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Author :
Publisher : IEEE Computer Society
ISBN 13 : 9780818635427
Total Pages : 203 pages
Book Rating : 4.6/5 (354 download)
Download or read book 1993 IEEE Multi-Chip Module Conference, MCMC-93 written by and published by IEEE Computer Society. This book was released on 1993 with total page 203 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Yervant Zorian
Publisher : Springer Science & Business Media
ISBN 13 : 1461561078
Total Pages : 161 pages
Book Rating : 4.4/5 (615 download)
Download or read book Multi-Chip Module Test Strategies written by Yervant Zorian and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Author : IEEE
Publisher :
ISBN 13 :
Total Pages : 210 pages
Book Rating : 4.3/5 (91 download)
Download or read book Multi-Chip Module Conference written by IEEE and published by . This book was released on 1992 with total page 210 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Ray T. Chen
Publisher : SPIE-International Society for Optical Engineering
ISBN 13 :
Total Pages : 476 pages
Book Rating : 4.F/5 ( download)
Download or read book Optoelectronic Interconnects and Packaging written by Ray T. Chen and published by SPIE-International Society for Optical Engineering. This book was released on 1996 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt: Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Author : Jun Zhang
Publisher : Trans Tech Publications Ltd
ISBN 13 : 3038262269
Total Pages : 854 pages
Book Rating : 4.0/5 (382 download)
Download or read book Engineering Decisions for Manufacturing Systems written by Jun Zhang and published by Trans Tech Publications Ltd. This book was released on 2013-09-03 with total page 854 pages. Available in PDF, EPUB and Kindle. Book excerpt: Collection of selected, peer reviewed papers from the 2013 2nd International Symposium on Manufacturing Systems Engineering (ISMSE2013), July 27-29, 2013, Singapore. The 140 paper are grouped as follows: Chapter 1: Applied Materials Engineering and Materials Processing; Chapter 2: Design and Engineering Researches in Mechanical Engineering; Chapter 3: Environmental Engineering and Energy Sources Engineering; Chapter 4: Opto- and Microelectronics; Chapter 5: Measurements, Detection, Signal and Data Processing; Chapter 6: Mechatronics, Control and Automation of Manufacture; Chapter 7: Information Technology in Manufacturing Systems; Chapter 8: Organization of Manufacture and Engineering Management.
Author :
Publisher :
ISBN 13 : 9780818627279
Total Pages : 181 pages
Book Rating : 4.6/5 (272 download)
Download or read book Proceedings, 1992 IEEE Multi-Chip Module Conference, MCMC-92 written by and published by . This book was released on 1992 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jiao Fan
Publisher :
ISBN 13 :
Total Pages : 404 pages
Book Rating : 4.:/5 (318 download)
Download or read book Computer Aided Design of Optoelectronic Multi-chip Modules written by Jiao Fan and published by . This book was released on 1994 with total page 404 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : John H. Lau
Publisher : McGraw-Hill Professional Publishing
ISBN 13 :
Total Pages : 600 pages
Book Rating : 4.3/5 (91 download)
Download or read book Flip Chip Technologies written by John H. Lau and published by McGraw-Hill Professional Publishing. This book was released on 1996 with total page 600 pages. Available in PDF, EPUB and Kindle. Book excerpt: A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR
Author : British Library. Document Supply Centre
Publisher :
ISBN 13 :
Total Pages : 938 pages
Book Rating : 4.3/5 (91 download)
Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 1997 with total page 938 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Jimmy Shinn-Hwa Wang
Publisher :
ISBN 13 :
Total Pages : 26 pages
Book Rating : 4.:/5 (321 download)
Download or read book Optimal Design in Self-damped Lossy Transmission Lines for Multichip Modules written by Jimmy Shinn-Hwa Wang and published by . This book was released on 1993 with total page 26 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : R.R. Tummala
Publisher : Springer Science & Business Media
ISBN 13 : 1461560373
Total Pages : 1060 pages
Book Rating : 4.4/5 (615 download)
Download or read book Microelectronics Packaging Handbook written by R.R. Tummala and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 1060 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author :
Publisher :
ISBN 13 :
Total Pages : 676 pages
Book Rating : 4.:/5 (318 download)
Download or read book Multichip Modules written by and published by . This book was released on 1994 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author : Mihaela Ana Balseanu
Publisher :
ISBN 13 :
Total Pages : 408 pages
Book Rating : 4.E/5 ( download)
Download or read book Silicon-on-silicon System Packaging written by Mihaela Ana Balseanu and published by . This book was released on 2003 with total page 408 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 934 pages
Book Rating : 4.E/5 ( download)
Download or read book Proceedings of the Technical Conference written by and published by . This book was released on 1994 with total page 934 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher : IEEE Computer Society
ISBN 13 : 9780818669705
Total Pages : 233 pages
Book Rating : 4.6/5 (697 download)
Download or read book Proceedings, 1995 IEEE Multi-Chip Module Conference, January 31-February 2, 1995, Santa Cruz, California written by and published by IEEE Computer Society. This book was released on 1994 with total page 233 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEEE Multi-Chip Module Conference (MCMC) brings together elements of packaging technology and design, circuits and system design, computer-aided design, modeling, analysis, and education. The proceedings of MCMC'95 comprise papers and posters on manufacturing issues, applications, field programm
Author : Jimmy Shinn-Hwa Wang
Publisher :
ISBN 13 :
Total Pages : 32 pages
Book Rating : 4.:/5 (321 download)
Download or read book A Novel Approach for the Transient Simulation of the Coupled Transmission Lines Characterized with the Frequency-dependent Losses Using Scattering-Parameter Based Macromodel written by Jimmy Shinn-Hwa Wang and published by . This book was released on 1994 with total page 32 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Author :
Publisher :
ISBN 13 :
Total Pages : 2266 pages
Book Rating : 4.F/5 ( download)
Download or read book The Cumulative Book Index written by and published by . This book was released on 1995 with total page 2266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
