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A Network Model For Electromigration Failure Of Interconnects
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Book Synopsis Principles and Practices of Interconnection Networks by : William James Dally
Download or read book Principles and Practices of Interconnection Networks written by William James Dally and published by Elsevier. This book was released on 2004-03-06 with total page 581 pages. Available in PDF, EPUB and Kindle. Book excerpt: One of the greatest challenges faced by designers of digital systems is optimizing the communication and interconnection between system components. Interconnection networks offer an attractive and economical solution to this communication crisis and are fast becoming pervasive in digital systems. Current trends suggest that this communication bottleneck will be even more problematic when designing future generations of machines. Consequently, the anatomy of an interconnection network router and science of interconnection network design will only grow in importance in the coming years.This book offers a detailed and comprehensive presentation of the basic principles of interconnection network design, clearly illustrating them with numerous examples, chapter exercises, and case studies. It incorporates hardware-level descriptions of concepts, allowing a designer to see all the steps of the process from abstract design to concrete implementation. - Case studies throughout the book draw on extensive author experience in designing interconnection networks over a period of more than twenty years, providing real world examples of what works, and what doesn't. - Tightly couples concepts with implementation costs to facilitate a deeper understanding of the tradeoffs in the design of a practical network. - A set of examples and exercises in every chapter help the reader to fully understand all the implications of every design decision.
Book Synopsis Electromigration in ULSI Interconnections by : Cher Ming Tan
Download or read book Electromigration in ULSI Interconnections written by Cher Ming Tan and published by World Scientific. This book was released on 2010 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.
Book Synopsis High-Speed VLSI Interconnections by : Ashok K. Goel
Download or read book High-Speed VLSI Interconnections written by Ashok K. Goel and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Book Synopsis Handbook of Performability Engineering by : Krishna B. Misra
Download or read book Handbook of Performability Engineering written by Krishna B. Misra and published by Springer Science & Business Media. This book was released on 2008-08-24 with total page 1331 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dependability and cost effectiveness are primarily seen as instruments for conducting international trade in the free market environment. These factors cannot be considered in isolation of each other. This handbook considers all aspects of performability engineering. The book provides a holistic view of the entire life cycle of activities of the product, along with the associated cost of environmental preservation at each stage, while maximizing the performance.
Book Synopsis Index to IEEE Publications by : Institute of Electrical and Electronics Engineers
Download or read book Index to IEEE Publications written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1998 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues for 1973- cover the entire IEEE technical literature.
Book Synopsis Fundamentals of Electromigration-Aware Integrated Circuit Design by : Jens Lienig
Download or read book Fundamentals of Electromigration-Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 171 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Book Synopsis Electromigration Inside Logic Cells by : Gracieli Posser
Download or read book Electromigration Inside Logic Cells written by Gracieli Posser and published by Springer. This book was released on 2016-11-26 with total page 134 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes new and effective methodologies for modeling, analyzing and mitigating cell-internal signal electromigration in nanoCMOS, with significant circuit lifetime improvements and no impact on performance, area and power. The authors are the first to analyze and propose a solution for the electromigration effects inside logic cells of a circuit. They show in this book that an interconnect inside a cell can fail reducing considerably the circuit lifetime and they demonstrate a methodology to optimize the lifetime of circuits, by placing the output, Vdd and Vss pin of the cells in the less critical regions, where the electromigration effects are reduced. Readers will be enabled to apply this methodology only for the critical cells in the circuit, avoiding impact in the circuit delay, area and performance, thus increasing the lifetime of the circuit without loss in other characteristics.
Book Synopsis Reliability of RoHS-Compliant 2D and 3D IC Interconnects by : John H. Lau
Download or read book Reliability of RoHS-Compliant 2D and 3D IC Interconnects written by John H. Lau and published by McGraw Hill Professional. This book was released on 2010-10-22 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration
Book Synopsis Electromigration in ULSI Interconnections by : Cher Ming Tan
Download or read book Electromigration in ULSI Interconnections written by Cher Ming Tan and published by World Scientific. This book was released on 2010 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration in ULSI Interconnections provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electro migration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained. The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electro migration are presented in a concise and rigorous manner.Methods of numerical modeling for the interconnect electro migration and their applications to the understanding of electro migration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electro migration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electro migration are outlined and discussed.
Book Synopsis Quantum and Semi-classical Percolation and Breakdown in Disordered Solids by : Asok K. Sen
Download or read book Quantum and Semi-classical Percolation and Breakdown in Disordered Solids written by Asok K. Sen and published by Springer Science & Business Media. This book was released on 2009-03-20 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt: This lecture notes in physics volume mainly focuses on the semi classical and qu- tum aspects of percolation and breakdown in disordered, composite or granular s- tems. The main reason for this undertaking has been the fact that, of late, there have been a lot of (theoretical) work on quantum percolation, but there is not even a (single) published review on the topic (and, of course, no book). Also, there are many theoretical and experimental studies on the nonlinear current-voltage characteristics both away from, as well as one approaches, an electrical breakdown in composite materials. Some of the results are quite intriguing and may broadly be explained utilising a semi classical (if not, fully quantum mechanical) tunnelling between - cron or nano-sized metallic islands dispersed separated by thin insulating layers, or in other words, between the dangling ends of small percolation clusters. There have also been several (theoretical) studies of Zener breakdown in Mott or Anderson in- lators. Again, there is no review available, connecting them in any coherent fashion. A compendium volume connecting these experimental and theoretical studies should be unique and very timely, and hence this volume. The book is organised as follows. For completeness, we have started with a short and concise introduction on classical percolation. In the ?rst chapter, D. Stauffer reviews the scaling theory of classical percolation emphasizing (biased) diffusion, without any quantum effects. The next chapter by A. K.
Book Synopsis Masters Theses in the Pure and Applied Sciences by : Wade H. Shafer
Download or read book Masters Theses in the Pure and Applied Sciences written by Wade H. Shafer and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 427 pages. Available in PDF, EPUB and Kindle. Book excerpt: Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 39 (thesis year 1994) a total of 13,953 thesis titles from 21 Canadian and 159 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 39 reports theses submitted in 1994, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.
Book Synopsis Bio-Inspired Models of Network, Information, and Computing Systems by : Gianni A. Di Caro
Download or read book Bio-Inspired Models of Network, Information, and Computing Systems written by Gianni A. Di Caro and published by Springer. This book was released on 2014-07-08 with total page 325 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the thoroughly refereed post-conference proceedings of the 7th International Conference on Bio-Inspired Models of Network, Information and Computing Systems (Bionetics 2012), held in Lugano, Switzerland, in December 2012. The 23 revised full papers presented were carefully reviewed and selected from 40 submissions. They cover topics such as networking, robotics and neural networks, molecular scale and bioinformatics, optimization and bio-inspired modeling in various fields.
Download or read book Physical Review written by and published by . This book was released on 1994-07 with total page 1786 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publishes papers that report results of research in statistical physics, plasmas, fluids, and related interdisciplinary topics. There are sections on (1) methods of statistical physics, (2) classical fluids, (3) liquid crystals, (4) diffusion-limited aggregation, and dendritic growth, (5) biological physics, (6) plasma physics, (7) physics of beams, (8) classical physics, including nonlinear media, and (9) computational physics.
Book Synopsis Scientific and Technical Aerospace Reports by :
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 836 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Electrothermal Analysis of VLSI Systems by : Yi-Kan Cheng
Download or read book Electrothermal Analysis of VLSI Systems written by Yi-Kan Cheng and published by Springer Science & Business Media. This book was released on 2005-12-01 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.
Book Synopsis Reliability Engineering and Services by : Tongdan Jin
Download or read book Reliability Engineering and Services written by Tongdan Jin and published by John Wiley & Sons. This book was released on 2019-03-11 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offers a holistic approach to guiding product design, manufacturing, and after-sales support as the manufacturing industry transitions from a product-oriented model to service-oriented paradigm This book provides fundamental knowledge and best industry practices in reliability modelling, maintenance optimization, and service parts logistics planning. It aims to develop an integrated product-service system (IPSS) synthesizing design for reliability, performance-based maintenance, and spare parts inventory. It also presents a lifecycle reliability-inventory optimization framework where reliability, redundancy, maintenance, and service parts are jointly coordinated. Additionally, the book aims to report the latest advances in reliability growth planning, maintenance contracting and spares inventory logistics under non-stationary demand condition. Reliability Engineering and Service provides in-depth chapter coverage of topics such as: Reliability Concepts and Models; Mean and Variance of Reliability Estimates; Design for Reliability; Reliability Growth Planning; Accelerated Life Testing and Its Economics; Renewal Theory and Superimposed Renewals; Maintenance and Performance-Based Logistics; Warranty Service Models; Basic Spare Parts Inventory Models; Repairable Inventory Systems; Integrated Product-Service Systems (IPPS), and Resilience Modeling and Planning Guides engineers to design reliable products at a low cost Assists service engineers in providing superior after-sales support Enables managers to respond to the changing market and customer needs Uses end-of-chapter case studies to illustrate industry best practice Lifecycle approach to reliability, maintenance and spares provisioning Reliability Engineering and Service is an important book for graduate engineering students, researchers, and industry-based reliability practitioners and consultants.
Book Synopsis Electromigration in Metals by : Paul S. Ho
Download or read book Electromigration in Metals written by Paul S. Ho and published by Cambridge University Press. This book was released on 2022-05-12 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
