photoresistor on device dimension is investigated. Devices with smaller electrode spacings show reasonably linear I-V characteristics. Moreover, heat treatment in O for an optimal time can increase the photo sensitivity by suppressing dark current. In conclusion, SOI SRT sensors and perovskite-oxide thin-film microsensors are promising candidates for integrated sensor applications.
Author : Valentin Korman
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 296 pages
Book Rating : 4.3/5 (91 download)
Download or read book Sensors for Propulsion Measurement Applications written by Valentin Korman and published by SPIE-International Society for Optical Engineering. This book was released on 2006 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author :
Publisher :
ISBN 13 :
Total Pages : 32 pages
Book Rating : 4.:/5 (962 download)
Download or read book HEAT Sensor written by and published by . This book was released on 2016 with total page 32 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document is the final report for the "HARSH ENVIRONMENT ADAPTABLE THERMIONIC SENSOR" project under NETL's Crosscutting contract DE-FE0013062. This report addresses sensors that can be made with thermionic thin films along with the required high temperature hermetic packaging process. These sensors can be placed in harsh high temperature environments and potentially be wireless and self-powered.
Author : National Aeronautics and Space Adm Nasa
Publisher :
ISBN 13 : 9781724016874
Total Pages : 30 pages
Book Rating : 4.0/5 (168 download)
Download or read book Durability Evaluation of a Thin Film Sensor System with Enhanced Lead Wire Attachments on Sic/Sic Ceramic Matrix Composites written by National Aeronautics and Space Adm Nasa and published by . This book was released on 2018-09-25 with total page 30 pages. Available in PDF, EPUB and Kindle. Book excerpt: An advanced thin film sensor system instrumented on silicon carbide (SiC) fiber reinforced SiC matrix ceramic matrix composites (SiC/SiC CMCs), was evaluated in a Mach 0.3 burner rig in order to determine its durability to monitor material/component surface temperature in harsh environments. The sensor system included thermocouples in a thin film form (5 microns thick), fine lead wires (75 microns diameter), and the bonds between these wires and the thin films. Other critical components of the overall system were the heavy, swaged lead wire cable (500 microns diameter) that contained the fine lead wires and was connected to the temperature readout, and ceramic attachments which were bonded onto the CMCs for the purpose of securing the lead wire cables, The newly developed ceramic attachment features a combination of hoops made of monolithic SiC or SiC/SiC CMC (which are joined to the test article) and high temperature ceramic cement. Two instrumented CMC panels were tested in a burner rig for a total of 40 cycles to 1150 C (2100 F). A cycle consisted of rapid heating to 1150 C (2100 F), a 5 minute hold at 1150 C (2100 F), and then cooling down to room temperature in 2 minutes. The thin film sensor systems provided repeatable temperature measurements for a maximum of 25 thermal cycles. Two of the monolithic SiC hoops debonded during the sensor fabrication process and two of the SiC/SiC CMC hoops failed during testing. The hoops filled with ceramic cement, however, showed no sign of detachment after 40 thermal cycle test. The primary failure mechanism of this sensor system was the loss of the fine lead wire-to-thin film connection, which either due to detachment of the fine lead wires from the thin film thermocouples or breakage of the fine wire. Lei, Jih-Fen and Kiser, J. Douglas and Singh, Mrityunjay and Cuy, Mike and Blaha, Charles A. and Androjna, Drago Glenn Research Center NASA/TM-2000-209917, E-12154, NAS 1.15:209917...
Author : Petru Ciureanu
Publisher : CRC Press
ISBN 13 :
Total Pages : 520 pages
Book Rating : 4.F/5 ( download)
Download or read book Thin Film Resistive Sensors, written by Petru Ciureanu and published by CRC Press. This book was released on 1992 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a complete overview of thin film resistive sensors.devoted to thin-film devices. Each type of input energy is discussed in a separate chapter. Detailed descriptions are given of the materials, properties, structure and principles of operation of the sensors as well as their main applications. Results of the authors' research and comprehensive reviews of the current literature are included. The scope of this book and its accessible style make it a valuable reference work to graduate scientists and engineers in many disciplines. Written for scientists and engineers using or developing thin film sensors.
Author : Toan Dinh
Publisher : Springer
ISBN 13 : 9811325715
Total Pages : 122 pages
Book Rating : 4.8/5 (113 download)
Download or read book Thermoelectrical Effect in SiC for High-Temperature MEMS Sensors written by Toan Dinh and published by Springer. This book was released on 2018-10-05 with total page 122 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the fundamentals of the thermoelectrical effect in silicon carbide (SiC), including the thermoresistive, thermoelectric, thermocapacitive and thermoelectronic effects. It summarizes the growth of SiC, its properties and fabrication processes for SiC devices and introduces the thermoelectrical sensing theories in different SiC morphologies and polytypes. Further, it reviews the recent advances in the characterization of the thermoelectrical effect in SiC at high temperatures. Discussing several desirable features of thermoelectrical SiC sensors and recent developments in these sensors, the book provides useful guidance on developing high sensitivity and linearity, fast-response SiC sensing devices based on thermoelectrical effects.
Author :
Publisher :
ISBN 13 :
Total Pages : 600 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings of IEEE Sensors ... written by and published by . This book was released on 2004 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt:
