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2021 Ieee International Meeting For Future Electron Devices Kansai Imfedk
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Download or read book IMFEDK2021 written by and published by . This book was released on 2021 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis The Proceedings of the 18th Annual Conference of China Electrotechnical Society by : Qingxin Yang
Download or read book The Proceedings of the 18th Annual Conference of China Electrotechnical Society written by Qingxin Yang and published by Springer Nature. This book was released on with total page 876 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Book Synopsis Micro and Nanoelectronics Devices, Circuits and Systems by : Trupti Ranjan Lenka
Download or read book Micro and Nanoelectronics Devices, Circuits and Systems written by Trupti Ranjan Lenka and published by Springer Nature. This book was released on 2022-09-12 with total page 519 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents select proceedings of the International Conference on Micro and Nanoelectronics Devices, Circuits and Systems (MNDCS-2022). The book includes cutting-edge research papers in the emerging fields of micro and nanoelectronics devices, circuits, and systems from experts working in these fields over the last decade. The book is a unique collection of chapters from different areas with a common theme and is immensely useful to academic researchers and practitioners in the industry who work in this field.
Book Synopsis Smart Energy and Advancement in Power Technologies by : Kumari Namrata
Download or read book Smart Energy and Advancement in Power Technologies written by Kumari Namrata and published by Springer Nature. This book was released on 2022-11-08 with total page 869 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises peer-reviewed proceedings of the International Conference on Smart Energy and Advancement in Power Technologies (ICSEAPT-2021). The book includes peer-reviewed papers on renewable energy economics and policy, renewable energy resource assessment, operations management and sustainability, energy audit, global warming, waste and resource management, green energy deployment, green buildings, integration of green energy, energy efficiency, etc. The book serves as a valuable reference resource for academics and researchers across the globe.
Book Synopsis HEMT Technology and Applications by : Trupti Ranjan Lenka
Download or read book HEMT Technology and Applications written by Trupti Ranjan Lenka and published by Springer Nature. This book was released on 2022-06-23 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers two broad domains: state-of-the-art research in GaN HEMT and Ga2O3 HEMT. Each technology covers materials system, band engineering, modeling and simulations, fabrication techniques, and emerging applications. The book presents basic operation principles of HEMT, types of HEMT structures, and semiconductor device physics to understand the device behavior. The book presents numerical modeling of the device and TCAD simulations for high-frequency and high-power applications. The chapters include device characteristics of HEMT including 2DEG density, Id-Vgs, Id-Vds, transconductance, linearity, and C-V. The book emphasizes the state-of-the-art fabrication techniques of HEMT and circuit design for various applications in low noise amplifier, oscillator, power electronics, and biosensor applications. The book focuses on HEMT applications to meet the ever-increasing demands of the industry, innovation in terms of materials, design, modeling, simulation, processes, and circuits. The book will be primarily helpful to undergraduate/postgraduate, researchers, and practitioners in their research.
Book Synopsis Transport Phenomena in Micro- and Nanoscale Functional Materials and Devices by : Joao B. Sousa
Download or read book Transport Phenomena in Micro- and Nanoscale Functional Materials and Devices written by Joao B. Sousa and published by William Andrew. This book was released on 2021-03-23 with total page 485 pages. Available in PDF, EPUB and Kindle. Book excerpt: Transport Phenomena in Micro- and Nanoscale Functional Materials and Devices offers a pragmatic view on transport phenomena for micro- and nanoscale materials and devices, both as a research tool and as a means to implant new functions in materials. Chapters emphasize transport properties (TP) as a research tool at the micro/nano level and give an experimental view on underlying techniques. The relevance of TP is highlighted through the interplay between a micro/nanocarrier's characteristics and media characteristics: long/short-range order and disorder excitations, couplings, and in energy conversions. Later sections contain case studies on the role of transport properties in functional nanomaterials. This includes transport in thin films and nanostructures, from nanogranular films, to graphene and 2D semiconductors and spintronics, and from read heads, MRAMs and sensors, to nano-oscillators and energy conversion, from figures of merit, micro-coolers and micro-heaters, to spincaloritronics. - Presents a pragmatic description of electrical transport phenomena in micro- and nanoscale materials and devices from an experimental viewpoint - Provides an in-depth overview of the experimental techniques available to measure transport phenomena in micro- and nanoscale materials - Features case studies to illustrate how each technique works - Highlights emerging areas of interest in micro- and nanomaterial transport phenomena, including spintronics
Book Synopsis Advances in Clean Energy Technologies by : Prashant V. Baredar
Download or read book Advances in Clean Energy Technologies written by Prashant V. Baredar and published by Springer Nature. This book was released on 2021-05-30 with total page 1130 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents select proceedings of the international conference on Innovations in Clean Energy Technologies (ICET 2020) and examines a range of durable, energy efficient and next-generation smart green technologies for sustainable future by reflecting on the trends, advances and development taking place all across the globe. The topics covered include smart technologies based product, energy efficient systems, solar and wind energy, carbon sequestration, green transportation, green buildings, energy material, biomass energy, smart cites, hydro power, bio-energy and fuel cell. The book also discusses various performance attributes of these clean energy technologies and their workability and carbon footprint. The book will be a valuable reference for beginners, researchers and professionals interested in clean energy technologies.
Book Synopsis Statistical Trend Analysis of Physically Unclonable Functions by : Behrouz Zolfaghari
Download or read book Statistical Trend Analysis of Physically Unclonable Functions written by Behrouz Zolfaghari and published by CRC Press. This book was released on 2021-03-25 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physically Unclonable Functions (PUFs) translate unavoidable variations in certain parameters of materials, waves, or devices into random and unique signals. They have found many applications in the Internet of Things (IoT), authentication systems, FPGA industry, several other areas in communications and related technologies, and many commercial products. Statistical Trend Analysis of Physically Unclonable Functions first presents a review on cryptographic hardware and hardware-assisted cryptography. The review highlights PUF as a mega trend in research on cryptographic hardware design. Afterwards, the authors present a combined survey and research work on PUFs using a systematic approach. As part of the survey aspect, a state-of-the-art analysis is presented as well as a taxonomy on PUFs, a life cycle, and an established ecosystem for the technology. In another part of the survey, the evolutionary history of PUFs is examined, and strategies for further research in this area are suggested. In the research side, this book presents a novel approach for trend analysis that can be applied to any technology or research area. In this method, a text mining tool is used which extracts 1020 keywords from the titles of the sample papers. Then, a classifying tool classifies the keywords into 295 meaningful research topics. The popularity of each topic is then numerically measured and analyzed over the course of time through a statistical analysis on the number of research papers related to the topic as well as the number of their citations. The authors identify the most popular topics in four different domains; over the history of PUFs, during the recent years, in top conferences, and in top journals. The results are used to present an evolution study as well as a trend analysis and develop a roadmap for future research in this area. This method gives an automatic popularity-based statistical trend analysis which eliminates the need for passing personal judgments about the direction of trends, and provides concrete evidence to the future direction of research on PUFs. Another advantage of this method is the possibility of studying a whole lot of existing research works (more than 700 in this book). This book will appeal to researchers in text mining, cryptography, hardware security, and IoT.
Book Synopsis Applications in Electronics Pervading Industry, Environment and Society by : Sergio Saponara
Download or read book Applications in Electronics Pervading Industry, Environment and Society written by Sergio Saponara and published by Springer. This book was released on 2019-05-10 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication and control. The book is based on the 2018 ApplePies Conference, held in Pisa, Italy in September 2018, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean and efficient energy; the environment; and smart, green and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contribution in this endeavor.
Book Synopsis 3D Microelectronic Packaging by : Yan Li
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer. This book was released on 2016-10-29 with total page 560 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Book Synopsis Magnetic Nano- and Microwires by : Manuel Vázquez
Download or read book Magnetic Nano- and Microwires written by Manuel Vázquez and published by Woodhead Publishing. This book was released on 2015-05-27 with total page 847 pages. Available in PDF, EPUB and Kindle. Book excerpt: Magnetic nanowires and microwires are key tools in the development ofenhanced devices for information technology (memory and data processing) andsensing. Offering the combined characteristics of high density, high speed, andnon-volatility, they facilitate reliable control of the motion of magnetic domainwalls; a key requirement for the development of novel classes of logic and storagedevices. Part One introduces the design and synthesis of magnetic nanowires andmicrowires, reviewing the growth and processing of nanowires and nanowireheterostructures using such methods as sol-gel and electrodepositioncombinations, focused-electron/ion-beam-induced deposition, chemicalvapour transport, quenching and drawing and magnetic interactions. Magneticand transport properties, alongside domain walls, in nano- and microwiresare then explored in Part Two, before Part Three goes on to explore a widerange of applications for magnetic nano- and microwire devices, includingmemory, microwave and electrochemical applications, in addition to thermalspin polarization and configuration, magnetocalorific effects and Bloch pointdynamics. - Detailed coverage of multiple key techniques for the growth and processing of nanowires and microwires - Reviews the principles and difficulties involved in applying magnetic nano- and microwires to a wide range of applications - Combines the expertise of specialists from around the globe to give a broad overview of current and future trends
Book Synopsis 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB 3D) by : IEEE Staff
Download or read book 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB 3D) written by IEEE Staff and published by . This book was released on 2021-10-05 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This workshop will focus on low temperature bonding technologies which will ultimately lead to entirely new manufacturing approaches to 3D and heterogeneous integration of semiconductor devices and microsystems, as well as photonic systems The workshop invites papers presenting new developments in low temperature bonding technologies, new device applications, facilities and technologies for mass production, and basic science relating to these technologies
Book Synopsis Advanced Power MOSFET Concepts by : B. Jayant Baliga
Download or read book Advanced Power MOSFET Concepts written by B. Jayant Baliga and published by Springer Science & Business Media. This book was released on 2010-06-26 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: During the last decade many new concepts have been proposed for improving the performance of power MOSFETs. The results of this research are dispersed in the technical literature among journal articles and abstracts of conferences. Consequently, the information is not readily available to researchers and practicing engineers in the power device community. There is no cohesive treatment of the ideas to provide an assessment of the relative merits of the ideas. "Advanced Power MOSFET Concepts" provides an in-depth treatment of the physics of operation of advanced power MOSFETs. Analytical models for explaining the operation of all the advanced power MOSFETs will be developed. The results of numerical simulations will be provided to give additional insight into the device physics and validate the analytical models. The results of two-dimensional simulations will be provided to corroborate the analytical models and give greater insight into the device operation.
Book Synopsis Electronic Processes in Non-Crystalline Materials by : Sir Nevill Francis Mott
Download or read book Electronic Processes in Non-Crystalline Materials written by Sir Nevill Francis Mott and published by Oxford University Press. This book was released on 2012-02-02 with total page 605 pages. Available in PDF, EPUB and Kindle. Book excerpt: A reissue of a classic Oxford text. The book sets out theoretical concepts and makes comparisons with experiments for a wide variety of phenomena in non-crystalline materials.
Download or read book Chalcopyrite written by Deborah Cronin and published by Nova Science Publishers. This book was released on 2014 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chalcopyrite is the most abundant copper sulfide, the most recalcitrant to hydrometallurgical processing, and a good semiconductor with a wide variation in resistivity. The reactivity of chalcopyrite from different sources has been a controversial issue since the seventies. It is known that synthetic chalcopyrite is more reactive than natural samples. This book discusses the chemical composition, uses and occurrence of the copper iron sulfide mineral, chalcopyrite.
Book Synopsis Hydrogen in Crystalline Semiconductors by : Stephen J. Pearton
Download or read book Hydrogen in Crystalline Semiconductors written by Stephen J. Pearton and published by Springer Science & Business Media. This book was released on 2013-03-08 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt: vgl. Hardcoverausgabe.
Book Synopsis 3D Microelectronic Packaging by : Yan Li
Download or read book 3D Microelectronic Packaging written by Yan Li and published by Springer Nature. This book was released on 2020-11-23 with total page 629 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.