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Book Synopsis 2020 36th Semiconductor Thermal Measurement, Modeling and Management Symposium (SEMI THERM) by : IEEE Staff
Download or read book 2020 36th Semiconductor Thermal Measurement, Modeling and Management Symposium (SEMI THERM) written by IEEE Staff and published by . This book was released on 2020-03-16 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: SEMI THERM is an international forum dedicated to the thermal management and characterization of electronic components and systems It provides knowledge covering all thermal length scales from IC to facility level The symposium fosters the exchange of knowledge between thermal engineers, professionals and leading experts from industry as well as the exchange of information on the latest academic and industrial advances in electronics thermal management
Book Synopsis Thirty-third Annual Semiconductor Thermal Measurement and Management Symposium by : Paul Wesling
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Book Synopsis 2018 34th Thermal Measurement, Modeling and Management Symposium (SEMI THERM) by : IEEE Staff
Download or read book 2018 34th Thermal Measurement, Modeling and Management Symposium (SEMI THERM) written by IEEE Staff and published by . This book was released on 2018-03-19 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Semiconductor thermal management and modeling
Book Synopsis "2021 37th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)". by :
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Book Synopsis 2017 33rd Thermal Measurement, Modeling and Management Symposium (SEMI THERM) by : IEEE Staff
Download or read book 2017 33rd Thermal Measurement, Modeling and Management Symposium (SEMI THERM) written by IEEE Staff and published by . This book was released on 2017-03-13 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: SEMI THERM provides a forum for engineers, academics, and executives to learn, exchange ideas, and display the latest in thermal management techniques, products and services Attendees include anyone interested in thermal design, management and characterization of electronic systems and components
Book Synopsis 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). by :
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Book Synopsis 2014 IEEE/CPMT 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM 2014) by :
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Book Synopsis Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st by :
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Book Synopsis 2015 31st Thermal Measurement, Modeling and Management Symposium (SEMI THERM) by : IEEE Staff
Download or read book 2015 31st Thermal Measurement, Modeling and Management Symposium (SEMI THERM) written by IEEE Staff and published by . This book was released on 2015-03-15 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Dedicated topics include 3D electronics, CFD modeling, data centers, energy harvesting, high heat flux cooling, LEDs, measurement and characterization, medical and consumer electronics and more
Book Synopsis 2014 IEEE/CPMT 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM 2014) by :
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Book Synopsis Semiconductor Thermal and Temperature Measurement Symposium (SEMI-THERM). (Title Varies With: Semiconductor Thermal Measurement and Management Symposium). by :
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Book Synopsis Thermal Management Market Visions and Strategies by :
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Book Synopsis 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM 2015) by :
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Book Synopsis Semiconductor Thermal Measurement and Management Symposium, 2007. SEMI-THERM 2007. Twenty Third Annual IEEE. by :
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Book Synopsis Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE. by :
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Book Synopsis 2016 32nd Thermal Measurement, Modeling and Management Symposium (SEMI THERM) by : IEEE Staff
Download or read book 2016 32nd Thermal Measurement, Modeling and Management Symposium (SEMI THERM) written by IEEE Staff and published by . This book was released on 2016-03-14 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Dedicated topics include 3D electronic packaging, CFD modeling, Data Centers, energy harvesting, high heat flux cooling, LEDs, thermal measurement & characterization, thermal reliability, medical & consumer electronics, and more
Book Synopsis Direct Copper Interconnection for Advanced Semiconductor Technology by : Dongkai Shangguan
Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 463 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.
