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Author :
Publisher :
ISBN 13 : 9781538630426
Total Pages : pages
Book Rating : 4.6/5 (34 download)
Download or read book EPTC written by and published by . This book was released on 2017 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : IEEE Staff
Publisher :
ISBN 13 : 9781538630433
Total Pages : pages
Book Rating : 4.6/5 (34 download)
Download or read book 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) written by IEEE Staff and published by . This book was released on 2017-12-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging Advanced Flip chip, 2 5D & 3D, PoP, embedded passives & actives on substrates, System in Packaging, embedded chip packaging technologies, Panel level packaging, RF, Microwave & Millimeter wave, Power and Rugged Electronics Packaging etc TSV Wafer Level Packaging Wafer level packaging ( Fan in Fan out), embedded chip packaging, 2 5D 3D integration, TSV, Silicon & Glass interposer, RDL, bumping technologies, etc Interconnection Technologies Au Ag Cu Al Wire bond Wedge bond technology, Flip chip & Cu pillar, solder alternatives (ICP, ACP, ACF, NCP, ICA), Cu to Cu, Wafer level bonding & die attachment (Pb free) etc Emerging Technologies Packaging technologies for MEMS, biomedical, optoelectronics, Internet of things, photo voltaic, printed electronics, wearable electronics, Photonics, LED, etc Materials and Processing advanced materials such 3D materials, photoresist, polymer dielectrics, solder materials, die attach, underfill, Substrates, etc
Author :
Publisher :
ISBN 13 : 9781538676684
Total Pages : pages
Book Rating : 4.6/5 (766 download)
Download or read book 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC). written by and published by . This book was released on 2018 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 : 9781665416191
Total Pages : pages
Book Rating : 4.4/5 (161 download)
Download or read book 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) written by and published by . This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Márta Rencz
Publisher : MDPI
ISBN 13 : 303943831X
Total Pages : 310 pages
Book Rating : 4.0/5 (394 download)
Download or read book Thermal and Electro-thermal System Simulation 2020 written by Márta Rencz and published by MDPI. This book was released on 2021-01-12 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Author : Frank Suli
Publisher : Woodhead Publishing
ISBN 13 : 008102391X
Total Pages : 490 pages
Book Rating : 4.0/5 (81 download)
Download or read book Electronic Enclosures, Housings and Packages written by Frank Suli and published by Woodhead Publishing. This book was released on 2018-11-15 with total page 490 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more
Author : Peng Yu
Publisher : John Wiley & Sons
ISBN 13 : 3527833048
Total Pages : 389 pages
Book Rating : 4.5/5 (278 download)
Download or read book Integrated Nanophotonics written by Peng Yu and published by John Wiley & Sons. This book was released on 2023-05-31 with total page 389 pages. Available in PDF, EPUB and Kindle. Book excerpt: Integrated Nanophotonics Helps readers understand the important advances in nanophotonics materials development and their latest applications This book introduces the current state of and emerging trends in the development of integrated nanophotonics. Written by three well-qualified authors, it systematically reviews the knowledge of integrated nanophotonics from theory to the most recent technological developments. It also covers the applications of integrated nanophotonics in essential areas such as neuromorphic computing, biosensing, and optical communications. Lastly, it brings together the latest advancements in the key principles of photonic integrated circuits, plus the recent advances in tackling the barriers in photonic integrated circuits. Sample topics included in this comprehensive resource include: Platforms for integrated nanophotonics, including lithium niobate nanophotonics, indium phosphide nanophotonics, silicon nanophotonics, and nonlinear optics for integrated photonics The devices and technologies for integrated nanophotonics in on-chip light sources, optical packaging of photonic integrated circuits, optical interconnects, and light processing devices Applications on neuromorphic computing, biosensing, LIDAR, and computing for AI and artificial neural network and deep learning Materials scientists, physicists, and physical chemists can use this book to understand the totality of cutting-edge theory, research, and applications in the field of integrated nanophotonics.
Author :
Publisher :
ISBN 13 : 9781728138350
Total Pages : pages
Book Rating : 4.1/5 (383 download)
Download or read book 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) written by and published by . This book was released on 2019 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Electronics Packaging and Technology Conference
Publisher :
ISBN 13 : 9781467372695
Total Pages : pages
Book Rating : 4.3/5 (726 download)
Download or read book 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) written by Electronics Packaging and Technology Conference and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Annotation Advanced Packaging, TSV Wafer Level Packaging, Interconnection Technologies, Emerging Technologies, Materials and Processes, Electrical Modeling and Simulations Mechanical Modeling and Simulations Thermal Characterization & Cooling Solutions, Quality & Reliability, Wafer Package Testing & Characterization.
Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811613761
Total Pages : 513 pages
Book Rating : 4.8/5 (116 download)
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Download or read book Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th written by and published by . This book was released on 2014 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John H. Lau
Publisher : Springer Nature
ISBN 13 : 9811999171
Total Pages : 542 pages
Book Rating : 4.8/5 (119 download)
Download or read book Chiplet Design and Heterogeneous Integration Packaging written by John H. Lau and published by Springer Nature. This book was released on 2023-03-27 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Author : Norbert Streitz
Publisher : Springer Nature
ISBN 13 : 3030503445
Total Pages : 709 pages
Book Rating : 4.0/5 (35 download)
Download or read book Distributed, Ambient and Pervasive Interactions written by Norbert Streitz and published by Springer Nature. This book was released on 2020-07-10 with total page 709 pages. Available in PDF, EPUB and Kindle. Book excerpt: This conference proceeding LNCS 12203 constitutes the refereed proceedings of the 12th International Conference on Cross-Cultural Design, CCD 2020, held as part of HCI International 2020 in Copenhagen, Denmark in July 2020. The conference was held virtually due to the corona pandemic. The total of 1439 papers and 238 posters included in the 40 HCII 2020 proceedings volumes was carefully reviewed and selected from 6326 submissions. The regular papers of DAPI 2020, Distributed, Ambient and Pervasive Interactions, presented in this volume were organized in topical sections named: Design Approaches, Methods and Tools, Smart Cities and Landscapes, Well-being, Learning and Culture in Intelligent Environments and much more.
Author : Thiam Beng Lim
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
ISBN 13 :
Total Pages : 492 pages
Book Rating : 4.3/5 (91 download)
Download or read book Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) written by Thiam Beng Lim and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 2000 with total page 492 pages. Available in PDF, EPUB and Kindle. Book excerpt: Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.
Author :
Publisher :
ISBN 13 : 9781479928347
Total Pages : pages
Book Rating : 4.9/5 (283 download)
Download or read book 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Marcin Słoma
Publisher : Walter de Gruyter GmbH & Co KG
ISBN 13 : 3110793601
Total Pages : 154 pages
Book Rating : 4.1/5 (17 download)
Download or read book Additive Manufacturing of Structural Electronics written by Marcin Słoma and published by Walter de Gruyter GmbH & Co KG. This book was released on 2024-05-06 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt: Additive manufacturing, also called rapid prototyping or 3D printing is a disruptive manufacturing technique with a significant impact in electronics. With 3D printing, bulk objects with circuitry are embedded in the volume of an element or conformally coated on the surface of existing parts, allowing design and manufacturing of smaller and lighter products with fast customisation. The book covers both materials selection and techniques. The scope also covers the research areas of additive manufacturing of passive and active components, sensors, energy storage, bioelectronics and more.
Author : Charis M. Galanakis
Publisher : Springer Nature
ISBN 13 : 303071571X
Total Pages : 429 pages
Book Rating : 4.0/5 (37 download)
Download or read book Environment and Climate-smart Food Production written by Charis M. Galanakis and published by Springer Nature. This book was released on 2021-11-09 with total page 429 pages. Available in PDF, EPUB and Kindle. Book excerpt: Agriculture and food systems, forestry, the marine and the bio-based sectors are at the very heart of the climate change crisis. Evidence on climate change reveals that it will affect farming first, through changes to rainfall regimes, rising temperatures, the variability and seasonality of the climate and the occurrence of more frequent extreme events (heatwaves, droughts, storms and floods). In addition to findings ways to mitigate greenhouse gas emissions, farmers will need to develop farming systems resilient to fluctuating environmental and socioeconomic conditions. It is thus a great challenge to support ambitious climate targets while satisfying the needs for food, feed, bio-based products and energy for a global population projected to reach 10 billion by 2030. Few books on the market integrate environment studies and climate-smart food production. This book fills the knowledge gap by covering all the relevant aspects in one reference: starting with microclimate management, climate change and food systems, and resilience of mixed farming and agroforestry systems, chapters address agricultural soil management, integrated water management in small agricultural catchments, citizen-driven food system approaches in cities, and ICT-enabled agri-food systems. By focusing on the most recent advances in the field while analyzing the potential of already applied practices, this book can serve as a handbook for regulators and researchers looking to understand all aspects of food production and distribution in this changing environment.
